• Korean Journal of Materials Research
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• v.23 no.2
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• pp.116-122
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• 2013

For fabricating silicon solar cells with high conversion efficiency, texturing is one of the most effective techniques to increase short circuit current by enhancing light trapping. In this study, four different types of textures, large V-groove, large U-groove, small V-groove, and small U-groove, were prepared by a wet etching process. Silicon substrates with V-grooves were fabricated by an anisotropic etching process using a KOH solution mixed with isopropyl alcohol (IPA), and the size of the V-grooves was controlled by varying the concentration of IPA. The isotropic etching process following anisotropic etching resulted in U-grooves and the isotropic etching time was determined to obtain U-grooves with an opening angle of approximately $60^{\circ}$. The results indicated that U-grooves had a larger diffuse reflectance than V-grooves and the reflectances of small grooves was slightly higher than those of large grooves depending on the size of the grooves. Then amorphous Si:H thin film solar cells were fabricated on textured substrates to investigate the light trapping effect of textures with different shapes and sizes. Among the textures fabricated in this work, the solar cells on the substrate with small U-grooves had the largest short circuit current, 19.20 mA/$cm^2$. External quantum efficiency data also demonstrated that the small, U-shape textures are more effective for light trapping than large, V-shape textures.

• Clean Technology
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• v.18 no.1
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• pp.43-50
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• 2012

Cleaning procedure of solar silicon wafer, following ingot sawing process in solar cell production is studied. Types of solar silicon wafer can be divided into monocrystalline or multicrystalline, and slurry sawn wafer or diamond sawn wafer according to the ingot growing methods and the sawing methods, respectively. Wafer surface and contaminants can vary with these methods. The characterisitics of contaminants and wafer surface are investigated for each cleaning substrate, and appropriate cleaning agents are developed. Physical properties and cleaning ability of the cleaning agents are evaluated in order to verify the application in the industry. The wafers cleaned with the cleaning agents do not show any residual contaminants when analyzed by XPS and regular patterns are formed after texturization. Furthermore, the cleaning agents are applied in the production industry, which shows superior cleaning results compared to the existing cleaning agents.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• v.5 no.5
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• pp.583-591
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• 2018

Tool-chip adhesion impacts on cutting performance significantly, especially in finish cutting process. To promote cutting tools' anti-adhesion property, the concave micro-grooves texture (MGT) and convex volcano-like texture (VLT) were fabricated separately on lathe tools' rake faces by laser surface texturing (LST). Various orientations of MGT and different area densities (9% and 48%) and regions (partial and full) of VLT were considered in textured patterns designing. The following orthogonal cutting experiments, machining of aluminum alloy 5038, analyzed tools' performances including cutting force, cutting stability, chip shape, rake face adhesion and abrasion. It indicated that under dry finish cutting conditions, MGT contributed to cutting stability and low cutting forces, meanwhile friction and normal force reduced by around 15% and 10%, respectively with a weak correlation to the grooves' orientation. High density VLT tools, on the other hand, presented an obvious anti-adhesion property. A $5{\mu}m$ reduction of crater wear's depth can be observed on textured rake faces after long length cutting and textured rake faces presented half size of BUE regions comparing to the flat tool, however, once the texture morphologies were filled or worn, the anti-adhesion effect could be invalid. The bearing ratio curve was employed to analysis tool-chip contact and durability of textured surfaces contributing to a better understanding of anti-adhesion and enhanced durability of the textured tools.

• Korean Journal of Metals and Materials
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• v.56 no.12
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• pp.915-920
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• 2018

With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.6
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• pp.225-229
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• 2011

Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

• International Journal of Highway Engineering
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• v.11 no.2
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• pp.1-15
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• 2009

Surface of exposed aggregate concrete pavements is consists of exposed coarse aggregate by removing upper 2$\sim$3mm mortar of concrete slab. Exposed aggregate concrete pavements have advantages of maintaining low-noise and adequate skid-resistance level during the performance period. In order to provide the successful exposed concrete aggregate pavement, uniform distribution of the coarse aggregate on pavement surface through adequate the mix design and exposing method. The mix design in concrete pavement is generally designed on the basis of strength, but mix design of exposed aggregate pavement employed in this study includes the consideration of noise and skid resistance, as well as strength. Smaller of maximum coarse aggregate is known to be effective for reduce noise level. Optimum mix design and exposing method of fine-size exposed aggregate portland cement concrete pavement that can reducing the noise and maintain the adequate level of skid resistance are proposed in this study. To consider the variation of optimum exposing time due to the hardening speed of mortar by climatic condition, quantitative is also suggested measurement of hardening state.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.73.1-73.1
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• 2010

