Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 1 Issue 1
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- Pages.15-19
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- 2002
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- 1738-2270(pISSN)
A Study on Wafer Level Vacuum Packaging using Epi poly for MEMS Applications
Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구
Abstract
A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5