Browse > Article

Numerical Analysis of a Slurry Flow on a Rotating CMP Pad Using a Two-phase Flow Model  

Nagayama, Katsuya (Department of Mechanical Information Science and Technology, Kyushu Institute of Technology)
Sakai, Tommi (Graduate School of Mechanical Information System, Kyushu Institute of Technology)
Kimura, Keiichi (Department of Mechanical Information Science and Technology, Kyushu Institute of Technology)
Tanaka, Kazuhiro (Department of Mechanical Information Science and Technology, Kyushu Institute of Technology)
Publication Information
International Journal of Precision Engineering and Manufacturing / v.9, no.2, 2008 , pp. 8-10 More about this Journal
Abstract
Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.
Keywords
CMP; Wafer; Pad; Slurry; Numerical simulation;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
Times Cited By Web Of Science : 3  (Related Records In Web of Science)
Times Cited By SCOPUS : 4
연도 인용수 순위
1 Sundararajan, S. G., Thakurta, D., Schwendeman, D. W., Murarka, S. P. and Gill, W. N., "Two-Dimensional Wafer-Scale Chemical Mechanical Planarization Models ased on Lubrication Theory and Mass Transport," J. Electrochem. Soc., Vol. 146, No. 2, pp. 761-766, 1999   DOI   ScienceOn
2 Subramanian, R. S., Zhang, L. and Babu, S. V., "Transport Phenomena in Chemical Mechanical Polishing," J. Electrochem. Soc., Vol. 146, No. 11, pp. 4263-4272, 1999   DOI
3 Thakurta, D. G., Borst, C. L., Schwendeman, D. W., Gutmann, R. J. and Gill, W. N., "Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory," Journal of The Electrochemical Society, Vol. 148, No. 4, pp. 207-214, 2001
4 Ring, T. A., Feeney, P., Kasthuriran, J., Li, S., Boldridge, D. and Dirksen, J., "Modeling Wafer Surface Damage Caused During CMP," Proceedings of CMP-MIC, Vol. 1, No. 12.F, 2006
5 Bae, S. H., Yang, S. M. and Kim, D. H., "Effects of chemical reaction on the polishing rate and surface planarity in the copper CMP," Rheology Journal, Vol. 14, No. 2, pp. 63-70, 2002
6 Park, J. W., Ryu, S. H. and Chu, C. N., "Pulsed Electrochemical Deposition for 3D Micro Structuring," International Journal of Precision Engineering and Manufacturing, Vol. 6, No. 4, pp. 49-54, 2005   과학기술학회마을
7 Borucki, L., Charns, L. and Philipossian, A., "Analysis of Frictional Heating of Grooved and Flat CMP Polising Pads," Journal of The Electrochemical Society,Vol. 151, No. 12, pp. 809-813, 2004   DOI   ScienceOn
8 Muldowney, G. P. and Tselepidakis D. T., "A Computational Study of Slurry Flow in Grooved CMP Polishing Pad," Proceedings of CMP-MIC, Vol. 1, No. 900P, pp. 147-156, 2004
9 Toshiroh, K. D., Seshimo, K., Suzuki, K., Philipossian, A. and Kinoshita, M., "Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP," Journal of The Electrochemical Society, Vol. 151, No. 3, pp. 196-199, 2004
10 Nagayama, K., Morishita, H., Kimura, K. and Tanaka K., "A Computational Study on Slurry Flow between a Wafer and CMP Pad with Grooves," Towards Synthesis of Micro-/Nano-Systems, JSPE Publication Series, Vol. 1, No. B5, pp. 277-280, 2006
11 Lin, J. F., Chen, S. C., Ouyang, Y. L. and Tsai, M. S., "Analysis of the Tribological Mechanical Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves," Journal of Tribology, Vol. 128, No. 3, pp. 445-459, 2006   DOI   ScienceOn
12 Muldowney, G. P., "Characterization of CMP Pad Surface using a Porous-Media Flow Approach," Proceedings of AIChE Annual Meeting, Vol. 1, No.191g, p. 12, 2003
13 Park, J. W., Lee, D. W., Kawasegi, N. and Morita, N., "Nanoscale Fabrication in Aqueous Solution using Tribo-Nanolithography," International Journal of Precision Engineering and Manufacturing, Vol. 7, No. 4, pp. 8-13, 2006   과학기술학회마을
14 Patir, N. and Cheng H. S., "An Average Flow Model for Determining Effects of Three-Dimensional Roughness on Partial Hydrodynamic Lubrication," Tansaction of the ASME Journal of Lubrication Tech, Vol. 100, No. 1, pp. 12-17, 1987
15 Chang, W. S., Choi, M. J., Kim, J. G., Cho, S. H. and Whang, K. H.,"Thin Film Micromachining Using Femtosecond Laser Photo Patterning of Organic Self-assembled Monolayers," International Journal of Precision Engineering and Manufacturing, Vol. 7, No. 1, pp. 13-17, 2006   과학기술학회마을