• Title/Summary/Keyword: Surface-etched structure

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The electrical and optical properties of transparent ZnO:Al films using HCl wet chemical etching (HCL 습식 에칭에 의한 ZnO:Al 투명전도막의 전기적, 광학적 특성)

  • Yoo, Jin-Su;Lee, Jeong-Chul;Kang, Ki-Hwan;Kim, Seok-Ki;Yoon, Kyung-Hoon;Song, Jin-Soo;Park, I-Jun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05b
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    • pp.62-65
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    • 2002
  • Transparent conducting aluminum-doped Zinc oxide films (ZnO:Al) were prepared by rf magnetron sputtering on glass (Coming 1737) substrate as a variation of the deposition condition. After deposition, the smooth ZnO:Al films were etched in diluted HCl (0.5%) to examine the electrical and surface morphology properties as a variation of the time. The most important deposition condition of surface-textured ZnO films by chemical etching is the processing pressure and the substrate temperature. In low pressures (0.9mTorr) and high substrate temperatures $({\leq}300^{\circ}C)$, the surface morphology of films exhibits a more dense and compact film structure with effective light-trapping to apply the silicon thin film solar cells.

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The fabrication of textured ZnO:Al films using HCI wet chemical etching (후 식각법을 이용한 Textured ZnO:Al 투명전도막 제조)

  • Yoo, Jin-Su;Lee, Jeong-Chul;Kang, Ki-Hwan;Kim, Seok-Ki;Yoon, Kyung-Hoon;Song, Jin-Soo;Park, I-Jun
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1482-1484
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    • 2002
  • Transparent conductive oxides (TCO) are necessary as front electrode for most thin film solar cell. In our paper, transparent conducting aluminum-doped Zinc oxide films (ZnO:Al) were prepared by rf magnetron sputtering on glass (Corning 1737) substrate as a variation of the deposition condition. After deposition, the smooth ZnO:Al films were etched in diluted HCI (0.5%) to examine the electrical and surface morphology properties as a variation of the time. The most important deposition condition of surface-textured ZnO films by chemical etching is the processing pressure and the substrate temperature. In low pressures (0.9mTorr) and high substrate temperatures $({\leq}300^{\circ}C)$, the surface morphology of films exhibits a more dense and compact film structure with effective light-trapping to apply the silicon thin film solar cells.

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The Dry Etching Characteristics of TiO2 Thin Films in N2/CF4/Ar Plasma

  • Choi, Kyung-Rok;Woo, Jong-Chang;Joo, Young-Hee;Chun, Yoon-Soo;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.1
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    • pp.32-36
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    • 2014
  • In this study, the etching characteristics of titanium dioxide ($TiO_2$) thin films were investigated with the addition of $N_2$ to CF4/Ar plasma. The crystal structure of the $TiO_2$ was amorphous. A maximum etch rate of 111.7 nm/min and selectivity of 0.37 were obtained in an $N_2/CF_4/Ar$ (= 6:16:4 sccm) gas mixture. The RF power was maintained at 700 W, the DC-bias voltage was - 150 V, and the process pressure was 2 Pa. In addition, the etch rate was measured as functions of the etching parameters, such as the gas mixture, RF power, DC-bias voltage, and process pressure. We used X-ray photoelectron spectroscopy to investigate the chemical state on the surface of the etched $TiO_2$ thin films. To determine the re-deposition and reorganization of residues on the surface, atomic force microscopy was used to examine the surface morphology and roughness of $TiO_2$ thin films.

Fabrication of nanoporous gold thin films on glass substrates for amperometric detection of aniline

  • Lee, Keon-U;Kim, Sang Hoon;Shin, Hyung-Joon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.354.1-354.1
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    • 2016
  • Nanoporous gold (NPG) is a very promising material in various fields such as sensor, actuator, and catalysis because of its high surface to volume ratio and conducting nature. In this study, we fabricated a NPG based amperometric sensor on a glass substrate by means of co-sputtering of Au and Si. During the sputtering process, we found the optimum conditions for heat treatment to reduce the residual stress and to improve adhesion between NPG films and the glass substrate. Subsequently, Si was selectively etched from Au-Si alloy by KOH solution, which forms nanoporous structures. Scanning electron microscopy (SEM) and auger electron spectroscopy (AES) were used to estimate the structure of NPG films and their composition. By employing appropriate heat treatments, we could make very stable NPG films. We tested the performance of NPG sensor with aniline molecules, which shows high sensitivity for sensing low concentration of aniline.

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Maskless Nano-fabrication by using both Nanoscratch and HF Wet Etching Technique (나노스크래치와 HF 에칭기술을 병용한 Pyrex 7740의 마스크리스 나노 가공)

  • 윤성원;이정우;강충길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.628-631
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    • 2003
  • This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.

