• Title/Summary/Keyword: Substrate loss

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Optimal Design of Dielectric-loaded Surface Plasmon Polariton Waveguide with Genetic Algorithm

  • Jung, Jae-Hoon
    • Journal of the Optical Society of Korea
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    • v.14 no.3
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    • pp.277-281
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    • 2010
  • We propose a design and optimization method for a dielectric-loaded surface plasmon polariton waveguide using a genetic algorithm. This structure consists of a polymer ridge on top of two layers of substrate and gold film. The thickness, width and refractive index of the ridge are designed to optimize the figures of merit including mode confinement and propagation length. The modal analysis combined with the effective index method shows that the designed waveguide exhibits a fundamental propagation mode with high mode confinement while ensuring that the propagation loss remains relatively low.

Synthesis of Polyimide Derived from 4-Methyl-1,2-phenylene Bis(4-aminobenzoate) and 4,4'-Hexafluoroisopropylidenediphthalic Anhydride

  • Byung Hyun Ahn
    • Elastomers and Composites
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    • v.58 no.1
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    • pp.26-31
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    • 2023
  • Aromatic diamine containing ortho catenation and methyl group was synthesized from 4-methyl catechol and 4-nitrobenzoyl chloride. Subsequently, a poly(amic acid) was prepared by reacting 4-methyl-1,2-phenylene bis(4-aminobenzoate) with 4,4'-hexafluoroisopropylidenediphthalic anhydride (6FDA). The resulting poly(amic acid) was transformed into a polyimide through chemical imidization. The polyimide formed was soluble in N-methyl-2-pyrrolidone (NMP) and could be cast into a flexible, transparent film. Furthermore, the polyimide exhibited a 5% weight loss at 380 ℃ in the nitrogen atmosphere.

Package-type polarization switching antenna using silicon RF MEMS SPDT switches (실리콘 RF MEMS SPDT 스위치를 이용한 패키지 형태의 편파 스위칭 안테나)

  • Hyeon, Ik-Jae;Chung, Jin-Woo;Lim, Sung-Joon;Kim, Jong-Man;Baek, Chang-Wook
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1511_1512
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    • 2009
  • This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.

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Basic Study on RF Characteristics of Thin-Film Transmission Line Employing ML/CPW Composite Structure on Silicon Substrate and Its Application to a Highly Miniaturized Impedance Transformer

  • Jeong, Jang-Hyeon;Son, Ki-Jun;Yun, Young
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.1
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    • pp.10-15
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    • 2015
  • A thin-film transmission line (TFTL) employing a microstrip line/coplanar waveguide (ML/CPW) was fabricated on a silicon substrate for application to a miniaturized on-chip RF component, and the RF characteristics of the device with the proposed structure were investigated. The TFTL employing a ML/CPW composite structure exhibited a shorter wavelength than that of a conventional coplanar waveguide and that of a thin-film microstrip line. When the TFTL with the proposed structure was fabricated to have a length of ${\lambda}/8$, it showed a loss of less than 1.12 dB at up to 30 GHz. The improvement in the periodic capacitance of the TFTL caused for the propagation constant, ${\beta}$, and the effective permittivity, ${\varepsilon}_{eff}$, to have values higher than those of a device with only a conventional coplanar waveguide and a thin film microstrip line. The TFTL with the proposed structure showed a ${\beta}$ of 0.53~2.96 rad/mm and an ${\varepsilon}_{eff}$ of 22.3~25.3 when operating from 5 to 30 GHz. A highly miniaturized impedance transformer was fabricated on a silicon substrate using the proposed TFTL for application to a low-impedance transformation for broadband. The size of the impedance transformer was 0.01 mm2, which is only 1.04% of the size of a transformer fabricated using a conventional coplanar waveguide on a silicon substrate. The impedance transformer showed excellent RF performance for broadband.

Transmit-receive Module for Ka-band Seekers using Multi-layered Liquid Crystal Polymer Substrates (다층 액정폴리머 기판을 이용한 Ka대역 탐색기용 송수신 모듈)

  • Choi, Sehwan;Ryu, Jongin;Lee, Jaeyoung;Lee, Jiyeon;Nam, ByungChang
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.20 no.5
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    • pp.63-70
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    • 2020
  • In this paper, the transmit-receive module for military seekers has been designed and fabricated in 35 GHz. To increase the performance of substrates and high integration of circuits in millimeter-wave band, a 4-layer LCP(Liquid Crystal Polymer) substrate was developed. This substrate was implemented with three FCCL substrates and two adhesive layers, and a process using the difference in melting point between the substrates was used for lamination. Using a strip line and a microstrip line was confirmed by the transmission loss along the length of the substrate, and the performance of LCP substrates was validated with a power divider in 35 GHz. After confirming the performance of individual blocks such as power amplifier and low noise amplifier, a single channel Ka-band transmission/reception module was developed using a 4-layer liquid crystal polymer substrate. The transmit power of this module has above 1.1W in pulse duty 10% and has an output power of 1.1W and it has receive noise figure less than 8.5 dB and receive gain more than 17.6 dB.

