Numerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives (TSOP(Thin Small Outline Package) 열변형 개선을 위한 전산모사 분석)
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- Journal of the Microelectronics and Packaging Society
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- v.20 no.3
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- pp.31-35
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- 2013