• 제목/요약/키워드: System on a Chip

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Galileo BOC(1,1)에서 이른 상관시간 옵셋 영역의 상관 값을 이용한 추적기법 (A Tracking Scheme using Correlation Value at Advanced Offset Range in Galileo BOC(1,1) Signal)

  • 유승수;김상훈;윤석호;송익호;김준태;김선용
    • 한국통신학회논문지
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    • 제33권1C호
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    • pp.86-93
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    • 2008
  • Galileo 시스템은 통신 물리계층으로 직접수열/대역확산(direct sequence/spread spectrum, DS/SS) 시스템을 사용한다. DS/SS 시스템은 수신신호로부터 정보를 복원하기 위해 수신신호의 확산신호와 수신기에서 발생한 확산신호의 동기를 정확하게 결정하고, 유지해야 한다. 이를 위해 DS/SS 시스템은 획득과 추적 단계를 수행해 동기를 맞춘다. 이상적인 환경에서 최적 부호추적기는 EL-DLL이다(delay lock loop with early minus late discriminator). EL-DLL은 정확한 동기시점을 기준으로 확산신호의 상관함수가 정확히 대칭인 특징을 이용해 추적을 수행한다. 그러나 다중경로 신호가 수신되었을 때 상관함수의 대칭성이 왜곡되며, 이로 인해 추적이 완료되어 동기시점을 결정한 후에도 일정한 동기오차가 존재한다. 이처럼 추적기가 동기시점을 결정한 후에도 잔존하는 동기오차를 추적편이라 한다. 이상적인 환경에서 Galileo BOC(1,1) 신호로 변조된 확산신호는 정확한 동기시점에서 최고 값이 나타나며, 이 시점을 기준으로 반 칩(chip) 이른 상관시간 옵셋과 늦은 상관시간 옵셋에서 극소 값을 갖는다. 이때 다중경로신호는 항상 가시신호에 비해 늦게 수신되기 때문에 정확한 동기시점을 기준으로 반 칩 이른 상관 시간 옵셋 주변의 상관 값은 다중경로신호에 의해 크게 왜곡되지 않는 특징을 갖는다. 본 논문은 이 특징을 바탕으로 Galileo BOC(1,1)에 알맞은 추적편이 완화기법을 제안하고, 기존 기법과 제안한 기법의 추적편이 특성을 분석한다.

진공 프린팅 성형 인쇄법(VPES)을 이용한 R.G.B.Y(Red, Green, Blue, Yellow) LED 광원 연구 (A Study on RGBY LED Light using a Vacuum Printing Encapsulation Systems Method)

  • 장민석;김영우;신기해;박정욱;홍진표;송상빈;김재필
    • 조명전기설비학회논문지
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    • 제25권2호
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    • pp.10-18
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    • 2011
  • In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

사출 성형된 일회용 카오스 마이크로 믹서의 개발: 나선형 라미네이션 마이크로 믹서 (I) - 디자인 및 수치 해석 - (Development of an Injection Molded Disposable Chaotic Micromixer: Serpentine Laminating Micromixer (I) - Design and Numerical Analysis -)

  • 김동성;이세환;권태헌
    • 대한기계학회논문집A
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    • 제29권10호
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    • pp.1289-1297
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    • 2005
  • The flow in a microchannel is usually characterized as a low Reynolds number (Re) so that good mixing is quite difficult to be achieved. In this regard, we developed a novel chaotic micromixer, named Serpentine Laminating Micromixer (SLM) in the present study, Part 1. In the SLM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms: splitting/recombination and chaotic advection. The splitting and recombination (in other term, lamination) mechanism is obtained by the successive arrangement of 'F'-shape mixing units in two layers. The chaotic advection is induced by the overall three-dimensional serpentine path of the microchannel. Chaotic mixing performance of the SLM was fully characterized numerically. To compare the mixing performance, a T-type micromixer which has the same width, height and length of the SLM was also designed. The three-dimensional numerical mixing simulations show the superiority of the SLM over the T-type micromixer. From the cross-sectional simulation results of mixing patterns, the chaotic advection effect from the serpentine channel path design acts favorably to realize the ideal lamination of fluid flow as Re increases. Chaotic mixing mechanism, proposed in this study, could be easily integrated in Micro-Total-Analysis-System, Lab-on-a-Chip and so on.

