• 한국전기전자재료학회논문지
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• 제26권1호
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• pp.56-63
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• 2013

IGZO thin films have been prepared by RF magnetron sputtering. The structural, electrical and optical properties of the IGZO thin films have been investigated as a function of deposition condition. XRD analysis of IGZO thin films showed a typical crystallographic orientation with c-axis perpendicular regardless of deposition conditions. The carrier mobility, carrier concentration and resistivity of the IGZO films sputtered at 200 W, 1mTorr and $300^{\circ}C$ were $28.5cm^2/V{\cdot}sec$, $2.6{\times}10^{20}cm^3$, $8.8{\times}10^{-4}{\Omega}{\cdot}cm$ respectively. The optical transmittance were higher than 80% at visible region regardless of the deposition conditions under the experiments above, and specifically higher than 90% at wave length over 500 nm. The absorption edge was shifted to shorter wavelength with increase of carrier concentration.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.51-54
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• 2000

In this paper, $Ba_{0.5}$Sr$_{0.5}$TiO$_3$ thin films were prepared on Pt/Ti/SiO$_2$/Si substrate by RF magnetron sputtering method. We investigated effect of deposition conditions (especially RF input power) on structural properties of BST thin films. Deposit conditions of BST films were set working gas ratio, Ar:O$_2$= 70 : 30, working pressure 10mTorr, and RF input power 25W, 50W, 75W and 100W. Post-annealing using rapid thermal annealing(RTA) performed at 45$0^{\circ}C$, 55$0^{\circ}C$, $650^{\circ}C$, and 75$0^{\circ}C$ in oxigen ambient for 60 sec, respectively. The structural properties of BST films on Pt/Ti/SiO$_2$/Si substrate analysed by X-ray diffraction(XRD).).).

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.406-413
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• 2000

The friction and wear behaviors of Magnetron Sputtered MoS$_2$films were investigated by using a pin on disk type tester which was designed and manufactured for this experiment. The experiment was conducted by using silicon nitride (Si$_3$N$_4$) as a pin material and Magnetron Sputtered MoS$_2$on bearing steel (STB2) as a disk material, under operating conditions that include different surface roughness (Polishing specimen, Grinding specimen)(2types), linear sliding velocities in the range of 22, 44, 66mm/sec (3types), normal loads vary from 9.8N, 19.6N, 29.4N(3types), corresponding to contact pressures of 1.9∼2.7GPa and atmospheric conditions of high vacuum( 1.3${\times}$10$\^$-4/Pa), medium vacuum( 1.3${\times}$10$\^$-l/Pa), ambient air(10$\^$5/Pa)(3types). We investigated fracture mechanism in magnetron sputtered MoS$_2$films with Magnetron Sputtering method in each experiment.

• Transactions on Electrical and Electronic Materials
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• 제2권1호
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• pp.12-15
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• 2001

Bi-2212 and Bi-2223 thin films are prepared by IBS(ion beam sputtering) technique. Three phases of Bi-2201, Bi-2212 and Bi-2223 appear as stable ones in spite of the conditions for thin film fabrication of Bi-2212 and Bi-2223 compositions, depending on substrate temperature (T $_{sub}$) and ozone pressure(PO$_3$). It is found out that these phases are limited within very narrow temperature.e.

• 한국자기학회지
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• 제10권5호
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• pp.232-236
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• 2000

Cr을 하지층으로 사용한 CoSm 박막은 고기록밀도 수평 자기기록 매체로 가능성이 커 이에 대한 관심이 집중되고 있다. 본 연구에서는 dc 마그네트론 스퍼터링법으로 제작한 CoSm 박막의 자기적 성질의 Ar 가스 스퍼터링 압력 의존성을 조사하였다. 특히 고기록밀도 자기기록 매체에서 magnetic switching volume V＊은 자기기록 매체에 기록된 정보의 열적 안정성, 자화반전 및 잡음을 이해하는데 중요한 자료가 된다. 따라서 본 연구에서는 동일 조건에서 제작한 하지층 Cr위에 스퍼터링 압력을 달리하여 자성층 CoSm을 성장시켜 switching volume의 스퍼터링 압력 의존성을 규명하도록 하였다. 연구 결과 switching volume은 스퍼터링 압력이 증가할수록 감소하며, 그 크기는 9.0-5.2$\times$$10^{-18}$ $cm^3$ 범위 내에 있었다. Switching volume V＊를 이용하여 계산한 switching 단위의 크기는 22 nm 보다 작으며, 이 크기는 고기록 밀도수평 자기기록매체의 열적 안정성에 대한 Sharrock 조건을 만족한다.

• 한국재료학회지
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• 제12권6호
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• pp.452-457
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• 2002

Titanium oxide films were prepared by RF reactive magnetron sputtering. The effect of sputtering conditions on structural and optical properties was investigated systemically as a function of sputtering pressure(5~20 mTorr) and $O_2/Ar$ flow ratio(0.08~0.4). The results of the X-ray diffraction showed that all films had only the anatase $TiO_2$ phase. At low sputtering pressure and $O_2/Ar$ flow ratio, the films had preferred orientations along [101] and [200] directions. As the sputtering pressure and $O_2/Ar$ flow ratio increased, the intensity of the 101 and 200 diffraction peaks decreased gradually. The microstructure of the sputtered films showed the fine grain size (20nm~50nm) and columnar microcrystals perpendicular to the substrate. With increasing the sputtering pressure and decreasing $O_2/Ar$ flow ratio, the sputtered films showed the more porous columnar structure. XPS analysis showed that stoichiometric $TiO_2$ films were deposited at 7 mTorr sputtering pressure and 0.2 $O_2/Ar$ flow ratio. The results of the X-ray diffraction showed that all films had only the anatase $TiO_2$ phase. Ellipsometeric analysis showed that the refractive index increased from 2.32 to 2.46 as the sputtering pressure decreased. The packing density calculated using the refractive index varied from 0.923 to 0.976, indicating that $TiO_2$films became denser as the sputtering pressure decreased.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1396-1397
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• 2006

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature haying an effect on the quality of the thin film was changed from $100[^{\circ}C]$ to $300[^{\circ}C]$ at intervals of $50[^{\circ}C]$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.354-355
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• 2007

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature having an effect on the quality of the thin film was changed from 100[$^{\circ}C$] to 300[$^{\circ}C$] at intervals of 50[$^{\circ}C$].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.143-143
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• 2009

In this paper, MgO thin films were deposited on Si(100) single crystal substrates by RF magnetron sputtering. The effects of RF power, chamber atmosphere, and substrate temperature on the characteristics of MgO thin films were already studied. Thus, we focused on the working pressure. The structural properties of the films changed dramatically with deposition conditions. Structural analyses carried out by X-ray diffraction (XRD). MgO films were obtained at the deposition conditions as follows:

• 한국전기전자재료학회논문지
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• 제14권1호
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• pp.34-42
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• 2001

The influences of substrate temperature were studied when fabricating KLN thin film on amorphous substrate using an rf-magnetron sputtering method. Investigating the vaporization temperature of the each element, the excess ratio of target and the optimum deposition conditions were effectively selected when thin filmizing a material which have elements with large difference fo vaporization temperature. In order to compensate K and Li which have lower vaporization temperatures than Nb, KLN target of composition excess with K of 60% and Li of 30% was used. KLN thin film fabricated on Corning 1737 glass substrate had single KLN phase above 58$0^{\circ}C$ of substrate temperature and crystallized to c-axis direction. The optimum conditions were rf power of 100W, process pressure of 150mTorr, and substrate temperature of $600^{\circ}C$.