• Journal of Periodontal and Implant Science
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• 제51권5호
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• pp.298-315
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• 2021

Purpose: Peri-implantitis therapy and implant maintenance are fundamental practices to enhance the longevity of zirconia implants. However, the use of physical decontamination methods, including hand instruments, polishing devices, ultrasonic scalers, and laser systems, might damage the implant surfaces. The aim of this systematic review was to evaluate the effects of physical decontamination methods on zirconia implant surfaces. Methods: A systematic search was conducted using 5 electronic databases: Ovid MEDLINE, PubMed, Scopus, Web of Science, and Cochrane. Hand searching of the OpenGrey database, reference lists, and 6 selected dental journals was also performed to identify relevant studies satisfying the eligibility criteria. Results: Overall, 1049 unique studies were identified, of which 11 studies were deemed suitable for final review. Air-abrasive devices with glycine powder, prophylaxis cups, and ultrasonic scalers with non-metal tips were found to cause minimal to no damage to implantgrade zirconia surfaces. However, hand instruments and ultrasonic scalers with metal tips have the potential to cause major damage to zirconia surfaces. In terms of laser systems, diode lasers appear to be the most promising, as no surface alterations were reported following their use. Conclusion: Air-abrasive devices and prophylaxis cups are safe for zirconia implant decontamination due to preservation of the implant surface integrity. In contrast, hand instruments and ultrasonic scalers with metal tips should be used with caution. Recommendations for the use of laser systems could not be fully established due to significant heterogeneity among included studies, but diode lasers may be the best-suited system. Further research-specifically, randomised controlled trials-would further confirm the effects of physical decontamination methods in a clinical setting.

• 한국산업융합학회 논문집
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• 제23권6_2호
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• pp.1051-1058
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• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Tribology and Lubricants
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• 제39권5호
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• pp.190-196
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• 2023

Anti-adhesion coatings are very important in the processing of adhesive materials such as optical clear adhesive (OCA) films. Choosing the appropriate release coating material for dies and tools can be quite challenging. Hydrophobic surface treatment is usually performed, and its performance is often estimated by the static water contact angle (CA). However, the relationship between the release performance and the CA is not well understood. In this study, the water CAs of surfaces coated with anti-adhesion materials and the peel strengths of the acrylic-based adhesive films are evaluated. STC5 and SUS304 are selected as the base materials. Base materials with different surface roughnesses are produced by hairline finishing, mirror-polishing, and end milling. Four fluoropolymer compounds, including a self-assembled monolayer, are selected to make the base surface hydrophobic. Static, advancing, and receding CAs are mostly increased due to the coating, but the CA hysteresis is found to increase or decrease depending on the coating material. The peel strengths all decreased after coating and are largely dependent on the coating material, with significantly lower values observed for fluorosilane and perfluoropolyether silane coatings. The peel strength is observed to correlate better with the static CA and advancing CA than with the receding CA or hysteresis. However, it is not possible to accurately predict the anti-adhesion performance based on water CA alone, as the peel strengths are not fully proportional to the CAs.

• 대한소아치과학회지
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• 제30권4호
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• pp.545-553
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• 2003

상아질 접착력을 높이기 위해서는 적절히 습윤한 상아질 표면을 얻는 것이 중요하다. 이런 방법에는 정확한 지침이 없으며, 주관적이고 술자에 따라 많은 차이가 있다. 본 연구에서는 적절히 습윤한 상아질을 얻는 방법에 관한 연구의 일환으로, 유치의 산부식 후. 여러 가지 방법을 이용해 상아질을 건조시킨 표본의 조직상을 획득하여 상아질 표면의 차이를 비교하고자 하여 다음과 같은 결론을 얻었다. 1. 유치 상아질을 산부식하면, 도말층이 제거되고 상아세관이 노출되며, 관간상아질과 관주상아질이 탈회되고, 교원섬유가 풍부한 이행층이 노출되는 것을 확인할 수 있었다. 2. 산부식된 상아질이 과도하게 건조되면 탈회된 상아질이 수축하여, 관간상아질이 붕괴되어 높이가 점차적으로 낮아지고 상아세관의 직경은 조금씩 감소되는 것으로 나타났다. 3. 유치 산부식 후, 10cm 거리에서 20초 동안 압축 공기로 건조시키면 상아질이 과도하게 건조, 탈수됨을 확인할 수 있었다. 4. 유치 산부식 후, 10cm 거리에서 3초 동안 압축 공기로 건조시키거나 마른 cotton, 젖은 cotton, microbrush, absorbent tissue paper로 건조시키면 상아질이 적절하게 건조됨을 확인할 수 있었다.

