• 반도체디스플레이기술학회지
• /
• 제1권1호
• /
• pp.15-19
• /
• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.74-78
• /
• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• 마이크로전자및패키징학회지
• /
• 제9권4호
• /
• pp.25-29
• /
• 2002

기존 홀 센서의 단점을 개선하기 위해서 트랜치를 이용한 수직 홀 센서를 제작하였다. 수직 홀 센서는 센서의 칩 표면에 수평 자계를 검출할 수 있으며, 홀 센서는 실리콘 직접 본딩 기술에 의해 제작된 SOI 기판 위에 제작하였다. 기판 아래의 $SiO_2$층과 마이크로머시닝에 의한 트랜치가 홀 센서의 동작 영역을 정의한다. 홀 센서의 감도는 150V/AT로 측정되었으며 안정된 값을 나타내었다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
• /
• pp.481-485
• /
• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권9호
• /
• pp.495-501
• /
• 2000

This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제51권6호
• /
• pp.271-277
• /
• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권6호
• /
• pp.354-359
• /
• 2000

A new method of measuring residual stress in micromachined film is proposed. An estimation of residual stress is performed by using least squares fit with an appropriate deflection modeling. an exact value of residual stress is obtained without any of the ambiguities that exist in conventional buckling method, and a good approximation is also obtained by using a few data points. Therefore, the test structures area could be greatly decreased by using this method. The measurement can be done more easily and simply without any actuation or any specific measuring equipment. The structure and fabrication processes described in this paper are simple and widely used in surface micromachining. In addition, in-situ measurement is available by using the proposed method when the test structure and the measurement structure are fabricated on a wafer simultaneously.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 G
• /
• pp.3286-3288
• /
• 1999

The electrostatically actuated test structure was presented to measure the micro mechanical characteristics of micromaterials as thin films forming the microactuators. The test structure was fabricated by the surface micromachining processes and driven by the electrostatic force, In order to measure the fracture toughness, the sharp notch in the test structure was introduced by the etching process. On the basis of the beam bending theory, the elastic modulus was measured by using the microcantilevr beam and the mechanical displacement, curvature and deflection curve under the electrostatic force was evaluated by using the electrostatic structure.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 G
• /
• pp.3301-3303
• /
• 1999

A new method of measuring residual stresses in micromachined films using beam or ring structures is proposed. Using the proposed method, more exact value of residual stress can be obtained without any ambiguities in conventional buckling method. Theoretical modeling with respect to this method is described, and experiment is performed. The structure and fabrication process in this paper are simple and widely used in surface micromachining. Therefore, it is possible to obtain a synchronous measurement. A synchronous and reason -able estimation of residual stresses in micromachined films enables us to obtain the prediction of more exact performance in micromachined devices.

• 센서학회지
• /
• 제19권4호
• /
• pp.320-327
• /
• 2010

In this paper, electrostatically actuated direct contact type RF MEMS switches have been designed and demonstrated. As driving structures of the switch, cantilever, bridge, and torsion spring beam structures are used and the actuation voltage characteristics of the switches have been compared and discussed. The designed RF switches are fabricated with the surface micromachining technology using the electroplated gold and nickel structures. The characteristics of the fabricated switches are measured and analyzed. The switch, which is fabricated using the 510 ${\mu}m$-length bridge structure with the thickness of 1.5 ${\mu}m$, is actuated with 15 V driving voltage. The insertion losses are less than 0.2 dB over the measured frequency ranges from 0 to 20 GHz and the isolations are more than 30 dB.