FPGA integrated IEEE 802.15.4 ZigBee wireless sensor nodes performance for industrial plant monitoring and automation

  • Ompal, Ompal;Mishra, Vishnu Mohan;Kumar, Adesh
    • Nuclear Engineering and Technology
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    • 제54권7호
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    • pp.2444-2452
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    • 2022
  • The field-programmable gate array (FPGA) is gaining popularity in industrial automation such as nuclear power plant instrumentation and control (I&C) systems due to the benefits of having non-existence of operating system, minimum software errors, and minimum common reason failures. Separate functions can be processed individually and in parallel on the same integrated circuit using FPGAs in comparison to the conventional microprocessor-based systems used in any plant operations. The use of FPGAs offers the potential to minimize complexity and the accompanying difficulty of securing regulatory approval, as well as provide superior protection against obsolescence. Wireless sensor networks (WSNs) are a new technology for acquiring and processing plant data wirelessly in which sensor nodes are configured for real-time signal processing, data acquisition, and monitoring. ZigBee (IEEE 802.15.4) is an open worldwide standard for minimum power, low-cost machine-to-machine (M2M), and internet of things (IoT) enabled wireless network communication. It is always a challenge to follow the specific topology when different Zigbee nodes are placed in a large network such as a plant. The research article focuses on the hardware chip design of different topological structures supported by ZigBee that can be used for monitoring and controlling the different operations of the plant and evaluates the performance in Vitex-5 FPGA hardware. The research work presents a strategy for configuring FPGA with ZigBee sensor nodes when communicating in a large area such as an industrial plant for real-time monitoring.

금속 범프와 마이크로 채널 액체 냉각 구조를 이용한 소자의 열 관리 연구 (IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps)

  • 원용현;김성동;김사라은경
    • 마이크로전자및패키징학회지
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    • 제23권2호
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    • pp.73-78
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    • 2016
  • 집적회로(Integrated Circuit) 소자의 트랜지스터(transistor) 밀도 증가는 소자에서 발생하는 열 방출(heat dissipation)의 급격한 상승을 초래하여 열 문제를 발생시키고, 이는 소자의 성능과 열적 신뢰성에 영향을 크게 미친다. 열문제의 해결방안 중 본 연구에서는 냉매를 이용한 액체 냉각방법을 연구하였으며, 실리콘 웨이퍼에 관통실리콘비아(through Si via)와 마이크로 채널(microchannel)을 딥 반응성 이온 애칭(deep reactive ion etching)로 구현한 후 유리기판과 어노딕본딩을 통하여 액체 냉각 구조를 제작하였다. 제작된 마이크로 채널 위에 Ag, Cu 또는 Cr/Au/Cu bump를 스크린프린팅(screen printing) 방법으로 형성하였고, 범프의 유무를 통해 액체 냉각 전후의 냉각 모듈의 실리콘 표면온도의 변화를 적외선현미경으로 분석하였다. Cr/Au/Cu bump가 탑재된 액체 냉각 모듈의 경우 가열온도 $200^{\circ}C$에서 냉각 전후의 실리콘 표면 온도 차이는 약 $45.2^{\circ}C$이고, 전력밀도 감소는 약 $2.8W/cm^2$ 이었다.