• 보존과학회지
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• 제32권3호
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• pp.377-384
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• 2016

철불의 개금 시 표면에 남아 있는 옻칠 제거 방법에는 물리적인 방법과 화학적인 방법을 사용하고 있으나, 표면 손상 및 약품 사용으로 인한 환경오염, 보존과학자의 건강에도 매우 유해하다. 그래서 본 연구에서는 비접촉식이고 친환경적인 Nd:YAG 레이저를 이용하여 옻칠 제거 실험을 실시하였다. 시편은 크기가 $5{\times}5cm$인 철제(Fe 99.9%)시편 표면을 균일하게 연마한 후 생칠을 도포 횟수를 달리하여 각각 $10{\mu}m$, $20{\mu}m$, $30{\mu}m$의 두께 차이로 제작하였다. 본 실험에서 사용된 레이저기기는 Nd:YAG 레이저로, 적외선 영역의 1064 nm(160~800 mJ)와 가시광선 영역인 532nm(50~350 mJ)의 두 가지 파장 모드를 이용하였다. 실험은 레이저 파장 에너지 조사 횟수 등에 따른 시편 표면의 변화를 조사하였다. 레이저 조사 전 후 표면을 실체현미경과 SEM 관찰, 비접촉 표면 조도 측정기, FT-IR 등을 이용하여 옻칠의 제거 및 잔류 여부를 알아보았다. 분석 결과 1064 nm 파장을 이용하여 $1.0J/cm^2$ 밀도에서 표면 손상 없이 $10{\mu}m$, $20{\mu}m$ 두께의 옻칠이 제거됨을 확인할 수 있었다. 이와 같은 결과를 통해 철불 개금 시 잔류하고 있는 옻칠 제거 방법으로 Nd:YAG 레이저가 효율적임을 본 실험을 통해 알 수 있었다. 향후 금속뿐만 아니라 목칠 가구 등 다양한 재질의 연구가 이루어지면 표면 손상 없이 옻칠을 제거 하는데 효과적으로 활용 가능할 것으로 본다.

• 대한치과보철학회지
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• 제28권2호
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• pp.29-51
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• 1990

This study was designed to compre the tensile bond strength of 4-META containging denture base resin to Co-Cr alloys after various surface treatments. Especially the surface treatment of sandblasting the mental with aluminum oxide and treating in oxidizing solution composed of 3% aqueous sulfuric acid with 1% potassium manganate were compared. Effect of surface roughness on bonding was measured after sandblasting with 50um, 300um aluminun oxide and polishing with emery pater. Also the effects of wax and wax solvent on bonding were observed. According to the type of polymerization process, heat-cured Meta-Dent resin and autopolymerizing Meta-Fast resin were used. For some specimnens, the tensile bond strength were measured agter three pre-conditions : 1day after bonding, immersed in water at $75^{\circ}C{\pm}3^{\circ}C$ for 4weeks, under normal ambient condition for 4weeks. The following results were obtained from this study : 1. The bond strengths of resins containing 4-META were significantly higher than those of conventional denture base resins(p<0.05). 2. Autopolymerizing Meta-Fast resin had higher bond strength than heat-cured Meta-Dent, resin(p<0.05). 3. The bond strengths of Biosil and Nobilium to 4-META containging resins were not significally different(p>0.05). 4. Stable adhesion can be achieved when mechanically roughen the metal surface by snadblasting with $50{\mu}m$ aluminum oxide than treating in an oxidizing soluing with potassium manganate(p<0.05). 5. Once the metal surface is contaminated with wax, the bond srtength decreased greatly in spite of wax wash with boiling water. But the bond strength recovered significantly with the use of wax solvent 6. Meta-Dent resin had higher bond strength when roughen the metal surface with $50{\mu}m$ aluminum oxide than with $300{\mu}m$ aluminum oxide(p<0.05). In case of Meta-Fast, resin, the use of $300{\mu}m$aluminum oxide was a little advantageous of bonding, but was statistically insignificant(p>0.05).

