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http://dx.doi.org/10.7317/pk.2014.38.6.752

Residual Stress Behavior and Characterization of Polyimide Crosslinked Networks via Ring-opening Metathesis Polymerization  

Nam, Ki-Ho (Department of Chemical and Biomolecular Engineering, Yonsei University)
Seo, Jongchul (Department of Packaging, Yonsei University)
Jang, Wonbong (Department of R&D, LG Display)
Han, Haksoo (Department of Chemical and Biomolecular Engineering, Yonsei University)
Publication Information
Polymer(Korea) / v.38, no.6, 2014 , pp. 752-759 More about this Journal
Abstract
Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.
Keywords
polyimide; ring-opening metathesis polymerization; crosslinked network; residual stress behavior; morphology;
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