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A Study of Mechanochemical Hyperfine-Writing Technique Using Deformation Induced Etch Hillock Phenomena (변형유기 식각 힐록 현상을 이용한 기계화학적 극미세 Writing 기법에 대한 연구)

  • Kang Chung Gil;Youn Sung Won
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.7 s.172
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    • pp.71-78
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    • 2005
  • The purpose of this study is to suggest a hyperfine maskless writing technique by using the nanoindentation and HF wet etching technique. Indents were made on the surface of Pyrex7740 glass by the hyperfine indentation process with a Berkovich diamond indenter, and they were etched in $50\;wr\%$ HF solution. After etching process, convex structure was obtained due to the deformation-induced hillock phenomena. In this study, effects of indentation process parameters (etching time, normal load, loading .ate, hold-time at the maximum load) on the morphologies of the indented surfaces after isotopic etching were investigated from an angle of deformation energies. Finally, sample characters were written to show the possibility of the application.

플라스마 디스플레이 패널의 격벽 형성의 에칭 메커니즘

  • Jeong Yu-Jin;Jeon Jae-Sam;Seong U-Gyeong;Kim Hyeong-Sun
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.198-201
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    • 2006
  • To produce fine structure with uniform surface of barrier ribs in PDP, acid etching process has been used in manufacture process. It is necessary to understand the mechanism of etching, particularly on the interface of ceramic fillers and matrix glass. We investigated the effect of ceramic fillers (ZnO, $Al_{2}O_3$) on the microstructure of borate glass system to find an etching mechanism of barrier ribs. The harrier ribs was etched with a several steps, dissolving a small amount of residual glass, taking out alumina fillers, and removing a cluster type of ZnO fillers and glass matrix.

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Etching Mechanism of Barrier Ribs in Plasma Display Panel (플라즈마 디스플레이 패널의 격벽형성의 에칭 메커니즘)

  • Chong, Eu-Gene;Jeon, Jae-Sam;Sung, Woo-Kyung;Kim, Hyung-Sun
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.3 s.16
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    • pp.33-36
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    • 2006
  • To produce a fine structure with uniform surface of barrier ribs in PDP, acid etching process has been used in manufacture process. It is necessary to understand the mechanism of etching, particularly on the interface of ceramic fillers and matrix glass. We investigated the effect of ceramic fillers (ZnO, $Al_2O_3$) on the microstructure of borate glass system to find an etching mechanism of barrier ribs. The barrier ribs was etched with several steps, dissolving a small amount of residual glass, taking out alumina fillers, and removing a cluster type of ZnO fillers and glass matrix.

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Novel Planar Metamaterial with a Negative Refractive Index

  • Kim, Dong-Ho;Choi, Jae-Ick
    • ETRI Journal
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    • v.31 no.2
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    • pp.225-227
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    • 2009
  • A new planar metamaterial (MTM) with simultaneous negative values of permittivity (${\varepsilon}$) and permeability (${\mu}$) is proposed. Our MTM is composed of two identical copper patterns etched on both sides of dielectric laminate, which is very thin and easy to fabricate. Unlike conventional MTMs, the proposed structure shows a negative refractive index (NRI) behavior with respect to a normally incident wave. To explain the underlying principle of the NRI characteristics, an equivalent resonant circuit model based on surface current density distribution is investigated. An eigenmode analysis and a three-dimensional wave simulation for the stacked MTM prism are also performed to verify the existence of negative refraction. The experimental results from the transmission and reflection measurement ensure the validity of our design approach and show good agreement with the theoretically predicted effective medium parameters.

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A STDUY ON THE SURFACE MORPHOLOGY AND BOND STRENGTH OF DENTURE BASE RESIN TO COBALT-CHROMIUM ALLOY AFTER VARYING MODES OF SURFACE TREATMENT (COBALT-CHROMIUM 합금의 표면처리방법에 따른 레진 의치상의 접착강도 및 표면상태에 대한 연구)

  • Vang, Mong-Sook;Park, Young-Jon
    • The Journal of Korean Academy of Prosthodontics
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    • v.35 no.1
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    • pp.78-94
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    • 1997
  • The purpose of this experiment was to determine the effects of various treatments on denture base resin to metal bond for cobalt-chromium alloy. The metal surface was treated as follows. Group 1 : Sandblasted with $50{\mu}m$ aluminum oxide. Group 2 : Sandblasted with $250{\mu}m$ aluminum oxide. Group 3 : Sandblasted with $250{\mu}m$ aluminum oxide and followed by silicoating. Group 4 : Electrochemically etched. Group 5 : treated with oxidizing solution. Group 6 : Beaded with $200{\mu}m$ retention structure and followed by silicoating. All specimens were applied with 4-META resin and were thermocycled 1000 times at temperature of $5^{\circ}C$ to $55^{\circ}C$. The effects of various surface treatments on the bond strength between 4-META resin and metal interface were measured by using the universal testing machine. All specimens were observed with SEM. The results were as follows 1. The bond strength of 4-META resin were significantly higher to Co-Cr alloy. 2. The bond strength decreased in the following orders : group 6, group 3, groups 1 and 2, group 4, group 5 and there was no statistically significant difference in bond strength among groups 1 and 2.(p>0.05) 3. The bond strength of cobalt-chromium alloy to 4-META resin were not significantly different.(p>0.05) 4. The treated surface of groups 1, 2 and 3 has more fine undercut than that of groups 4 and 5 with SEM. 5. Stable adhesion can be achieved when mechanically roughened metal surface by sandblasting than treating in an electrochemical etching and an oxidizing solution with potassium manganate.

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