• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.156-157
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• 1998

It is a diffcult and challenging pproblem to control the growth of eppitaxial films. Heteroeppitaxy is esppecially idfficult because of the lattice mismatch between sub-strate and depposited layers. This mismatch leads usually to a three dimensional(3D) island growth. But the use of surfactants such as As, Sb, and Bi can be beneficial in obtaining high quality heteroeppitaxial films. In this study medium energy ion scattering sppectroscoppy(MEIS) was used in order to reveal the growth mode of Ge on Si(001) and the strain of depposited film without and with dynamically supplied atomic hydrogen at the growth thempperature of 35$0^{\circ}C$. It was ppossible to control the growth mode from layer-by-layer followed by 3D island to layer-by-layer by controlling the hydrogen flux. In the absent of hydro-gen the film grows in the layer-by-layer mode within the critical thickness(about 3ML) and the 3D island formation is followed(Fig1). The 3D island formation is suppressed by introducing hydrogen resulting in layer-by-layer growth beyond the critical thickness(Fig2) We measured angular shift of blocking dipp in order to obtain the structural information on the thin films. In the ppressence of atomic hydrogen the blocking 야 is shifted toward higher scattering angle about 1。. That means the film is distorted tetragonally and strained therefore(Fig4) In other case the shift of blocking dipp at 3ML is almost same as pprevious case. But above the critical thickness the pposition of blocking dipp is similar to that of Si bulk(Fig3). It means the films is relaxed from the first layer. There is 4.2% lattice mismatch between Ge and Si. That mismatch results in about 2。 shift of blocking dipp. We measured about 1。 shift. This fact could be due to the intermixing of Ge and Si. This expperimental results are consistent with Vegard's law which says that the lattice constant of alloys is linear combination of the lattic constants of the ppure materials.

• Journal of KSNVE
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• v.7 no.1
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• pp.43-53
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• 1997

This paper investigated the practical use for measuring the structural intensity (power flow per width of cross section) in a uniform semi-infinite beam in flexural vibration. The structural intensity is obtained as a vector at a measurement point, One-dimensional structural intensity can be obtained from 4-point cross spectral measurement, or 2-point measurement on the assumption of far field. The measurement errors due to finite difference approximation and phase mismatch of accelerometers are examined. For precise measurements, it would be better to make the value of k$\delta$(wave number x space between accelerometers) between 0.5 and 1.0. Formulation of the relation between bending waves in structures and structural intensity makes it possible to separate the wave components by which one can get a state of the vibration field. Experimental results are obtained from 2- and 4-point measurement performed at 200mm (near field) and 400mm (far field) apart from excitation point in random excitation. the results are compared with the theoretical values and measured values of input power spectrum in order to verify the accuracy of structural intensity method, 2-point method is suggested as the practical structural intensity method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.239-242
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• 1998

Ca $F_2$ films have superior gate insulator properties than conventional gate insulator such as $SiO_2$, Si $N_{x}$, $SiO_{x}$, and T $a_2$ $O_{5}$ to the side of lattice mismatch between Si substrate and interface trap charge density( $D_{it}$). Therefore, this material is enable to apply Thin Film Transistor(TFT) gate insulator. Most of gate oxide film have exhibited problems on high trap charge density, interface state in corporation with O-H bond created by mobile hydrogen and oxygen atom. This paper performed Ca $F_2$ property evaluation as MIM, MIS device fabrication. Ca $F_2$ films were deposited at the various substrate temperature using a thermal evaporation. Ca $F_2$ films was grown as polycrystalline film and showed grain size variation as a function of substrate temperature and RTA post-annealing treatment. C-V, I-V results exhibit almost low $D_{it}$(1.8$\times$10$^{11}$ $cm^{-1}$ /le $V^{-1}$ ) and higher $E_{br}$ (>0.87MV/cm) than reported that formerly. Structural analysis indicate that low $D_{it}$ and high $E_{br}$ were caused by low lattice mismatch(6%) and crystal growth direction. Ca $F_2$ as a gate insulator of TFT are presented in this paper paperaper

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.207-212
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• 2014

Aluminum-doped zinc oxide (AZO) films were deposited on SiOC/Si wafer by an RF-magnetron sputtering system, by varying the deposition parameters of radio frequency power from 50 to 200 W. To assess the correlation of the optical properties between the substrate and AZO thin film, photoluminescence was measured, and the origin of deep level emission of AZO thin films grown on SiOC/Si wafer was studied. AZO formed on SiOC/Si substrates exhibited ultraviolet emission due to exciton recombination, and the visible emission was associated with intrinsic and extrinsic defects. For the AZO thin film deposited on SiOC at low RF-power, the deep level emission near the UV region is attributed to an increase of the variations of defects related to the AZO and SiOC layers. The applied RF-power influenced an energy gap of localized trap state produced from the defects, and the gap increased at low RF power due to the formation of new defects across the AZO layer caused by lattice mismatch of the AZO and SiOC films. The optical properties of AZO films on amorphous SiOC compared with those of AZO film on Si were considerably improved by reducing the roughness of the surface with low surface ionization energy, and by solving the problem of structural mismatch with the AZO film and Si wafer.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.737-739
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• 1998