• The Journal of Advanced Prosthodontics
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• 제11권1호
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• pp.7-15
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• 2019

PURPOSE. The aim of this study was to identify the effects of three aesthetic restorative materials on the wear between tooth and restoration by a pin-on-disk manner. MATERIALS AND METHODS. Six aesthetic restorative materials were used to prepare disk specimens for wear test, which were Lava Zirconia as zirconia group, Vintage MP and Cerabien ZR as veneering porcelain group, Gradia Direct microhybrid composite containing prepolymerized fillers, Filtek Z250 microhybrid composite containing zirconia glass and colloidal silica particles, and Filtek Z350 nanocomposite as composite resin group. Vertical loss of the worn cusp, change of the surface roughness of the restoration materials, and the surface topography were investigated after wear test under 9.8-N contact load. RESULTS. The porcelain groups (Vintage MP and Cerabien ZR) caused the largest vertical loss of teeth when compared with those of the composite resin and zirconia groups, and Filtek Z250 microhybrid composite results in the second-largest vertical loss of teeth. The surface of Filtek Z350 nanocomposite was deeply worn out, but visible wear on the surface of the zirconia and Gradia Direct microhybrid composite was not observed. When the zirconia surface was roughened by sand-blasting, vertical loss of teeth considerably increased when compared with that in the case of fine polished zirconia. CONCLUSION. It was identified that microhybrid composite resin containing a prepolymerized filler and zirconia with reduced surface roughness by polishing were the most desirable restorative materials among the tested materials to prevent the two-body wear between aesthetic restorative material and tooth.

• 한국정밀공학회지
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• 제20권5호
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.57-58
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• 2006

In MIM (metal insulator metal) capacitor, Ru (ruthenium) has been suggested as new bottom electrode due to its excellent electrical performance, a low leakage of current and compatibility to the high dielectric constant materials. In this case of Ru bottom electrode, CMP (chemical mechanical planarization) process was needed m order to planarize and isolate the bottom electrode. In this study, the effect of chemical A on polishing and etching behavior was investigated as functions of chemical A concentration, abrasive particle and pressure. Chemical A was used as oxidant and etchant. The thickness of passivation layer on the treated Ru surface increased with the increase of chemical A concentration. The etch rate and removal rate of Ru were increased by the addition of chemical A. The removal rate was highest m slurry of pH 9 with the addition of 0.1 M chemical A and 2 wt% alumina at 4 psi. The maximum removal rate is about 80 nm/min.

• 한국진공학회지
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• 제11권4호
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• pp.235-239
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• 2002

식각된 트랜치의 내부에 다결정 실리콘 측벽을 형성하고, 감압 화학기상 증착법(RPCVD: Reduced Pressure Chemical Vapor Deposition)을 이용해서 이를 선택적으로 성장시킴으로써 트랜치를 채우는 새로운 트랜치 격리방법을 제안하였다. 공정진행 결과, 측벽의 초기깊이와 선택적으로 성장되는 실리콘의 두께가 트랜치의 최종형태를 결정하는 가장 중요한 요소임을 확인할 수 있었다. 이 방법은 CMP 공정을 거치지 않고도 트랜치의 내부만이 실리콘으로 채워진 구조를 구현함으로써, 공정을 단순화할 뿐만 아니라 불균일 연마와 흠집발생 등 기존의 CMP 공정에서 발생할 수 있는 문제들을 방지할 수 있다는 장점을 지니고 있다.