• 문화기술의 융합
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• 제6권2호
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• pp.467-472
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• 2020

일반적인 보통 등급의 지반(ground) 상 구조물의 안정성 확보를 위한 설계입력정수(input-parameters) 도출방법들은 보편적으로 잘 알려져 있다. 연구지역과 같은 습곡된(folded) 변성암(metamorphic rocks) 지반은 엽리가(foliation) 촘촘히 발달해 있고, 엽리에 평행한 소규모 단층들(faults)이 분포하고 있어 설계입력정수 도출을 위한 특별한 조사방법 및 시험, 등이 요구된다. 수 mm 간격의 엽리가 발달한 변성암 지반은 엽리면 직접전단강도시험(direct shear test), 엽리의 배향(strike/dip)과 맵핑(mapping), 엽리의 지하 연속성 파악을 위한 시추조사, 변성암반의 암반분류(rock mass rating), 등이 필요하다. 특정 엽리면을 따라 발달한 소규모의 엽리평행단층(foliation-parallel faults)이 다수 발달한 지반은 선구조선 분석, 단층 추적을 위한 지표지질맵핑, 단층면 직접전단강도시험, 등이 필수적이다. 습곡지반은 지질구조구(structural domain) 분석, 불연속면의 평사투영(stereonet)해석, 습곡축을 따른 전기비저항탐사, 등의 추가조사로 설계입력정수 도출이 합리적이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.450-450
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• 2006

Organic light-emitting diodes (OLED) as pixels for flat panel displays are being actively pursued because of their relatively simple structure, high brightness, and self-emitting nature [1, 2]. The top-emitting diode structure is preferred because of their geometrical advantage allowing high pixel resolution [3]. To enhance the performance of TOLEDs, it is important to deposit transparent top cathode films, such as transparent conducting oxides (TCOs), which have high transparency as well as low resistance. In this work, we report on investigation of the characteristics of an indium tin oxide (ITO) cathode electrode, which was deposited on organic films by using a radio-frequency magnetron sputtering method, for use in top-emitting organic light emitting diodes (TOLED). The cathode electrode composed of a very thin layer of Mg-Ag and an overlaying ITO film. The Mg-Ag reduces the contact resistivity and plasma damage to the underlying organic layer during the ITO sputtering process. Transfer length method (TLM) patterns were defined by the standard shadow mask for measuring specific contact resistances. The spacing between the TLM pads varied from 30 to $75\;{\mu}m$. The electrical properties of ITO as a function of the deposition and annealing conditions were investigated. The surface roughness as a function of the plasma conditions was determined by Atomic Force Microscopes (AFM).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.292.2-292.2
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• 2013

Graphene, a two-dimensional graphite material consisting of sp2-hybridized carbons. The properties of graphene such as extremely high carrier mobility, high thermal conductivity, low resistivity, large specific make it a promising materail of divices and material. Typically, poly (methyl methacrylate) (PMMA) is used when graphene transfer to other substrates. To remove PMMA on graphene, people used to dip the graphene into the acetone. However, it is known that the remove of PMMA on the graphene is difficult to completely using the acetone. Therefore, to remove the PMMA on the graphene surface, many research groups have employed various methods such as the thermal treatment, photothermal method, and other solvent. Nevertheless, a part of PMMA still remain on graphene surface. Usually, to observe the residual PMMA on graphene surface, topography of graphene surface scanned by atomic force microscopy is used. However, in that case, we can not distinguish PMMA and other particles. In this study, to confirm the residual PMMA on graphene surface, we employed novel measurement technique which is available to distinguish PMMA and other particles by means of photothermal effect.

• 대한금속재료학회지
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• 제50권3호
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• pp.237-242
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• 2012

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.

• 대한금속재료학회지
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• 제49권11호
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• pp.845-852
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• 2011

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processing conditions. The compact/target(?) has a diameter of ${\Phi}150{\times}6.35mm$. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FE-SEM. A Ti thin-film fabricated on a $Si/SiO_2$ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below $40{\mu}m$, respectively. The specific resistivity of the optimized Ti target was $8.63{\times}10^{-6}{\Omega}{\cdot}cm$.

• 지구물리와물리탐사
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• 제19권4호
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• pp.200-211
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• 2016

횡단 전위 배열(cross potential array)과 동일열 전위배열(direct potential array) 자료를 뒷받침하여 다양한 수변 구조물의 누수 경로 예측을 가능하게 하는 배열을 제시하고 이를 D-Lux array 라고 명명하였다. 또한 D-Lux array 자료를 색으로 가시화한 하나의 행렬로 정리하여 D-Lux view라고 제시하고 D-Lux view에서 관찰되는 저 전위차 이상대의 위치로 누수 구역의 위치를 해석하였다. D-Lux view의 보다 직관적인 해석을 위해서 D-Lux array 자료와 동일열 전위 배열 자료를 함께 사용하여 각 지점들 사이의 전위차 자료를 각 지점의 전위값으로 역산하고 이를 이용하여 등전위 분포도를 작성하였다. 등전위 분포도는 그래프나 D-Lux view에서 알 수 없었던 누수의 유입구, 유출구 뿐만 아니라 경로까지 예측 가능하게 하였다. 수조 실험과 수치 해석으로 예비 탐사를 실시한 후 현장 탐사로 콘크리트 보와 필 댐에 대한 적용이 이루어졌다. 그 결과, 콘크리트 보와 필 댐에 대해 누수 경로 탐지가 가능함을 확인하였다.