표면 플라즈몬 현미경을 이용한 자기조립 단분자막의 이미징 (Imaging of self-assembled monolayers by surface plasmon microscope)

  • 표현봉;신용범;윤현철;양해식;김윤태
    • 한국광학회지
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    • 제14권1호
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    • pp.97-102
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    • 2003
  • 이차원 표면 플라즈몬의 공명 흡수와 포토 마스크를 이용하여 11-MUA(11-Mercaptoundecanoic acid)와 11-MUOH(11-Mercaptoundecanol) 둥으로 이루어진 자기조립 단분자막(Self-Assembled Monolayer; SAM)의 다채널 영상을 얻었다. 통상의 Photoresist를 이용한 리토그래피 대신에 Thiol bonding의 광산화를 이용하여 패터닝 과정을 줄이고, 백색광 및 대역통과 필터(λ$_{0}$=633nm)를 이용하여 입사광으로써 레이저를 사용할 때 나타나는 간섭무늬를 줄였다. 이로부터 나타나는 이차원 영상의 명암을 정량적으로 보정하면 수 나노미터(nm) 두께의 변화를 측정할 수 있다. 또한 표면 플라즈몬 공명법은 국소화된 근접장 (소산장)을 이용하는 방법으로서, 통상 많이 이용되는 형광법 등에서 나타나는 광탈색(Photobleaching)이나 소광(Quenching) 현상이 없이 시료의 처리가 간단하고, 영상 신호의 시간에 따른 변화가 극히 적으며, 실시간으로 신호의 변화를 측정할 수 있다는 장점이 있다.

COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구 (A Study on Ni Electroless Plating Process for Solder Bump COG Technology)

  • 한정인
    • 한국재료학회지
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    • 제5권7호
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    • pp.794-801
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    • 1995
  • LCD 모듈을 위한 실장 기술인 Chip on Glass 공정 기술을 개발함에 있어 구동 IC와 기판d의 Al 전극을 연결하기 위하여 기존의 기술과의 연관성 및 공정의 연속성, 제조단가등을 고려하여 Pb-Sn 범프를 사용하고자 하였으며 이를 위해 Al 금속 박막위에 니켈 무전해 도금하는 방법을 연구 하였다. Al 전극에 무전해 니켈 도금하기 위해서는 광레지스트 차폐막을 손상하지 않는 전처리 방법이 필요하기 때문에 전처리 방법으로서 알칼리 아연산염 처리법과 불화물을 이용한 아연산염 처리법을 선택하여 실시하였다. 이 가운데 산성불화암모늄(NH$_4$HF)을 1.5 g/$\ell$ 함유하고 황산아연(ZnSO$_4$)을 100 g/$\ell$ 함유한 산성 아연산염 용액에서는 광레지스트 차폐막이 손상되지 않았으며 처리시간을 적절히 조절함으로써 알루미늄 박막상에 선택적으로 니켈 무전해 도금을 할 수 있었다. 아연산염 응액중의 첨가제와 무전해 도금액 중의 억제제인 Thiourea는 도금층의 평활도를 높이는 역할을 하였다. 또한 아연산염 처리를 하기 전에 산세 처리를 함으로써 도금층의 균일성을 향상시킬 수 있었다.

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BTA드릴가공의 절삭성능에 관한 연구 (A Study on Cutting Performance of the BTA Drilling)

  • 장성규;김순경;전언찬
    • 한국정밀공학회지
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    • 제15권10호
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    • pp.65-72
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    • 1998
  • The BTA drilling chip is better for deep hole drilling than other self-piloting with pad drilling chips because the large length to diameter ratio allows a unique cutting force dispersion and better supplies the high pressure fluid. Therefore the BTA is useful for many tasks, such as coolant hole drilling of large scale dies, as well as tube seat drilling, which is essential for the heat exchanger, and variable component drilling for automobiles. Deep hole drilling has several significant problems, such as hole deviation, hole over-size, circularity, straightness, and surface roughness. The reasons for these problems, which often result in quality short comings, are an alignment of the BTA drilling system and the unbalance of cutting force by work piece and tool shape. This paper analyzes the properties through an experiment which com¬pared single-edge BTA drills with multiple-edge BTA drills, as well as the shapes of the tools to cause an unbalance of cutting force, and its effect on the precision of the worked hole. Conclusions are as follows. 1) In SMSSC drilling, 60m/min of BTA with single and multi-edged tools proved the best cutting condition and the lowest wear character. 2) The roundness got a little worse as cutting speed was increased, but surface roughness was hot affected. 3) It was proved that the burnishing torque of both drills approached 26%. which is almost the same as the 24% insisted on by Griffiths, and the dispersion characteristic of the multi-edged BTA drill proved better than the single-edge BTA drill.