Effect of Sintering Temperature on Structural and Dielectric Properties of (Ba0.54Sr0.36Ca0.10)TiO3 Thick Films

  • Noh, Hyun-Ji;Lee, Sung-Gap;Nam, Sung-Pill;Lee, Young-Hie
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.2
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    • pp.49-52
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    • 2009
  • Barium strontium calcium titanate powders were prepared with the sol-gel method. Ferroelectric $(Ba_{0.54}Sr_{0.36}Ca_{0.1})TiO_3$(BSCT) thick films were fabricated by the screen-printing method on alumina substrate. Then we investigated the structural and dielectric properties of the BSCT thick films at different sintering temperatures. The thermal analysis showed that the BSCT polycrystalline perovskite phase formed at around $660^{\circ}C$. The X-ray diffraction analysis showed a cubic perovskite structure with no second phase present in all of the BSCT thick films. The average grain size and the thickness of the specimens sintered at $1450^{\circ}C$ were about $1.6{\mu}m$ and $45{\mu}m$, respectively. The relative dielectric constant increased and the dielectric loss decreased as the sintering temperature was increased; for BSCT thick films sintered at $1450^{\circ}C$ the values of the dielectric constant and the dielectric loss were 5641 and 0.4%, respectively, at 1 kHz.

Experimental Investigation of R(ω), T(ω) and L(ω) for Multi-Layer SRRs and Wires Metamaterials

  • Luo, Hao;Wang, Xian;Liao, Zhangqi;Wang, Tao;Gong, Rongzhou
    • Journal of electromagnetic engineering and science
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    • v.10 no.3
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    • pp.186-189
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    • 2010
  • Reflection(R($\omega$)), transmission(T($\omega$)) and loss(L($\omega$)) characteristics of multi-layer metamaterials are investigated experimentally in free space with the incident EM waves perpendicular to the substrate plane. The sample is made of split-ring resonators(SRRs) and wires which are the typical model of metamaterials. The R($\omega$) and T($\omega$) of multi-layer metamaterials have been calculated from the measured S-parameters. In this paper, we got the impedance-matched result according to the curves of R($\omega$), meanwhile the T($\omega$) decreased with increasing number of layers. At last, we attained the result that the L($\omega$) gets to nearly 98% around 8 GHz, with R($\omega$)=T($\omega$)=0. The design presented in this paper achieves experimented loss near unity.

Reduced Hybrid Ring Coupler Using Surface Micromachining Technology for 94-GHz MMIC Applications

  • Uhm, Won-Young;Beak, Tae-Jong;Ryu, Keun-Kwan;Kim, Sung-Chan
    • Journal of information and communication convergence engineering
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    • v.14 no.4
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    • pp.246-251
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    • 2016
  • In this study, we developed a reduced 94 GHz hybrid ring coupler on a GaAs substrate in order to demonstrate the possibility of the integration of various passive components and MMICs in the millimeter-wave range. To reduce the size of the hybrid ring coupler, we used multiple open stubs on the inside of the ring structure. The chip size of the reduced hybrid ring coupler with multiple open stubs was decreased by 62% compared with the area of the hybrid ring coupler without open stubs. Performance in terms of the loss, isolation, and phase difference characteristics exhibited no significant change after the use of the multiple open stubs on the inside of the ring structure. The reduced hybrid ring coupler showed excellent coupling loss of $3.87{\pm}0.33dB$ and transmission loss of $3.77{\pm}0.72dB$ in the measured frequency range of 90-100 GHz. The isolation and reflection were -48 dB and -32 dB at 94 GHz, respectively. The phase differences between two output ports were $180^{\circ}{\pm}1^{\circ}$ at 94 GHz.

Wafer-Level Package of RF MEMS Switch using Au/Sn Eutectic Bonding and Glass Dry Etch (금/주석 공융점 접합과 유리 기판의 건식 식각을 이용한 고주파 MEMS 스위치의 기판 단위 실장)

  • Kang, Sung-Chan;Jang, Yeon-Su;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of Sensor Science and Technology
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    • v.20 no.1
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    • pp.58-63
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    • 2011
  • A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

Design and Fabrication of Singly fed Circularly Polarized Patch Antenna with 2-stage LNA (2단 LNA를 결합한 단일급전 원편파 패치안테나의 설계 및 제작)

  • Yun, Li-Ho
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.10
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    • pp.1731-1736
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    • 2008
  • In this paper, singly fed circularly polarized nearly-square patch antenna for receiving S-DMB is presented. It used teflon substrate of relative dielectric constant ${\in}_{\gamma}=2.2$ and the sire is $40{\times}40{\times}15[mm]$. Experimental results of fabricated antenna show that input return loss and axial ratio are about 22MHz, 25MHz at the center resonant frequency, respectively. And fabricated LNA has gain of 27.5 [dB], NF of 1.27 [dB], input return loss of -15.4 [dB] and output return loss of -18.9 dB, respectively. Simulation results and experimental results are good agreements. This proposed antenna is well able to handheld gadgets for receiving S-DMB.