• Title/Summary/Keyword: System LSI

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SOC Bus Transaction Verification Using AMBA Protocol Checker

  • Lee, Kab-Joo;Kim, Si-Hyun;Hwang, Hyo-Seon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.2
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    • pp.132-140
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    • 2002
  • This paper presents an ARM-based SOC bus transaction verification IP and the usage experiences in SOC designs. The verification IP is an AMBA AHB protocol checker, which captures legal AHB transactions in FSM-style signal sequence checking routines. This checker can be considered as a reusable verification IP since it does not change unless the bus protocol changes. Our AHB protocol checker is designed to be scalable to any number of AHB masters and reusable for various AMBA-based SOC designs. The keys to the scalability and the reusability are Object-Oriented Programming (OOP), virtual port, and bind operation. This paper describes how OOP, virtual port, and bind features are used to implement AHB protocol checker. Using the AHB protocol checker, an AHB simulation monitor is constructed. The monitor checks the legal bus arbitration and detects the first cycle of an AHB transaction. Then it calls AHB protocol checker to check the expected AHB signal sequences. We integrate the AHB bus monitor into Verilog simulation environment to replace time-consuming visual waveform inspection, and it allows us to find design bugs quickly. This paper also discusses AMBA AHB bus transaction coverage metrics and AHB transaction coverage analysis. Test programs for five AHB masters of an SOC, four channel DMAs and a host interface unit are executed and transaction coverage for DMA verification is collected during simulation. These coverage results can be used to determine the weak point of test programs in terms of the number of bus transactions occurred and guide to improve the quality of the test programs. Also, the coverage results can be used to obtain bus utilization statistics since the bus cycles occupied by each AHB master can be obtained.

Optical Performance Evaluation of SIL Assembly with Lateral Shearing Interferometer (층 밀리 간섭계를 이용한 고체침지렌즈의 광학적 성능 평가)

  • Lee, Jin-Eui;Kim, Wan-Chin;Choi, Hyun;Kim, Tae-Seob;Yoon, Yong-Joong;Park, No-Cheol;Park, Young-Pil
    • Transactions of the Society of Information Storage Systems
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    • v.2 no.4
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    • pp.224-229
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    • 2006
  • There has been studied flow to minimize the spot size to increase data capacity. Optical data storage devices are being developed near practical limits with wavelength and NA of 405nm and 0.85. There has been studied many types of next generation storage devices such as blu-ray multilayer system, probe based data storage and holographic data storage. Among these data storage devices, solid immersion lens(SIL) based near field recording (NFR) has been widely studied. In this system, SIL is the key component that focuses the laser beam with a very small size which enables ultra high data capacity. Therefore, optical performance evaluation system is required for SIL assembly. In this dissertation, a simple and accurate SIL assembly measurement method is proposed with wedge plate lateral shearing interferometer(LSI). Wedge plate LSI is cheaper than commercialized interferometer, robust to the vibration and the moving distance for phase shifting is large that is order of micrometer. We designed the thickness, wedge angle, material, surface quality and wavelength of wedge plate as 1mm, 0.02degree, fused silica, lamda/10(10-5) and 405nm, respectively. Also, we confirmed simulation and experimental results with quantitative analysis. This simple wedge plate LSI can be applied to different types of SIL such as solid immersion mirror(SIM), hemispherical, super-hemispherical and elliptical SIL.

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Linear and Circular Interpolation for 2-Dimensional Contouring Control (2次元 輪곽制御 를 위한 直線 및 圓통補間)

  • 이봉진
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.6 no.4
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    • pp.341-345
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    • 1982
  • The interpolator is usually built in hardware (logic circuitry), and the interpolator fabricated in a single LSI chip is recently made use of in most NC controllers, making the system more compact. However, the LSI interpolator not only has the technical difficulties but also requires high cost, in its fabrication. To solve these problems, we tried to find the method of interpolation by software, and succeeded in developing a program which, executed by INTEL's 8085 microprocessor, can distribute the input pulses of up to 4.0 [Kpps] for the linear interpolation and 3.0 [Kpps] for the circular interpolation. This paper presents the algorithm used to reduce the execution time and the flow chart of the interpolation program, and also shows the possibility of software interpolation. The interpolation program designed in assembly language is presented in the appendix.