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산화막 CMP에서 세리아 입자의 패드 표면누적과 재료제거 관계 (Correlation between Ceria abrasive accumulation on pad surface and Material Removal in Oxide CMP)

  • 김영진;박범영;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.118-118
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    • 2008
  • The oxide CMP has been applied to interlayer dielectric(ILD) and shallow trench isolation (STI) in chip fabrication. Recently the slurry used in oxide CMP being changed from silica slurry to ceria (cerium dioxide) slurry particularly in STI CMP, because the material selectivity of ceria slurry is better than material selectivity of silica slurry. Moreover, the ceria slurry has good a planarization efficiency, compared with silica slurry. However ceria abrasives make a material removal rate too high at the region of wafer center. Then we focuses on why profile of material removal rate is convex. The material removal rate sharply increased to 3216 $\AA$/min by $4^{th}$ run without conditioning. After $4^{th}$ run, material removal rate converged. Furthermore, profile became more convex during 12 run. And average material removal rate decreased when conditioning process is added to end of CMP process. This is due to polishing mechanism of ceria. Then the ceria abrasive remains at the pad, in particular remains more at wafer center contacted region of pad. The field emission scanning electron microscopy (FE-SEM) images showed that the pad sample in the wafer center region has a more ceria abrasive than in wafer outer region. The energy dispersive X-ray spectrometer (EDX) verified the result that ceria abrasive is deposited and more at the region of wafer center. Therefore, this result may be expected as ceria abrasives on pad surface causing the convex profile of material removal rate.

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Digital subtraction radiography를 이용한 치조골 변화의 정략적 분석 (QUANTITATIVE ANALYSIS OF THE ALVEOLAR BONE CHANGE BY THE DIGITAL SUBTRACTION RADIOGRAPHY)

  • 류명걸;정현주
    • Journal of Periodontal and Implant Science
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    • 제25권1호
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    • pp.67-75
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    • 1995
  • The progress of periodontal disease and the wound healing process after treatment result in alveolar bone bone change. So, detection of it is very important in the diagnosis and the radiograph of periodontal disease. Various effects have been made to assess the subtle alveolar bone change and digital subtraction radiography (DSR) has been reported to be the best method in evaluating it qualitatively and quantitatively. The present study was performed to estimate the detectable alveolar bone change qualitatively with digital subtraction radiography. For the in vitro study, 10 intraoral standard radiographs were taken from porcine dry mandible which a rectangular cortical bone chip of 0.1mm to 1.0mm thickness with 0.1mm increment was attached on the buccal surface. The radiographs without and with bone plates were reviewed at the same time by 10 observers and requested to detect the presence of cortical bone plates. Digital Subtraction radiograph was reviewed subsequently by using the DSR system(digital converter-256 grey-levels,DT 2851,Data Translation Co., U.S.A;IBM 386 ; CCD camera, FOTOVIX, Tamrom Co., Japan). The detectable thickness of cortical bone plate was O.4mm on the intraoral radiograph and 0.2mm on the subtaction images. For the human study, radiographs were taken from patients by using intraoral film holding device and aluminum reference wedge before and 3 month after bone graft and 1 week after osteoplasty. The grey level change was estimated in the subtraction images and calculated to aluminum equivalent thickness. The grey level of the grafted site was higher that that of healthy controls. Average grey levels of change on healthy controls were O.48mm aluminum equivalent. However, the amount of changes in grafted sites were 1.87mm aluminum thickness equivalent and in the site of osteoplasty were -1.49mm aluminum thickness equivalent. In conclusion, digital subtraction radiography was more effective in detecting as subtle change of alveolar bone than intraoral standard radiography. With the aid of quantitative analysis of digital subtraction radiography, alveolar bone resorption of apposition can be estimated during diagnosis and treatment of periodontally diseased patients.

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