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http://dx.doi.org/10.7317/pk.2014.38.4.510

Residual Stress Behavior and Physical Properties of Colorless and Transparent Polyimide Films  

Nam, Ki-Ho (Department of Chemical and Biomolecular Engineering, Yonsei University)
Lee, Wansoo (Department of Chemical and Biomolecular Engineering, Yonsei University)
Seo, Kwangwon (Department of Chemical and Biomolecular Engineering, Yonsei University)
Han, Haksoo (Department of Chemical and Biomolecular Engineering, Yonsei University)
Publication Information
Polymer(Korea) / v.38, no.4, 2014 , pp. 510-517 More about this Journal
Abstract
A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.
Keywords
polyimide; residual stress behavior; optical property; morphology;
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1 S. L. Ma, Y. S. Kim, J. H. Lee, J. S. Kim, I. Kim, and J. C. Won, Polymer(Korea), 29, 204 (2005).
2 G. J. Shin, J. H. Chi, W.-C. Zin, T. H. Chang, M. H. Ree, and J. C. Jung, Polymer(Korea), 30, 97 (2006).
3 I.-H. Tseng, Y.-F. Liao, J.-C. Chiang, and M.-H. Tsai, Mater. Chem. Phys., 136, 247 (2012).   DOI   ScienceOn
4 H. Wei, X. Fang, Y. Han, B. Hu, and Q. Yan, Eur. Polym. J., 46, 246 (2010).   DOI   ScienceOn
5 X. Fang, Z. W. Yang, L. Gao, Q. Li, and M. Ding, Polymer, 44, 2641 (2003).   DOI   ScienceOn
6 Y.-H. Yu, J.-M. Yeh, S.-J. Liou, C.-L. Chen, D. J. Liaw, and H. Y. Lu, J. Appl. Polym. Sci., 92, 3573 (2004).   DOI   ScienceOn
7 J.-S. Park and J.-H. Chang, Polymer(Korea), 32, 580 (2008).
8 H. S. Jin and J. H. Chang, J. Appl. Polym. Sci., 107, 109 (2008).   DOI   ScienceOn
9 W. Jang, J. Seo, C. Lee, S.-H. Paek, and H. Han, J. Appl. Polym. Sci., 113, 976 (2009).   DOI   ScienceOn
10 W. Jang, M. Seo, J. Seo, S. Park, and H. Han, Polym. Int., 57, 350 (2008).   DOI   ScienceOn
11 N. L. Le and T.-S. Chung, J. Membrane Sci., 454, 62 (2014).   DOI   ScienceOn
12 J.-S. Park and J.-H. Chang, Polymer(Korea), 33, 313 (2009).
13 H. L. Tyan, C. M. Leu, and K. H. Wei, Chem. Mater., 12, 222 (2001).
14 M. Hasegawa and K. Horie, Prog. Polym. Sci., 26, 259 (2001).   DOI   ScienceOn
15 B. Y. Myung, C. J. Ahn, and T. H. Yoon, Polymer, 42, 7993 (2001).   DOI   ScienceOn
16 L. Cheng and X. G. Jian, J. Appl. Polym. Sci., 92, 1516 (2004).   DOI   ScienceOn
17 D.-J. Liaw, B.-Y. Liaw, P.-N. Hsu, and C.-Y. Hwang, Chem. Mater., 13, 1811 (2011).
18 D.-J. Liaw, C.-Y. Hsu, and B.-Y. Liaw, Polymer, 42, 7993 (2001).   DOI   ScienceOn
19 U. Min and J.-H. Chang, Polymer(Korea), 34, 495 (2010).
20 J.-G. Liu, X.-J. Zhao, H.-S. Li. Fan, and S.-Y. Yang, High Perform. Polym., 18, 851 (2006).   DOI   ScienceOn
21 M. Koo, J.-S. Bae, S. E. Shim, D. Kim, D.-G. Nam, J.-W. Lee, G.- W. Lee, J. H. Yeum, and W. Oh, Colloid Polym. Sci., 289, 1503 (2011).   DOI
22 F. Moghadam and K. Moghadam, Solid State Technol., 27, 149 (1984).
23 M. Ree, S. Swanson, and W. Volksen, Polymer, 34, 1423 (1993).   DOI   ScienceOn
24 H. Chung, C. Lee, and H. Han, Polymer, 42, 319 (2001).   DOI   ScienceOn
25 H. Chung, J. Lee, J. Hwang, and H. Han, Polymer, 42, 7893 (2001).   DOI   ScienceOn
26 D. H. Lee, S. H. Shim, J. S. Choi, and K.-B. Yoon, Appl. Surf. Sci., 254, 4650 (2008).   DOI   ScienceOn
27 M. Chung, J. Lee, J. Hwang, and H. Han, Polymer, 42, 7893 (2001).   DOI   ScienceOn
28 G. Maier, Prog. Polym. Sci., 26, 3 (2001).   DOI   ScienceOn
29 C.-P. Yang, Y.-Y. Su, and Y.-C. Chen, J. Appl. Polym. Sci., 102, 4101 (2006).   DOI   ScienceOn