Structural and Electrical Properties of $CuInSe_2$ Ternary Compound Thin Film

$CuInSe_2$ 박막의 구조적 전기적 특성

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature haying an effect on the quality of the thin film was changed from $100[^{\circ}C]$ to $300[^{\circ}C]$ at intervals of $50[^{\circ}C]$.