• Journal of the Korean Physical Society
• /
• v.73 no.10
• /
• pp.1473-1478
• /
• 2018

In this study, we have developed a simple and cost-effective method to prevent edge bead formation by covering the edge of a chip-level substrate with heat-resistant tape during patterning using SU-8. Edge beads are a fundamental problem in photoresists and are particularly notable in high-viscosity fluids and thick coatings. Edge beads can give rise to an air gap between the substrate and the patterning mask during UV exposure, which results in non-uniform patterns. Furthermore, the sample may break since the edge bead is in contact with the mask. In particular, the SU-8 coating thickness of the chip-level substrates used in MEMS or BioMEMS may not be properly controlled because of the presence of edge beads. The proposed method to solve the edge bead problem can be easily and economically utilized without the need for a special device or chemicals. This method is simple and prevents edge bead formation on the sample substrate. Despite the small loss in the taping area, the uniformity of the SU-8 coating is improved from 50.9% to 5.6%.

• Proceedings of the IEEK Conference
• /
• 2000.06a
• /
• pp.260-262
• /
• 2000

Printed microstrip antennas are known to have limitations in terms of bandwidth by the presence of the dielectric substrate. In this paper, to overcome these limitations, a broadband microstrip bow-tie antenna which has two dip point for high speed wireless LAN, fabricated on a Taconic substrate is designed and simulated. In simualted results, the return loss is two dip point which is -28.5dB at 5.68GHz and -27dB at 5.85GHz. The bandwidth of this antenna is 8.7％ about VSWR$\leq$2 and 5.9％ about VSWR$\leq$1.5.

• Proceedings of the KIEE Conference
• /
• 1991.11a
• /
• pp.265-268
• /
• 1991

In the study, PPTMDSO(plasma-polymerized tetramethyldisiloxane) films were deposited on on glass substrate in a paralled plate reactor. As the function of RF power increased from 20 W to 110 W, and the substrate temperature increased from $25^{\circ}C$ to $100^{\circ}C$, the deposit ion rate, increased. When oxygen was intentionally added in monomer vapor, the concentration of Si-O-Si bonds increased while C-H, Si-H, -CH3, Si(CH3)x, -CH3, and Si-C bonds decreased in IR spectra. Thermal stability of PPTMSDO film were investigated and weight loss at $800^{\circ}C$ was 7.3 %.

• Proceedings of the IEEK Conference
• /
• 1998.10a
• /
• pp.703-706
• /
• 1998

This paper presents an efficient substrate-bias generator(SBG)for low-power, high-density DRAM's The proposed SBG can supply stable voltage with switching the supply voltage of driving circuit, and it can substitude the small capacitance for the large capacitance. The charge pumping circuit of the SBG suffere no VT loss and is to be applicable to low-voltage DRAM's. Also it can reduce the power consumption to make VBB because of it's high pumping efficiency. Using biasing voltage with positive temperature coefficient, VBB level detecting circuit can detect constant value of VBB against temperature variation. VBB level during VBB maintaining period varies 0.19% and the power dissipation during this period is 0.16mw. Charge pumping circuit can make VBB level up to -1.47V using VCC-1.5V, and do charge pumping operation one and half faster than the conventional ones. The temperature dependency of the VBB level detecting circuit is 0.34%. Therefore the proposed SBG is expected to supply a stable VBB with less power consumption when it is used in low power DRAM's.

• Journal of Sensor Science and Technology
• /
• v.15 no.3
• /
• pp.164-167
• /
• 2006

Calorimeter is one of widely used biosensors. Conventional or existing calorimeters are realized directly on a silicon wafer which has very high thermal conductivity. It results in decreasing temperature difference between junctions and it makes a sensitivity of calorimeter to be decreased. In this study, the microcalorimeter was made by using MEMS(Micro Electro Mechanical Systems)-technology and hot junctions of the microcalorimeter are released from a silicon substrate to reduce loss of generated heat by reactions between biomolecules. Sensitivity of the released microcalorimeter was 18 mV/M which is 1.5 times higher than another calorimeters on silicon substrate by reactions between biotin and streptavidin.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.33 no.2
• /
• pp.81-86
• /
• 2001

The functions of food packaging are not only prevention from physical damage and loss during carrying and transportation, but also extension of shelf-life by adding antimicrobial substrate in packaging materials. Consumption of active packaging is gradually increasing. With different dosage of potassium sorbate(P.S.), the food preservative agent, antimicrobial papers were made by internal and external application of starch. The antimicrobial action of the paper was analyzed by the halo test and the shake flask method. The mechanical properties and strength were also measured. Antimicrobial papers adding P.S. showed higher values in tensile index than adding starch. The antimicrobial paper using starch showed similar microbe decreasing rate as that using P.S. Though microbe decreasing rate was 21.9%, it showed possibility to make antimicrobial paper using food preservative.

• Korean Journal of Pharmacognosy
• /
• v.27 no.4
• /
• pp.328-335
• /
• 1996

Effects of hydrogen peroxide$(H_2O_2)$ on polyphenol oxidase (PPO) in Perillae Folium were investigated. The inactivation of this enzyme was dependent on $H_2O_2$ concentration. and the initial lag period was not shown. Preincubation of Perillae Folium PPO with $H_2O_2$ in the absence of a substrate resulted in rapid loss of enzymatic activity. The inactivation of PPO by $H_2O_2$ dependents temperature and pH. OH radical scavengers such as mannitol and sodium formate did not protect the enzyme against inactivation by $H_2O_2$. Substrate analogue such as phenylalanine protected the enzyme against inactivation by $H_2O_2$. and copper chelator such as sodium azide also protected the enzyme.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.6
• /
• pp.344-347
• /
• 2014

This study was carried out on DLC thin film deposition technology used in infrared optical system production as a method of reducing the shape changes of the molding core and the consequent loss of life. Experiments on the deposition on silicon wafer and tungsten carbide used as a substrate for molding core were conducted at each processing condition using a filtered arc system, and it was found that the surface and mechanical properties were of the greatest quality when the substrate bias voltage of -150 V was used. In addition, it was confirmed that the PV and Ra characteristics were improved by the deposition of the DLC thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.1084-1087
• /
• 2001

The (Sr$\sub$0.85/Ca$\sub$0.15/)TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The crystallinity of SCT thin films is increased with increase of substrate temperature in the temperature range of 100[$^{\circ}C$]∼500[$^{\circ}C$]. Also, the crystallinity of SCT thin films are obtained at the substrate temperature above 400[$^{\circ}C$]. SCT thin films had (111) preferred orientation. The dielectric constant changes almost linearly in temperature ranges of-80∼+90[$^{\circ}C$]. The temperature properties of the dielectric loss have a stable value within 0.1. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.12
• /
• pp.1106-1110
• /
• 2005

We fabricated (110) silicon hard master by using anisotropic wet etching for embossing. The etching chemical for the silicon wafer was a TMAH $25\%$ solution. The anisotropic wet etching produces a smooth sidewall surface and the surface roughness of the fabricated master is about 3 nm. After spin coating an organic-inorganic sol-gel hybrid material on a silicon substrate, we employed hot embossing technique operated at a low pressure and temperature to form patterns on the silicon substrate by using the fabricated master. We successfully fabricated the multi-mode planar optical waveguides showing low propagation loss of 0.4 dB/cm. The surface roughness of embossed patterns was uniform for more than 10 times of the embossing processes with a single hydrophobic surface treatment of the silicon hard master.