• Journal of Powder Materials
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• v.27 no.5
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• pp.406-413
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• 2020

Ti_0.5Al_0.5N/CrN nano-multilayers, which are known to exhibit excellent wear resistances, were prepared using the unbalanced magnetron sputter for various periods of 2-7 nm. Ti_0.5Al_0.5N and CrN comprised a cubic structure in a single layer with different lattice parameters; however, Ti_0.5Al_0.5N/CrN exhibited a cubic structure with the same lattice parameters that formed the superlattice in the nano-multilayers. The Ti_0.5Al_0.5/CrN multilayer with a period of 5.0 nm exceeded the hardness of the Ti_0.5Al_0.5N/CrN single layer, attaining a value of 36 GPa. According to the low-angle X-ray diffraction, the Ti_0.5Al_0.5N/CrN multilayer maintained its as-coated structure up to 700℃ and exhibited a hardness of 32 GPa. The thickness of the oxidation layer of the Ti_0.5Al_0.5N/CrN multilayered coating was less than 25% of that of the single layers. Thus, the Ti_0.5Al_0.5N/CrN multilayered coating was superior in terms of hardness and oxidation resistance as compared to its constituent single layers.

• Current Photovoltaic Research
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• v.3 no.3
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• pp.101-105
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• 2015

ZnO is gathering great interest for large square optoelectrical devices of flat panel display (FHD) and solar cell as a transparent conductive oxide (TCO). Herewith, Mg and IIIA (Al, In) co-doped ZnO films were prepared on SLG substrate using RF magnetron sputtering system. The effect of variation of atomic weight % of Mg and ZnO have been investigated. The atomic weight % Al and In are of 3% and kept constant throughout. The numbers of samples were prepared according to their different contents, which are $M_{3%}AZO_{94%}$, $M_{4%}AZO_{93%}-(MAZO)$ and $M_{3%}IZO_{94%}$, $M_{4%}IZO_{93%}-(MIZO)$ respectively. A RF power of 225 W and working pressure of 6 m Torr was used for the deposition at $300^{\circ}C$. All of the two thin film show good uniformity in field emission scanning electron microscopy image. $M_{3%}AZO_{94%}$ thin film shows overall better performance among the all. The film shows the best lowest resistivity, carrier concentration, mobility and Sheet resistance and is found to be are of $8.16{\times}10^{-4}{\Omega}cm$, $4.372{\times}10^{20}/cm^3$, $17.5cm^2/vs$ and $8.9{\Omega}/sq$ respectively. Also $M_{3%}AZO_{94%}$ thin film shows the relatively high optical band gap energy of 3.7 eV with high transmittance more than 80% in visible region required for the better solar cell performance.

• Current Photovoltaic Research
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• v.8 no.2
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• pp.45-49
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• 2020

Molybdenum (Mo) thin films are widely used as back contact in copper indium diselenide (CISe) solar cells. However, despite this, there are only few published studies on the properties of Mo and characteristics of CISe solar cells formed on such Mo substrates. In this studies, we investigated the properties of sputter deposited Mo bilayer, and fabricated non-vacuum CISe solar cells using bilayer Mo substrates. The changes in surface morphology and electrical resistivity were traced by varying the gas pressure during deposition of the bottom Mo layer. In porous surface structure, it was confirmed that the electrical resistivity of Mo bilayer was increased as the amount of oxygen bonded to the Mo atoms increased. The resulting solar cell characteristics vary as the bottom Mo layer deposition pressure, and the maximum solar cell efficiency was achieved when the bottom layer was deposited at 7 mTorr with a thickness of 100 nm and the top layer deposited at 3 mTorr with a thickness of 400 nm.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.3
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• pp.134-137
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• 2012

We have considered the effect of electron irradiation energy of 300, 600 and 900 eV on structural, electrical and optical properties of $In_2O_3$ films prepared with RF magnetron sputtering. In this study, the thin film crystallization, optical transmittance and sheet resistance are dependent on the electron's irradiation energy. The electron irradiated $In_2O_3$ films at 900 eV are grown as a hexagonal wurtzite phase. The sheet resistance decreases with a increase in electron irradiation energy and $In_2O_3$ film irradiated at 900 eV shows the lowest sheet resistance of $110{\Omega}/{\Box}$. The optical transmittance of $In_2O_3$ films in a visible wave length region also depends on the electron irradiation energy. The film that at 900 eV shows the higher figure of merit than another films prepared in this study.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.126-126
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• 2018

