• 한국국방경영분석학회지
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• 제17권2호
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• pp.100-112
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• 1991

Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 국제학술발표논문집
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• The 3th International Conference on Construction Engineering and Project Management
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• pp.635-641
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• 2009

In the building construction, the specialist contractors play the important roles in the point of the quality securing. Therefore, it is very important for the construction industry to study the sub-package problem. The sub-package problem includes two problems which should be solved. One is to decide the scope of works of each specialist contractor, and another one is to decide the particular specialist contractor which carries out the work. However, the sub-package problem in Korea is not clarified yet, although the circumstance around it has changed rapidly. Many factors influence to the sub-package problem regardless of internal factors or external factors of the project. The general contractor usually decides the sub-package under considering the project conditions. In case of the internal factors, each general contractor manages the organization and materials. But the external factors are relatively more difficult to control and predict than internal ones. But out of the external factors, the legal system has very close relationship with a sub-package problem especially in Korean construction system. So, this paper clarifies relationship between the legal system relating subcontracting and the state of sub-package.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• International Journal of Advanced Culture Technology
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• 제9권4호
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• pp.409-416
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• 2021

We are invented the movement composition technique that is to check the food adjacent-package status of the wireless-management movement monitoring level (WMMML) on the movement monitoring communication system. The movement monitoring level condition by the movement monitoring communication system is formatted with the adjacent-package system. As to inspection a wireless RFID of the wireless RFID, we are found of the movement value with wireless RFID by the adjacent upper take form. The concept of movement monitoring level is formatted the reference of wireless-management level for composition signal by the movement package communication system. Further symbolizing a food composition of the WMMML of the medium-minimum in terms of the adjacent-package communication system, and the movement wireless RFID package that was the movement value of the far composition of the Mo-MMCS-FA-_φMED-MIN with 5.80±1.20 units, that was the movement value of the convenient composition of the Mo-MMCS-CO-_φMED-MIN with 4.06±(-0.04) units, that was the movement value of the flank composition of the Mo-MMCS-MO-_φMED-MIN with 0.91±0.07 units, that was the movement value of the vicinage composition of the Mo-MMCS-VI-_φMED-MIN with 0.18±(-0.03) units. The adjacent package will be to look into at the food ability of the adjacent-package communication system with wireless RFID by the movement monitoring level on the WMMML that is supply the wireless communication by the movement monitoring level system. We will be possible to make effort of a communication system by the management signal and to put to use of the delivery data of RFID level by the delivery system.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• 대한안전경영과학회지
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• 제10권2호
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• pp.95-103
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• 2008

The package loading process of the lumbering industry is an operation that after a pair of workers bind three or six lumbers into one unit and cut both ends of the lumbers, transports the weight cargo of 30-50kg by one meter, pack and load at a height of 1.2 meters. This package loading process causes lots of noise and wood dust when workers carry out the heavy work as the above. Therefore we developed the monolithic both ends cutting package loading equipment in order to prevent from getting musculoskeletal disease. An loading bar working system of this equipment is improved from pneumatic pressure system to oil pressure system, furnished the newly designed flow dividers, and developed the new system that a both end array is loaded identically. Also we developed the safety equipment of loading bar in order to prevent workers mistake and overload from malfunction during the package loading process. The main cause of job evasion on working place could be solved by preventing the musculoskeletal disease and improving the working environments.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2008년도 춘계학술대회
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• pp.135-147
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• 2008

The package loading process of the lumbering industry is an operation that after a pair of workers bind three or six lumbers into one unit and cut both ends of the lumbers, transports the weight cargo of 30-50kg by one meter, pack and load at a height of 1.2 meters. This package loading process causes lots of noise and wood dust when workers carry out the heavy work as the above. Therefore we developed the monolithic both ends cutting package loading equipment in order to prevent from getting musculoskeletal disease. An loading bar working system of this equipment is improved from pneumatic pressure system to oil pressure system, furnished the newly designed flow dividers, and developed the new system that a both end array is loaded identically. Also we developed the safety equipment of loading bar in order to prevent workers mistake and overload from malfunction during the package loading process. The main cause of job evasion on working place could be solved by preventing the musculoskeletal disease and improving the working environments.