• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.10
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• pp.67-73
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• 2010

In this paper, the effect of a finite substrate on the mutual coupling of a pair of microstrip patch antennas along the H -plane is investigated. The mutual coupling of a pair of microstrip patch antennas can be reduced using the interference effect due to the phase difference by a variety of routes of the surface wave. In the case of the substrate with $\varepsilon_r$=10 and thickness of 3.2 mm, the mutual coupling is reduced by 4.85 dB on the substrate size with the strong mutual coupling, while the mutual coupling is reduced by 34.28 dB on the substrate size with the weak mutual coupling when the distance between the antenna centers is varied from 0.5 $\lambda_0$ to 1.0 $\lambda_0$. In the case of optimization substrate size, the decreasing rate of the mutual coupling with the increase of the distance between the antenna centers is very large. Good agreements between the image method and full wave simulation results are obtained.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.320-324
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• 2015

Mutual coupling between antenna elements of a linear microstrip patch antenna array positioned along the H-plane including the effect of edge reflections is investigated. Simple formulas are presented for the estimation of the grounded dielectric substrate size with minimum mutual coupling. The substrate sizes calculated by these formulas are in good agreement with those obtained by the full-wave simulation and experimental measurement. The substrate size with minimum mutual coupling is a function of the effective dielectric constant for surface waves and the distance between the antenna centers. The substrate size with minimum mutual coupling decreases as the effective dielectric constant for surface waves on a finite grounded dielectric substrate increases.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.1
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• pp.49-57
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• 2002

Including RF Package inductance, substrate coupling through conductive silicon(Si)-substrate is modeled and quantitatively characterized. 2-port substrate coupling model is extended for the characterization of multi-port substrate coupling between digital circuit block and analog/RF circuit block. Furthermore, scalable parameter extraction model is developed. Multi-port substrate coupling can be investigated by linearly superposing a frequency-dependent 2-port substrate coupling model using scalable parameters. In addition, Substrate coupling including RF package inductance effect is quantitatively investigated. It is shown that package effect increases substrate coupling and shifts a characteristic frequencies(i.e., poles) to the higher frequency range. The proposed methodology can be efficiently used to the mixed-signal circuit performance verification.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.91-92
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• 2005

The electromagnetic coupling effect in standard CMOS process is simulated and evaluated. EM coupling transfer characteristic between planar spiral inductors by isolation methode in standard CMOS have simulated and measured. Measurement results show that suppression of EM coupling effect by ground guardring. The evaluated structures are fabricated 1P5M(one poly, five metal) 0.25um standard CMOS process. These measurement results provide a isolation design guidelines in standard CMOS process for Rf coupling suppression.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.6
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• pp.26-34
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• 2010

The mutual coupling of a pair of microstrip patch antennas on a finite grounded dielectric substrate is influenced by the diffracted field of surface waves from the edges of a substrate. The effective dielectric constant of a grounded dielectric substrate determines the distance between the antenna center and the edge of a substrate to obtain the minimum mutual coupling between a pair of microstrip patch antennas. The optimum substrate size with the minimum mutual coupling is easily calculated using the image method. The optimum substrate sizes using the linage method are in good agreement with the results obtained by the full wave simulation.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.48 no.4
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• pp.92-99
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• 2011

Effect of a finite grounded substrate on mutual coupling characteristics of a 2-element array antenna using inductor loaded patch antennas is investigated. The mutual coupling characteristics of a 2-element array antenna using inductor loaded patch antennas positioned along the E-plane are compared with those positioned along the H-plane. The magnitude of mutual coupling is very small and the distance between the center of element and the substrate edge on the E-plane for the minimum mutual coupling is similar regardless of the direction at which antenna elements are positioned in the case of a 2-element array antenna using inductor loaded patch antennas.

• Applied Chemistry for Engineering
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• v.31 no.2
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• pp.230-236
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• 2020

In this study, an adhesive tape with water and impact resistance for mobile devices was developed using a UV-curable urethane acrylate based polymer as a substrate. The substrate fabricated by UV-curable materials shows hydrophobicity and poor wettability, which significantly deteriorates the interface-adhesions between the substrate and acrylic adhesive. In order to improve the interface adhesion, 3-glycidoxy-propyl trimethoxysilane (GPTMS), a silane coupling agent having epoxy functional groups, was selected and incorporated into UV-curable urethane acrylate based polymer resins in various contents. The changes of the chemical composition according to the contents of GPTMS was studied with Fourier-transform infrared spectroscopy (FT-IR), energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) to know the surface bonding properties. Also mechanical properties of the substrate were characterized by tensile strength, gel fraction and water contact angle measurements. The peel strengths at 180° and 90° were measured to compare the adhesion between the substrate and adhesive according to the silane coupling agent contents. The mechanical strength of the urethane acrylate adhesive tape decreased as the silane coupling agent increased, but the adhesion between the substrate and adhesives increased remarkably at an appropriate content of 0.5~1 wt%.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.2330-2334
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• 2014

In this study, we confirmed the frequency characteristics of planar spiral inductor based on non-contact method AC coupling for wireless signal transmission. The dielectric constant variation of the substrate does not directly effect the inductance of device but effect the electrostatic capacity of device. Therefore, its change self-resonance frequency. The thickness increment of the substrate increase inductance but decrease self-resonance frequency. Because, the thickness decrement of the substrate make the inside electrostatic capacity increment.

• The Journal of the Acoustical Society of Korea
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• v.20 no.3E
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• pp.31-37
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• 2001

Finite element model of a cMUT is constructed using the commercial code ANSYS to analyze the cross talk mechanism. Calculation results of the complex load impedance seen by single capacitor cells are presented, and then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Cross talk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the cross talk level, the effect of various structural variations of the substrate are investigated, which include a change of its thickness and etched trenches or polymer walls between array elements.

• Journal of Electrical Engineering and information Science
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• v.2 no.3
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• pp.95-98
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• 1997

A nonlinear optical-microwave interaction is carried out in an uniplanar CPW-to-Slotline ring resonator on the semi-insulating GaAs substrate, in which a Schottky photodetector is monolithically integrated as a coupling gap. When the capacitive reactance of the detetor is modulated, the parametric amplification effect of the mixer occurs. In this device structure, the parametric amplification gain of 20 dB without the applied bias in RF signal is obtained. This microwave optoelectronic mixer can be used in the fiber-optic communication link.