• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.91-95
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• 2010

A UV-enhanced atomic layer deposition (UV-ALD) process was developed to deposit $TiO_2$ thin films on Si substrates using titanium isopropoxide(TIP) and $H_2O$ as precursors with UV light. In the UV-ALD process, the surface reactions were found to be self-limiting and complementary enough to yield a uniform, conformal, pure $TiO_2$ thin film on Si substrates at room temperature. The UV light was very effective to obtain the high-quality $TiO_2$ thin films with good adhesive strength on Si substrates. The UV-ALD process was applied to produce uniform and conformal $TiO_2$ coats into deep trenches with high aspect ratio.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.441-442
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• 2002

Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.173-178
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• 2007

Carbon nanotube cathodes(CNT cathodes) with a trench structure similar to gated structure of triode-type cathode were fabricated by a screen printing method using multi-walled carbon nanotubes. The effects of surface treatments on CNT cathodes were investigated for high efficiency field emission displays(FEDs). A liquid method easily removed the organic residue and protruded the CNTs. Field emission properties were measured by using a diode-type mode. The liquid method produced a turn-on field of $1.4V/{\mu}m$. The emission current density was measured about $3.1mA/cm^{2}$ at the electric field of $3V/{\mu}m$. The liquid method showed a high potential applicable to the surface treatment for triode-type FEDs.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.124-131
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• 1999

Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.816-823
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• 1996

Chlorine containing high density plasmas are widely used to etch various materials in the microelectronic device fabrication. In this study, the characteristics of inductively coupled $Cl_2(O_2/N_2$) plasmas and their effects on the formation of silicon etching have been investigated using a Langmuir probe, quadrupole mass spectrometry(QMS), X-ray photoelectron spectroscopy(XPS), and Scanning Electron Microscopy(SEM). The addition of oxygen for chlorine plasmas reduced ion current densities and chlorine radical densities compared to the nitrogen addition by the recombination of oxygen with chlorine. Also, when silicon is etched in $Cl_2/O_2$ plasmas, etch products recombined with oxygen such as $SiCl_xO_y$ emerged. However, when nitrogen is added to chlorine, etch products recombined with nitrogen or Si-N bondings on the etched silicon surface were not found. All the silicon etch characteristics were dependent on the plasma conditions such as ion density, radical density, etc. As a result sub micron vertical silicon trench etch profiles could be effectively formed using optimized etch conditions for $Cl_2/O_2\; and \;Cl_2/N_2$ gas combinations.

• Journal of the Korea Society for Simulation
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• v.9 no.4
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• pp.51-58
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• 2000

The control of the data retention time is a main issue for realizing future high density dynamic random access memory. The novel junction process scheme in sub-micron DRAM cell with STI(Shallow Trench Isolation) has been investigated to improve the tail component in the retention time distribution which is of great importance in DRAM characteristics. In this' paper, we propose the new implantation scheme by gate-related ion beam shadowing effect and buffer-enhanced ${\Delta}Rp$ (projected standard deviation) increase using buffered N-implantation with tilt and 4X(4 times)-rotation that is designed on the basis of the local-field-enhancement model of the tail component. We report an excellent tail improvement of the retention time distribution attributed to the reduction of electric field across the cell junction due to the redistribution of N-concentration which is Intentionally caused by ion Beam Shadowing and Buffering Effect using tilt implantation with 4X-rotation. And also, we suggest the least requirements for adoption of this new implantation scheme and the method to optimize the key parameters such as tilt angle, rotation number, Rp compensation and Nd/Na ratio. We used MEDICI Simulator to confirm the junction device characteristics. And measured the refresh time using the ADVAN Probe tester.

• Journal of The Korean Society of Agricultural Engineers
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• v.61 no.6
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• pp.67-72
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• 2019

This study compared the theory of a culvert spacing and analytical results of the seepage flow for the subsurface drainage. i) If culvert spacing (Sc) is within 5 m, the unit drainage (q) is very larger; in contrast, if Sc is 5 m or more, there is very little drainage in the middle between drains. Therefore, the drain spacing should be within 5 m to ensure high drainage efficiency. ii) Since the planned culvert drainage increases linearly with the soil's permeability coefficient (k), k must be taken into account when determining the drain diameter by the planned culvert drainage. iii) As a result of analyzing the drainage performance of the absorbing culvert, the drainage performance is sufficient with the diameter of the corrugated drain pipe Dc = 50 mm at the length of the drain Lc = 100 m. iv) Therefore, if the drain spacing (Sc) is less than 5 m using the low-cost non-excavated drainage pipe method (${\Phi}50mm$ the corrugated drain pipe and fiber mat) rather than the conventional trench drain method (Sc > 10 m, Dc > 100 mm), uniform and high drainage efficiency can be ensured as well as low construction cost. v) The sub-irrigation+drainage culvert requires narrower drain spacing (Sc < 2-3 m) for irrigation. As a result of examining the condition of 35 mm in diameter (Dc) and 2~3 m in drain spacing, it is possible to apply the non-excavated drainage pipe method to the sub-irrigation+drainage culvert because drainage performance is sufficient at the drain length Lc = 50 m.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.43-47
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• 2016

This paper covers the study on the properties of $TiO_2$ film deposited by atomic layer deposition (ALD) using TTIP and water at various temperatures including the low temperature range of <$150^{\circ}C$. At low deposition temperature, ALD $TiO_2$ films showed uniform growth rate per cycle ($0.3{\AA}/cycle$), good uniformity, smooth surface, and homogenous amorphicity. They also showed good conformality of >80% on the trench structure with the high aspect ratio of up to 75. However, relatively high concentration of impurities (C~4-7 at%) in the film was observed due to low deposition temperature.

• Economic and Environmental Geology
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• v.33 no.4
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• pp.249-260
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• 2000

The development of dual volcanic chains, parallel to the trend of the subduction trench, is observed in the southern part of Korea. Elsewhere on the Earth volcanic arcs dominantly consist of two such chains. In the southern part of Korea, two volcanic chains within a single volcanic arc was developed. Kyongsang basin, where the first volcanic chain located, and Youngdong-Kwangju depression zone where the second volcanic zone located, showed sub-parallel volcanic rock distributed areas. Concentrations of incompatible elements in the southern part of Korea samples show clear across-arc variations, with lavas from the first volcanic chain being most depleted in these elements, all incompatible element concentrations increase towards the second volcanic chain. The above across-arc variation may be caused by the difference in solid phases coexisting with the fluid phases during the dehydration processes. The concentrations of incompatible elements, Zr/Y ratios, and Rb/K ratios indicate that the second volcanic chain (Youngdong-Kwangiu depression zone) was generated by low degrees of partial melting at the deeper depth compared to the conditions of the first volcanic chain (Kyongsang basin) and residual garnet probably attributed to the their partial melting.