• Bulletin of the Korean Space Science Society
• /
• 2004.04a
• /
• pp.33-33
• /
• 2004

Traditional bound abrasive grinding leaves the machine marks and subsurface damages ranging from 1 to few tens microns ms in height. These are removed typically by subsequent craftmen-based loose abrasive lapping, polishing and figuring. Using the multi-variable regression technique, we established a new automated grinding process control method for the removal of loose abrasive lapping from the traditional fabrication process. (omitted)

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.11 no.3
• /
• pp.106-111
• /
• 2001

The freestanding GaN substrates were grown by hydride vapor phase epitaxy (HVPE) on (0001) sapphire substrate and prepared by using laser induced lift-off. After a mechanical polishing on both Ga and N-surfaces of GaN films with 100$\mu\textrm{m}$ thick, their polarities have been investigated by using chemical etching in phosphoric acid solution, 3 dimensional surface profiler and Auger electron spectroscopy (AES). The composition of the GaN film measured by AES indicted that Ga and N terminated surfaces have the different N/Ga peak ratio of 0.74 and 0.97, respectively. Ga-face and N-face of GaN revealed quite different chemical properties: the polar surfaces corresponding to (0001) plane are resistant to a phosphoric acid etching whereas N-polar surfaces corresponding to(0001) are chemically active.

• Journal of the Korean Ceramic Society
• /
• v.19 no.1
• /
• pp.44-50
• /
• 1982

Drawing optical fibers in a graphite furnace is one of the most convenient and economical means of producing optical fiber. Since the flaw formation on optical fiber is mainly due to dust contaminations during drawing and surface corrosion by water vapor penetration through coating layer, the tensile strength of optical fiber drawn in a graphite furnace is greatly inflenced by the drawing conditions. The important factors found in this investigation were preform treatment (fire polishing), furnace interior environment (dust contamination, inert gas flows), primary coating condition (resin curing temperature, coating materials, method, thickness) and fiber pulling condition (furnace temperature, drawing speed, pulling tension). The tensile strength at optimum drawing conditions turned out to be 5 ~ 6 GPa.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.27 no.12
• /
• pp.2110-2117
• /
• 2003

A physics-based material removal model in various scales is described and a feature scale simulation for a chemical mechanical polishing (CMP) process is performed in this work. Three different scales are considered in this model, i.e., abrasive particle scale, asperity scale and wafer scale. The abrasive particle and the asperity scales are combined together and then homogenized to result in force balance conditions to be satisfied in the wafer scale using an extended Greenwood-Williamson and Whitehouse-Archard statistical model that takes into consideration the joint distribution of asperity heights and asperity tip radii. The final computation is made to evaluate the material removal rate in wafer scale and a computer simulation is performed for detailed surface profile variations on a representative feature. The results show the dependence of the material removal rate on the joint distribution, applied external pressure, relative velocity, and other operating conditions and design parameters.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.311-316
• /
• 2008

Thick-walled cylinders, such as a cannon or nuclear reactor, are autofrettaged to induce advantageous residual stresses into pressure vessels and to increase operating pressure and the fatigue lifetimes. As the autofrettage level increases, the magnitude of compressive residual stress at the bore also increases. The purpose of the present paper is to predict the accurate residual stress of SCM440 high strength steel using the Kendall model which was adopted by ASME Code. Hydraulic pressure process was applied and thick-walled cylinders were autofrettaged up to 30% overstrain levels. Electro polishing was performed to get more accurate data. Residual stresses were measured by X-ray diffraction method. The autofrettaged surface which was plastically deformed analyzed using a scanning electron microscope(SEM). Although there were some differences in measured residual stress and numerical, there is a tendency to agree.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2013.05a
• /
• pp.509-512
• /
• 2013

In this paper, force feedback control for industrial robots has been proposed as a system which is suitable to work utilizing pressure sensitive alternative to human. Conventionally, polished surface of the workpiece are recognized, chamfer ridge, machining processes such as deburring, and it is most difficult to automate because of its complexity, has been largely dependent on the human.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.304-307
• /
• 2003

Replacement of aluminum by copper for interconnections in the semiconductor industry has raised a number of important issues. The integration of copper interconnection can be carried out by CMP(chemical mechanical polishing) is used to planarize the surface topography. In this experiments, we evaluated the optimization of several conditions for chemical additives during Cu CMP process. It was presented that the main cause of grown particle size is tartaric acid. The particle size was in inverse propotion to a quantity of bead and the time of milling process. The slurry stabilizer and oxidizer have been shown to have very good effect by addition in later milling process.

• Transactions on Electrical and Electronic Materials
• /
• v.7 no.2
• /
• pp.62-66
• /
• 2006

Advanced CMP conditioner design requires investigations of key conditioner manufacturing parameters and their effects on pad surface and then wafer performance. In the present investigation, diamond shape, concentration, distribution, and other key manufacturing parameters are considered to improve CMP process stability and conditioner life. Self avoiding random distribution ($SARD^{TM}$) of diamond abrasives has been developed and both numerical simulation and experimental results show very stable and reliable polishing performance.

• International Journal of Precision Engineering and Manufacturing
• /
• v.9 no.2
• /
• pp.8-10
• /
• 2008

Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.

• Journal of the Korean Society for Precision Engineering
• /
• v.16 no.5 s.98
• /
• pp.40-47
• /
• 1999

In CMP for semiconductor wafer films, the acceptable within-chip planarity, within-wafer and wafer-to-wafer nonuniformity could be achieved by conditioning. The role of conditioning is to remove continuously polishing residues from pad and to maintain the initial pad surface pores. To reach these requirements, the diamond grits disk has been considered as a conventional conditioner. However, we have investigated many defects as scratch on wafers out of diamond grits shedding, contaminations from bonding materials, and pad pore subsidences by over-conditioning. So, this paper studies the effect of ultrasonic vibration in CMP conditioning as a representative. The effect of ultrasonic vibration was certified through ILD, Metal CMP.