• Metals and materials international
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• 제24권6호
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• pp.1256-1261
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• 2018

Both thermoplastic formability and electrical conductivity of Al-Ni-Y metallic glass with 12 different compositions have been investigated in the present study with an aim to apply as a functional material, i.e. as a binder of Ag powders in Ag paste for silicon solar cell. The thermoplastic formability is basically influenced by thermal stability and fragility of supercooled liquid which can be reflected by the temperature range for the supercooled liquid region (${\Delta}T_x$) and the difference in specific heat between the frozen glass state and the supercooled liquid state (${\Delta}C_p$). The measured ${\Delta}T_x$ and ${\Delta}C_p$ values show a strong composition dependence. However, the composition showing the highest ${\Delta}T_x$ and ${\Delta}C_p$ does not correspond to the composition with the highest amount of Ni and Y. It is considered that higher ${\Delta}T_x$ and ${\Delta}C_p$ may be related to enhancement of icosahedral SRO near $T_g$ during cooling. On the other hand, electrical resistivity varies with the change of Al contents as well as with the change of the volume fraction of each phase after crystallization. The composition range with the optimum combination of thermoplastic formability and electrical conductivity in Al-Ni-Y system located inside the composition triangle whose vertices compositions are $Al_{87}Ni_3Y_{10}$, $Al_{85}Ni_5Y_{10}$, and $Al_{86}Ni_5Y_9$.

• 한국초전도ㆍ저온공학회논문지
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• 제9권1호
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• pp.9-13
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• 2007

Coated conductor(CC) is recently in actively progress for the research and development, and its can be used various stabilizer lot the specific requirements for each application. Among various superconducting applications, coated conductor applied to superconducting fault current limiters(SFCLS) bypasses fault current to its stabilizer, where the surge is abruptly reduced ; thus, stainless steel, which has large resistivity can be a suitable stabilizer for SFCLS. Despite high n-value of the YBCO, CC stabilized with stainless steel did not effectively limit the first peak fault current. In the short circuit test results of AMSC's 344S, a half period delay was observed between the fault and the generation of resistance(60Hz). In this paper, we performed short-circuit experiments with stacked and unstacked CC and compared the test results to analyze effective fault current limiting characteristics. we compared time of the generated resistance as the fault current limiting characteristics and made the samples one is the stacked CC and the other is unstacked CC. These samples were used equal numbers of pieces of CC. In addition, comparison and analysis was made for the stacked structure by measuring fault current limiting characteristics with respect to thermal insulation by impregnating with epoxy resin.

• 한국재료학회지
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• 제33권2호
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• pp.63-70
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• 2023

In this study, crystallization was effectively suppressed in Al-based metallic glasses (Al-MGs) during pulverization by cryo-milling by applying an extremely low processing temperature and using a surfactant. Before Al-MGs can be used as an additive in Ag paste for solar cells, the particle sizes of the Al-MGs must be reduced by milling. However, during the ball milling process crystallization of the Al-MG is a problem. Once the Al-MG is crystallized, they no longer exhibit glass-like behavior, such as thermoplastic deformation, which is critical to decrease the electrical resistance of the Ag electrode. The main reason for crystallization during the ball milling process is the heat generated by collisions between the particles and the balls, or between the particles. Once the heat reaches the crystallization temperature of the Al-MGs, they start crystallization. Another reason for the crystallization is agglomeration of the particles. If the initially fed particles become severely agglomerated, they coalesce instead of being pulverized during the milling. The coalesced particles experience more collisions and finally crystallize. In this study, the heat generated during milling was suppressed by using cryo-milling with liquid-nitrogen, which was regularly fed into the milling jar. Also, the MG powders were dispersed using a surfactant before milling, so that the problem of agglomeration was resolved. Cryo-milling with the surfactant led to D50 = 10 um after 6 h milling, and we finally achieved a specific contact resistance of 0.22 mΩcm² and electrical resistivity of 2.81 μΩcm using the milled MG particles.

• 마이크로전자및패키징학회지
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• 제27권4호
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• pp.25-37
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• 2020

본 연구에서는 그래핀 소재의 전기전도성 및 자기적 특성을 향상시키기 위해 산화그래핀 표면상의 산소를 포함한 기능기와 열처리 환원공정을 이용하여 환원그래핀과 금속소재를 하리브리드화 하였다. 산화 그래핀 표면의 -OH, -COOH 등의 산소 포함 기능기들을 열처리 환원시킴과 동시에 금속이온을 기능기와의 이온교환법에 의해 치환 합성하는 연구를 진행하였다. 하이브리드 소재 합성에 사용된 금속은 Fe, Ag, Ni, Zn, Fe/Ag이며 SEM, TEM 및 EDS를 통해 환원 그래핀 표면 위에 균일한 크기의 금속 입자가 비교적 구형 잘 분산되었음을 확인하였다. 그래핀 표면상의 금속입자들은 모두 산화물 형태의 구조를 가지고 있었다. 하이브리드 소재의 전기적 특성을 확인하기 위해 rGO-metal hybrid 시료를 PET film에 dip-coating 방법으로 후막 필름을 형성시킨 후 면저항을 측정하였고, SEM을 통해 시편의 두께를 측정하여 비저항을 계산한 결과, 비저항의 범위는 2.14×10-5 ~ 3.5×10-3 ohm/cm범위에 있음을 확인하였다.