최근 차세대 디스플레이인 flexible 하고 transparent 한 디스플레이 개발이 진행 중 이며, 이러한 디스플레이가 개발 되기 위해 백 플레인으로 사용되는 Thin Film Transistor (TFT) 또한 차세대 디스플레이 못지 않게 연구가 진행 되고 있다. 기존의 무기물을 기반으로 하고 Rigid한 TFT는 현재 많은 곳에 적용이 되어 사람들이 사용 하고 있다. 하지만 이미 시장은 포화상태이며 차세대 디스플레이 컨셉인 flexible 하고 투명한 것과 맞지 않는다. 그래서 유연하며 투명한 특성을 가진 TFT에 대한 연구가 활발히 진행 되고 있으며 많은 성과를 이루었다. 이러한 소자를 이용하여 훗날 Electronic-skin(e-skin)이라 부르는 전자 피부를 활용하여 실시간 모니터링 할 수 있는 헬스 케어 분야 등에 활용 가치 또한 높다. 현재 유연하며 투명한 기판 및 물질 개발에 많은 연구 개발이 진행 되고 있다. 하지만 유연한 기판을 사용하여 TFT를 제작한 후 stress나 bending에 대한 내구성과 안정성, 신뢰성 등이 무기물을 기반으로 한 TFT에 비해 좋지 않은 실정이다. 따라서 유연하며 투명한 기판을 사용한 TFT에 대한 안정성, 신뢰성 등을 확보하여야 한다. 본 연구 에서는 유연한 기판을 사용하여 TFT를 제작 한 후, TFT특성과 안정성을 확보하는 것을 목표로 실험을 진행하였다. 우리는 Mo전극과 Parylene 기판을 사용하여 유연한 TFT소자를 탑 게이트 구조로 제작 하였고 Rigid한 Glass기판 위에 Floating Process를 진행하기 위해 PVA층을 코팅 후 그 위에 Parylene을 CVD로 증착 하고 IGZO를 Sputter를 사용해 증착했다. Parylene은 DI Water 70도에서 Floating 공정을 통해 Rigid 기판에서 탈착 시켰다. 유연한 기판 위에 TFT를 제작 후 bending에 대한 특성 변화 및 안정성에 대한 측정을 실시하였다. Bending에 대한 특성 변화는 우수한 결과가 나왔지만 안정성 측정 중 Negative Bias Stress(NBS) 상에서 비정상적인 On Current Drop 현상이 발생 되었다. Parylene과 Channel층 사이 interface roughness로 인해 charge trap이 되고 이로 인해 On Current Drop 이라는 현상으로 나타났다. 그래서 우리는 Parylene 기판과 Channel 층간의 surface roughness를 개선하기 위한 방법으로 UV Treatment를 사용하였고 시간을 다르게 하여 surface 개선을 진행했다. Treatment 시간을 증가 시킴에 따라 Surface roughness가 많이 좋아 졌으며, Surface를 개선하고자 비정상적인 On Current Drop 현상이 없어졌으며 위 실험으로 Polymer의 surface roughness에 따라 TFT에 대한 안정성에 대한 신뢰성이 확보 될 수 있는 것을 확인 하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.125-125
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• 2018

반도체 소자의 미새화에 따라 선폭이 10nm 이하로 줄어듦에 따라, 금속 배선의 저항이 급격하게 상승하고 있다. Cu는 낮은 저항과 높은 전도도를 가지고 있어 현재 배선물질로써 가장 많이 사용되고 있지만, 소자가 미세화됨에 따라 Cu를 미래의 배선물질로써 계속 사용하기에는 몇 가지 문제점이 제기되고 있다. Cu는 electron mean free path (EMFP)가 39 nm로 긴 특성을 가지기 때문에, 선폭이 줄어듦에 따라 surface 및 grain boundary scattering이 증가하여 저항이 급격하게 증가한다. 또한, technology node에 따른 소자의 operating temperature와 current density의 증가로 인해 Cu의 reliability가 감소하게 된다. 텅스텐은 EMFP가 19 nm로 짧은 특성을 가지고 있어, 소자의 크기가 줄어듦에 따라 Cu보다 낮은 저항 특성을 가질 수 있으며, 녹는점이 3695K로 1357K인 Cu보다 높으므로 배선물질로써 Cu를 대체할 가능성이 있다. 본 연구에서는 Inductively Coupled Plasma (ICP) assisted magnetron sputtering을 통해 매우 얇은 텅스텐 박막을 증착하여 저항을 낮추고자 하였다. 고밀도 플라즈마의 방전을 위해, internal-type coil antenna를 사용하였으며 텅스텐 박막의 증착을 위해 DC sputter system이 사용되었다. 높은 에너지를 가진 텅스텐 이온을 이용하여 낮은 온도에서 고품위 박막을 증착할 수 있었으며, dense한 구조의 박막 성장이 가능하였다. ICP assisted를 이용하여 증착했을 때와, 그렇지 않을 때를 비교하여 ICP 조건에 따라서 박막의 저항이 감소함을 확인할 수 있었을 뿐만 아니라 최대 약 65% 감소함을 확인할 수 있었다. XRD를 이용하여 ICP power를 인가했을 때, 높은 저항을 갖는 A-15 구조를 가진 ${\beta}$ peak의 감소와 낮은 저항을 갖는 BCC 구조를 가진 ${\alpha}$ peak의 증가를 상온과 673K에서 증착한 박막 모두에서 확인하였으며, 이를 통해 ICP power가 저항 감소에 영향을 미친다는 것을 확인하였다. 또한, 두 온도 조건에서 grain size를 계산하여 ICP power를 인가함에 따라 두 조건 모두 grain size가 증가하였음을 조사하였다. 또한, XPS 분석을 통해 ICP power를 인가하였을 때 박막의 저항에 많은 영향을 끼치는 O peak이 감소하는 것을 통해 ICP assisted의 효과를 확인하였다. 이를 통해, ICP assisted magnetron sputtering을 통해 텅스텐 박막을 증착함으로써 차세대 배선물질로써 텅스텐의 가능성을 확인할 수 있었다.