Two-axis latera I-shearing interferometer for performance test of lenses using a Dove prism (도브 프리즘을 이용한 렌즈 성능평가용 2축 층밀리기 간섭계)

  • 김승우;이혁교;김병창
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.384-387
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    • 1995
  • Two axes lateral-shearing interferometer(LSI) specially devised for production line inspection lenses is presented. The interferometer composed with four prisms and a dove prism can test the lens performance including asymmetric aspheric lens. The dove prism which rotates the input image with respect to optical axis makes it possible. The wavefront passing through the test lens is reconstsucted by the phase derivative obtained form the two axes LSI system. Zernike-polynomials fitting of this wavefront is presented for determinating quantitative aberration of aspherical lenses.

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A Study on the UV Intensity Models and their Affecting Factors (자외선 강도 산정 모델과 영향 인자에 관한 연구)

  • Kim, Dooil;Choi, Younggyun;Kim, Sunghong
    • Journal of Korean Society of Water and Wastewater
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    • v.22 no.4
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    • pp.421-427
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    • 2008
  • UV disinfection is widely used in water treatment facilities and wastewater treatment plant because of its effectiveness to removal of pathogen and Giardia which is resistant to traditional chemical disinfection. As a design and performance tool of UV disinfection system, 3 dimensional UV intensity models were composed and simulated to compare each other and to find affecting factors in this study. Reflection, refraction and absorption are important parameters in UV intensity model and MPSS and MSSS model can reflect these parameters while LSI model can not. Absorption is the most important parameters among the reflection, refraction, absorption and shadowing so, this should not be neglect. Based on this simulation, shadowing effect is negligible when the number of installed lamp is a few but, this effect can not be neglectable when the number of installed lamp is quite a few. The errors according to shadowing effect is increased as the number of lamp installed increased.

Methods and Sample Size Effect Evaluation for Wafer Level Statistical Bin Limits Determination with Poisson Distributions (포아송 분포를 가정한 Wafer 수준 Statistical Bin Limits 결정방법과 표본크기 효과에 대한 평가)

  • Park, Sung-Min;Kim, Young-Sig
    • IE interfaces
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    • v.17 no.1
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    • pp.1-12
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    • 2004
  • In a modern semiconductor device manufacturing industry, statistical bin limits on wafer level test bin data are used for minimizing value added to defective product as well as protecting end customers from potential quality and reliability excursion. Most wafer level test bin data show skewed distributions. By Monte Carlo simulation, this paper evaluates methods and sample size effect regarding determination of statistical bin limits. In the simulation, it is assumed that wafer level test bin data follow the Poisson distribution. Hence, typical shapes of the data distribution can be specified in terms of the distribution's parameter. This study examines three different methods; 1) percentile based methodology; 2) data transformation; and 3) Poisson model fitting. The mean square error is adopted as a performance measure for each simulation scenario. Then, a case study is presented. Results show that the percentile and transformation based methods give more stable statistical bin limits associated with the real dataset. However, with highly skewed distributions, the transformation based method should be used with caution in determining statistical bin limits. When the data are well fitted to a certain probability distribution, the model fitting approach can be used in the determination. As for the sample size effect, the mean square error seems to reduce exponentially according to the sample size.

A Simplified Digital Frequency/Phase/Voltage Controller for the Traveling Wave Type Ultrasonic Motor Drive System (초음파 모터 구동을 위한 단순화된 디지털 주파수/위상차/전압 제어기)

  • 이을재;김영석
    • The Transactions of the Korean Institute of Power Electronics
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    • v.4 no.3
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    • pp.285-293
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    • 1999
  • In this paper, the novel digital frequency/phase controller, to control the invelter fed traveling wave type ultra-sonic m motor(USM) is proposed. This controller is used to control the drive frequency, phase difference and applied voltages of e each phase of the motor. Proposed digital controller has constructed with digital logic only, no more use digitallongleftarrowanalog h hybrid method of the conventional controller, in order to generate drive frequency and phase difference. Therefore, the c control system has become to velY simple structure. T\rvo types of controllers are designed, one is to control drive f frequency and phase difference, another has added voltage control function of each phase. Two full digital voltage/phase c controllers are implemented by using custom LSI and EPLD, the control pelformance and the simplicity ofthe proposed c controller is verified by expeJimental results.

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Technologies for 3D Assembly and Chip-level Stack

  • Bonkohara, Manabu
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.65-89
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    • 2003
  • Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

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