Gate insulators using various fluoride films were investigated for thin film transistor applications. Conventional oxide containing materials exhibited high interface states, high $D_{it}$ gives an increased threshold voltage and poor stability of TFT. To improve TFT performances, we must reduce interface trap charge density between Si and gate insulator. In this paper, we investigated gate insulators such as such as $CaF_2$, $SrF_2$, $MgF_2$ and $BaF_2$. These materials exhibited an improvement in lattice mismatch, difference in thermal expansion coefficient, and electrical stability MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 0.737%, breakdown electric field higher than 1.7MV/cm and leakage current density of $10^{-6}A/cm^2$. This paper probes a possibility of new gate insulator material for TFT application.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.12
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• pp.755-760
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• 1999

Various fluoride films were investigated for a gate insulator of thin film transistor application. Conventional oxide containing materials like $SiO_2\;Ta_2O_5\; and \; Al_2O_3$ exhibited high interface states which lead to an increased threshold voltage and poor stability of TFT. In this paper, we investigated gate insulators using a binary matrix system of fluoride such as $CaF_2,\; SrF_2\; MgF_2,\; and\; BaF_2$. These materials exhibited an improvement in lattice mismatch, interface state and electrical stability. MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 5%, breakdown electric field higher than 1.2MV/cm and leakage current density of $10^{-7}A/cm^2$. MIS diode having $Ca_2$ film as an insulation layer exhibited the interface states as low as $1.58\times10^{11}cm^{-2}eV^{-1}$. This paper probes a possibility of new gate insulator materials for TFT applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.47-50
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• 2000

This paper investigated structural and electrical properties of $Y_2$ $O_3$ as a buffer layer of single transistor FRAM (ferroelectric RAM). $Y_2$ $O_3$ buffer layers were deposited at a low substrate temperature below 40$0^{\circ}C$ and then RTA (rapid thermal anneal) treated. Investigated parameters are substrate temperature, $O_2$ partial pressure, post-annealing temperature, and suppression of interfacial $SiO_2$ layer generation. For a well-fabricated sample, we achieved that leakage current density ( $J_{leak}$) in the order of 10$^{-7}$ A/$\textrm{cm}^2$, breakdown electric field ( $E_{br}$ ) about 2 MV/cm for $Y_2$ $O_3$ film. Capacitance versus voltage analysis illustrated dielectric constants of 7.47. We successfully achieved an interface state density of $Y_2$ $O_3$/Si as low as 8.72x1010 c $m^{-2}$ e $V^{-1}$ . The low interface states were obtained from very low lattice mismatch less than 1.75%.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.6
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• pp.583-590
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• 2015

Automobile crash optimization is nonlinear dynamic response structural optimization that uses highly nonlinear crash analysis in the time domain. The equivalent static loads (ESLs) method has been proposed to solve such problems. The ESLs are the static load sets generating the same displacement field as that of nonlinear dynamic analysis. Linear static response structural optimization is employed with the ESLs as multiple loading conditions. Nonlinear dynamic analysis and linear static structural optimization are repeated until the convergence criteria are satisfied. Nonlinear dynamic crash analysis for frontal analysis may not have boundary conditions, but boundary conditions are required in linear static response optimization. This study proposes a method to use the inertia relief method to overcome the mismatch. An optimization problem is formulated for the design of an automobile frontal structure and solved by the proposed method.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.10-14
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• 2002

Structural behavior of high-pressure composite vessels of TYPE 3 (full-wrapped over a seamless aluminum liner) was studied through numerical simulations based on 3D nonlinear finite element method. Under high-pressure loading, a TYPE 3 composite vessel shows material nonlinearity due to elastic-plastic deformation of aluminum liner, and mismatch of deformation at the junction of cylinder and dome causes geometrical nonlinearity. Finite element modeling and analysis technique considering this nonlinearity was presented, and a pressure vessel of 6.8L of internal volume was analyzed. Design specification to satisfy requirements was determined based on analysis results.

• Nuclear Engineering and Technology
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• v.49 no.5
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• pp.1031-1043
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• 2017

A structural model for stress distributions of coated Zircaloy subjected to realistic incore pressure difference, thermal expansion, irradiation-induced axial growth, and creep has been developed in this study. In normal operation, the structural integrity of coating layers is anticipated to be significantly challenged with increasing burnup. Strain mismatch between the zircaloy and the coated layer, due to their different irradiation-induced axial growth, and creep deformation are found to be the most dominant causes of stress. This study suggests that the compatibility of the high temperature irradiation-induced strains (axial growth and creep) between zircaloy and the coating layer and the capability to undergo plastic strain should be taken as key metrics, along with the traditional focus on chemical protectiveness.