• Title/Summary/Keyword: Spreading resistance

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Evaluation of Spreading Thermal Resistance in Symmetrical Four-Heat Generating Electronic Components (4개 대칭배열 발열 전자소자에서의 확산 열저항 산정)

  • Kim Yun-Ho;Kim Seo-Young;Rhee Gwang-Hoon
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.8
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    • pp.664-671
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    • 2006
  • We propose the correlation to predict the spreading thermal resistance on a plate with symmetrical four heat sources. The correlation transforms four heat sources to a single equivalent heat source and then the spreading thermal resistance can be obtained with the existing equation for a single heat source. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, the plate thermal conductivity and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.

Effect of Frictional Resistance Force on a Liquid Pool Spreading Model with Continuous and Instantaneous Release (마찰저항이 연속누출과 순간누출을 가지는 액체 풀의 확산에 미치는 영향에 대한 해석적 연구)

  • Kim, Tae Hoon;Choi, Byung-Il;Kim, Myungbae;Do, Kyu Hyung;Han, Yong-Shik
    • Transactions of the Korean hydrogen and new energy society
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    • v.24 no.6
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    • pp.487-494
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    • 2013
  • In this study, solutions for a liquid pool spreading model with continuous and instantaneous release are discussed based on the model used in the FERC's report. The effects of the release time on the liquid pool volume and radius are investigated for the continuous release. For the continuous release with the frictional resistance force in the liquid pool spreading model, the vaporization time decreases as the release time increases. On the other hand, for the continuous release without the frictional resistance force in the liquid pool spreading model, the vaporization time increases as the release time increases. These phenomena are deeply related to the pool radius. In addition, the effects of the initial pool radius for the instantaneous release in the liquid pool spreading model are discussed. For the case with the frictional resistance force in the liquid pool spreading model, as reducing release time in the model with the frictional resistance force for the continuous release, the solution for a continuous release approaches to that for an instantaneous release. On the contrary to this, the pool volume and radius for the instantaneous release without the frictional resistance force are totally different from those for the continuous release without the frictional resistance force.

Modeling of Parasitic Source/Drain Resistance in FinFET Considering 3D Current Flow (3차원적 전류 흐름을 고려한 FinFET의 기생 Source/Drain 저항 모델링)

  • An, TaeYoon;Kwon, Kee-Won;Kim, SoYoung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.10
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    • pp.67-75
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    • 2013
  • In this paper, an analytical model is presented for the source/drain parasitic resistance of FinFET. The parasitic resistance is a important part of a total resistance in FinFET because of current flow through the narrow fin. The model incorporates the contribution of contact and spreading resistances considering three-dimensional current flow. The contact resistance is modeled taking into account the current flow and parallel connection of dividing parts. The spreading resistance is modeled by difference between wide and narrow and using integral. We show excellent agreement between our model and simulation which is conducted by Raphael, 3D numerical field solver. It is possible to improve the accuracy of compact model such as BSIM-CMG using the proposed model.

Resolution in Carrier Profiling Semiconductors by Scanning Spreading Resistance Microscopy and Scanning Frequency Comb Microscopy

  • Hagmann, Mark J.;Mousa, Marwan S.;Yarotski, Dmitry A.
    • Applied Microscopy
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    • v.47 no.3
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    • pp.95-100
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    • 2017
  • High resolution measurements of the carrier profile in semiconductor devices is required as the semiconductor industry progresses from the 10-nm lithography node to 7-nm and beyond. We examine the factors which determine the resolution of the present method of scanning spreading resistance microscopy as well as such factors for the newer method of scanning frequency comb microscopy that is now under development. Also, for the first time, we consider the sensitivity of both methods to the location of heterogeneities in the semiconductor. In addition, mesoscopic effects on these measurements are considered for the first time. Two simple analytical models are extended to study the sensitivity to heterogeneities as well as mesoscopic effects.

Simulating the Response of a 10-Storey Steel-Framed Building under Spreading Multi-Compartment Fires

  • Jiang, Jian;Zhang, Chao
    • International Journal of High-Rise Buildings
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    • v.7 no.4
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    • pp.389-396
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    • 2018
  • This paper presents a numerical investigation on the structural response of a multi-story building subjected to spreading multi-compartment fires. A recently proposed simple fire model has been used to simulate two spreading multi-compartment fire scenarios in a 10-story steel-framed office building. By assuming simple temperature rising and distribution profiles in the fire exposed structural components (steel beams, steel column and concrete slabs), finite element simulations using a three-dimensional structural model has been carried out to study the failure behavior of the whole structure in two multi-compartment fire conditions and also in a standard fire condition. The structure survived the standard fire but failed in the multi-compartment fire. Whilst more accurate fire models and heat transfer models are needed to better predict the behaviors of structures in realistic fires, the current study based on very simple models has demonstrated the importance and necessity of considering spreadingmulti-compartment fires in fire resistance design of multi-story buildings.

Resistance to Chloride Attack of Normal Strength Concrete Depending on Spreading of Different Types of Oils (유지종류변화 및 표면도포에 따른 보통강도 콘크리트의 염해저항성)

  • Baek, Cheol;Lee, Jae-Jin;Hwang, Chan-Woo;Lee, Jun-Seok;Lee, Dong-Yun;Han, Cheon-Goo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2017.11a
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    • pp.163-164
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    • 2017
  • The paper is to investigate the effect of spreading of various kinds of oils on resistance to chloride attack of the normal strength concrete. Resistance to chloride attack was measured for 32 weeks and six different kinds of oils ere used. Test results indicated that resistance to chloride attack was improved in order of DSP, BD, ERBD and ERCO compared with that of Plain mixture due to filling effect of capillary pore by the use of oil.

