Low Temperature Sintering and Dielectric Properties of Low Dielectric Constant/Loss for LTCC Wiring Substrate (저유전율/저손실 LTCC 배선 기판의 저온소결 및 유전특성)
-
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
- /
- 2004.07b
- /
- pp.714-717
- /
- 2004