System-on-Package (SOP) Vision, Status and Challenges

  • Tummala, Rao R. (NSF Packaging Research Center, Georgia Institute of Technology)
  • 발행 : 2000.04.01

초록

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

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