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Manufacturing of High Water-Resistant Particleboard by Combining Use of Urea Resin and EMDI Resin (요소수지와 EMDI수지의 복합이용에 의한 고내수정 파티클보드의 제조)

  • Park, Jong-Young
    • Journal of the Korean Wood Science and Technology
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    • v.26 no.1
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    • pp.97-105
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    • 1998
  • This study examined the combined using effects of urea-formaldehyde (UF) resin and emulsifiable methylene diphyenyl diisocyanate (EMDI) resin to overcome performance limit of three-layer particleboards commonly made by UF resin. Two adhesive adding methods were applied with three types of resin combination system to each layer of particleboards. The one was simultaneously spreading method with emulsified compound resin (UF and EMDI) while the other was separately spreading method with unemulsified EMDI resin after UF resin spreading. The performance of particleboards bonded with 2% EMDI resin to the inner layers(IL) were similar to that of controls bonded with 8% UF resin. In the case of the emulsified compound resin application to the all layers of particleboards, there were marked reinforcing effects of EMDI resin, although a small amount of EMDI resin was mixed with UF resin. Especially bending MOR after 24 hours cold water-immersion and thickness swelling after 2 hours hot water-immersion of compound resin-bonded particleboards were remarkably different from those of pure UF resin-bonded particleboards. It was found that separately spreading method with unemulsified EMDI resin was more effective than simultaneously spreading method with emulsified compound resin to sustain the internal bond strength of particleboards after 24 hours cold water-immersion. In the resin combination systems to outer layers/inner layers of particleboards, water resistance and strength properties were superior in order of UF+EMDI/UF+EMDI > UF/UF+EMDI > UF/UF. And water resistance of particleboards was greatly dependent upon EMDI resin level in any adhesive adding method.

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Design and Optimization of 4.5 kV 4H-SiC MOSFET with Current Spreading Layer (Current Spreading Layer를 도입한 4.5 kV 4H-SiC MOSFET의 설계 및 최적화)

  • Young-Hun, Cho;Hyung-Jin, Lee;Hee-Jae, Lee;Geon-Hee, Lee;Sang-Mo, Koo
    • Journal of IKEEE
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    • v.26 no.4
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    • pp.728-735
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    • 2022
  • In this work, we investigated a high-voltage (~4.5 kV) 4H-SiC power DMOSFET with modifications of current spreading layer (CSL), which was introduced below the p-well region for low on-resistance. These include the following: 1) a thickness of CSL (TCSL) from 0 um to 0.9 um; 2) a doping concentration of CSL (NCSL) from 1×1016 cm-3 to 5×1016 cm-3. The design is optimized using TCAD 2D-simulation, and we found that CSL helps to reduce specific on-resistance but also breakdown voltage. The resulting structures exhibit a specific on-resistance (Ron,sp) of 59.61 mΩ·cm2, a breakdown voltage (VB) of 5 kV, and a Baliga's Figure of Merit (BFOM) of 0.43 GW/cm2.

Electrical Characterization of Electronic Materials Using FIB-assisted Nanomanipulators

  • Roh, Jae-Hong;You, Yil-Hwan;Ahn, Jae-Pyeong;Hwang, Jinha
    • Applied Microscopy
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    • v.42 no.4
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    • pp.223-227
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    • 2012
  • Focused Ion Beam (FIB) systems have incorporated versatile nanomanipulators with inherent sophisticated machining capability to characterize the electrical properties of highly miniature components of electronic devices. Carbon fibers were chosen as a model system to test the applicability of nanomanipulators to microscale electronic materials, with special emphasis on the direct current current-voltage characterizations in terms of electrode configuration. The presence of contact resistance affects the electrical characterization. This resistance originates from either i) the so-called "spreading resistance" due to the geometrical constriction near the electrode - material interface or ii) resistive surface layers. An appropriate electrode strategy is proposed herein for the use of FIB-based manipulators.

Pullout Parameter According to the Length of Spreading of Extensible Geogrid Reinforcement (신장성 지오그리드 보강재의 포설길이에 따른 인발정수)

  • Park, Jong-Beom;Ju, Jae-Woo;Na, Hyun-Ho
    • Journal of the Korean Geosynthetics Society
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    • v.16 no.4
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    • pp.241-249
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    • 2017
  • In a reinforced soil structure, the interaction between soil and an reinforcement occurs due to the frictional resistance on the contact surface between them or the pullout resistance of the reinforcement. Generally, a pullout test is conducted to measure pullout parameters of extensible geogrids. The factors affecting the pullout parameters in a pullout test include a density of backfill, shape of reinforcements, overburden pressure, length of spread reinforcements, and so on. The purpose of this study is to suggest a length of the spreading of an extensible reinforcement that can be used in estimating suitable pullout parameters of a pullout test. To this end, a pullout test was carried out. For the test, the length of spreading of an extensible reinforcement was set as 32 cm, 52 cm, 72 cm, and 100 cm, and effects of the lengths on pullout parameters were analyzed. As a result of the pullout test, it was confirmed that the frictional resistance between the soil and the reinforcement increases with the increase of the length of the reinforcement.