• Analytical Science and Technology
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• v.5 no.2
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• pp.199-202
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• 1992

Ti-silicide was formed by using metal-Ti target and composite target on the silicon substrate that $BF_2$ were introduced into. Implant energies of $BF_2$ were 50keV and 90keV. The behavior of boron was investigated by SIMS. The redistribution of boron occurred during the formation of Ti-silicide by metal-Ti target and the sample implanted at the energy of 50keV showed severe out-diffusion. In the case that Ti-silicide was formed by composite target, there was little redistribution of boron.

• Applied Microscopy
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• v.29 no.3
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• pp.265-274
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• 1999

The microstructure of Cu thin films in various deposition conditions was characterized. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50 and 100 mtorr. The microstructure was characterized using conventional and high resolution SEM and TEM. As sputtering pressure increases, open boundaries are observed more frequently. The Cu film deposited at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As the film grows thicker, open boundaries are wider and the density of open boundaries are higher. The comparison between SEM and TEM show that the small features shown in high resolution SEM are grains. High resolution SEM is very effective to characterize the microstructure of the thin films. One column in the films deposited at 50 and 100 mtorr consists of several grains, which are smaller than those deposited at 5 mtorr.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.5
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• pp.230-234
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• 2014

IGZO/Ag bi-layered films were deposited on glass substrate at room temperature with radio frequency and direct current magnetron sputtering, respectively to consider the effect of Ag buffer layer on the electrical, optical and structural properties. For all deposition, while the thickness of Ag buffer layer was varied as 10, 15, and 20 nm, The thickness of IGZO films were kept at 100 nm, In a comparison of figure of merit, IGZO films with 15 nm thick Ag buffer layer show the higher figure of merit ($1.1{\times}10^{-2}{\Omega}^{-1}$) than that of the IGZO single layer films ($3.7{\times}10^{-4}{\Omega}^{-1}$). From the observed results, it is supposed that the IGZO 100 nm/Ag 15 nm bi-layered films may be an alternative candidate for transparent electrode in a transparent thin film transistor device.

• Journal of Surface Science and Engineering
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• v.40 no.3
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• pp.117-124
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• 2007

The ITO films were deposited on glass substrates by RF-superimposed dc reactive magnetron sputtering and were annealed in $N_2$ vacuum furnace with temperatures in the range of $403K{\sim}573K$ for 30 minutes. Electrical, optical and structural properties of ITO films were examined with varying annealing temperatures from 403 K to 573 K. The resistivity of as-deposited ITO films was $5.4{\times}10^{-4}{\Omega}cm$ at the sputter conditions of applied RF/DC power of 200/200 W, $O_{2}$ flow of 0.2 seem and Ar flow of 0.2 seem. As a result of annealing in the temperature range of $403K{\sim}573K$, the crystallization occurred at 423 K that is lower than the crystallization temperature caused by a conventional sputtering method. And the resistivity decreased from $5.4{\times}10^{-4}{\Omega}cm\;to\;2.3{\times}10^{-4}{\Omega}cm$, the carrier concentration and mobility of ITO films increased from $4.9{\times}10^{20}/cm^3\;to\;6.4{\times}10^{20}/cm^3$, from $20.4cm^2/Vsec\;to\;41.0cm^2/Vsec$, respectively. The transmittance of ITO films in visible became higher than 90% when annealed in the temperature range of $423K{\sim}573K$. High quality ITO thin films made by RF-superimposed dc reactive magnetron sputtering and annealing in $N_2$ vacuum furnace will be applied to transparent conductive oxides of the advanced flat panel display.