태양광 시장은 세계적인 금융 위기 속에서도 점점 그 규모가 확대되고 있다. 시장의 규모가 확대되고 있음에도 불구하고 금융 위기를 겪으면서 생산자 중심의 시장에서 수요자 중심의 시장으로 바뀌게 되었다. 이에 따라 더 적은 비용으로 높은 출력의 제품만이 경쟁력을 가지게 됨으로써 효율이 더욱 이슈화되었다. 여러 태양전지 중 가장 점유율이 높은 결정질 태양전지는 일반적인 양산 공정만으로 효율을 높이는데 한계가 있으므로 selective emitter, back contact, light induced plating 등의 새로운 공정을 도입하여 효율을 높이려는 경향이 나타나고 있다. 본 연구에서는, ALD 장치를 사용하여 결정질 태양전지의 후면을 passivation 함으로써 효율을 높이는 방법을 모색하였다. 부동화 층으로는 $Al_2O_3$를 사용하였으며 셀을 제조하여 평가하였다. 실험방법은 p-type의 웨이퍼를 이용하여 습식으로 texturing 후 $POCl_3$ 용액으로 p-n junction을 형성하였고 anti-reflection 막인 SiNx는 PECVD를 사용하여 R.I 2.05, 80nm 두께로 증착하였다. 그런 다음 후면의 n+ layer를 제거하기 위하여 SiNx에 영향을 미치지 않는 용액을 사용하여 후면을 식각하였다. BSF 층은 screen printer로 Al paste를 printing하여 형성하였고 Al etching용액으로 여분의 Al제거한 후 ALD 장치를 이용하여 $Al_2O_3$를 증착하였다. 마지막으로 전극을 형성한 후 laser로 isolation하여 효율을 평가하였다.

• Journal of the Korean Vacuum Society
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• v.21 no.2
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• pp.99-105
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• 2012

We fabricated the textured silicon (Si) surface on Si substrates by the electrochemical etching using gold (Au) nanoparticle catalysts. The antireflective property of the fabricated Si nanostructures was improved. The Au nanoparticles of ~20-150 nm were formed by the rapid thermal annealing using thermally evaporated Au films on Si. In the chemical etching, the aqueous solution containing $H_2O_2$ and HF was used. In order to investigate the effect of electrochemical etching on the etching depth and reflectance characteristics, the sample was immersed in the aqueous etching solution for 1 min with and without applied cathodic voltages of -1 V and -2 V. As a result, the solar weighted reflectance, i.e., the averaged reflectance with considering solar spectrum (air mass 1.5), could be efficiently reduced for the electrochemically etched Si by applying the cathodic voltage of -2 V, which is expected to be useful for Si solar cell applications.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.19-24
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• 2019

In this study, the Ag nano-dots structure was applied to the textured wafer surface to improve the light trapping effect of crystalline silicon solar cell. The Ag nano-dots structure was formed by the annealing of Ag thin film. Ag thin film deposition was performed using a thermal evaporator. The effect of light trapping was compared and analyzed through light reflectance measurements. The optimization process of the Ag nano-dots structure was made by varying the thickness of Ag thin film, the annealing temperature and time. The thickness of Ag thin films was in the range of 5 ~ 20 nm. The annealing temperature was in the range of 450~650℃ and the annealing time was in the range of 30 ~ 60 minutes. As a result, the light reflectance of 10 nm Ag thin film annealed at 650℃ for 30 minutes showed the lowest value of about 9.67%. This is a value that is about 3.37% lower than the light reflectance of the sample that has undergone only the texturing process. Finally, the change of the light reflectance by the HF treatment of the sample on which the Ag nano-dots structure was formed was investigated. The HF treatment time was in the range of 0 ~ 120 seconds. As a result, the light reflectance decreased by about 0.41% due to the HF treatment for 75 seconds.

• Textile Coloration and Finishing
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• v.25 no.3
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• pp.223-231
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• 2013

This research has a main focus on providing fundamental data for on-the-spot industrial fields by comparing and contrasting physical properties of fluffy spun-like material. The fluffy spun-like yarn is developed as fluffy yarn similar to natural spun-like yarn by treating polyester(FDY and + type shaped DTY) with ATY machine. In this experiment, using ATY machine for raw material texturing, we produced two fluffy yarns: (i) + type shaped(50d/36f, DTY) as core yarn and 100d/192f FDY as effect yarn[ATY(D)], (ii) FDY(75/36) as core yarn and 100d/192f FDY [ATY(F)] as effect yarn. After producing thous yarns, we twisted them with 500T/M, 700T/M, 1000T/M, respectively. produced yarns through this process were used as the samples for this experiment. Even though the shrinkage of fluffy yarn ATY(F) and ATY(D) becomes high as treated temperature rises and treated time lengthens, it is more affected by treated temperature then by treated time. In this experiment, produced fluffy yarn[ATY(D)] shows a little high values for temperature, but almost same values for higher temperatures. When we compare ATY(F) with ATY(D) fluffy yarn shows more natural fluffy yarn surface structure like natural cotton. The shrinkage of 700T/M twisted ATY(D) fluffy yarn show about 11% under treated temperature $180^{\circ}C$ and treated time 30min, and about 7% under $120^{\circ}C$ and 30min, respectively. But the shrinkage of 1000T/M fluffy yarn shoes about 9% and 6% under same conditions. Regarding treated time, tenacity and initial modulus of ATY(D) fluffy yarn rise high until 30min, but do not show much increase above 30min. Regarding treated temperature, tenacity and initial modulus of it rise high aboyer $140^{\circ}C$.