• The Journal of Korean Academy of Prosthodontics
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• v.22 no.1
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• pp.123-132
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• 1984

To evaluate the microstructure of various combination clasp joint in removable partial denture, the auther selected framework alloys (Type IV gold alloy, Dentaurium, Ticonium 100) and wrought wires (gold alloy, Ticonium) for this study. Twelve series of combination joints were made by investment soldering technic and wrought wire embedded casting technic. All specimens were cut cross-sectionally and longitudinally, then examined with metallurgical microscope. The results were as follows; Some diffusion was observed in the properly constructed combination clasp joints. In soldered joints, empolying precious alloys were more favorable than non-precious alloys. In castion joints, assemblage of same alloy between framework and wrought wire was superior to other groups. Some impurities were observed in both joints by technical problems.

• The Journal of Advanced Prosthodontics
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• v.4 no.2
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• pp.89-92
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• 2012

PURPOSE. Adequate passive-fitting of one-piece cast 3-element implant-supported frameworks is hard to achieve. This short communication aims to present an alternative method for section of one-piece cast frameworks and for casting implant-supported frameworks. MATERIALS AND METHODS. Three-unit implant-supported nickel-chromium (Ni-Cr) frameworks were tested for vertical misfit (n = 6). The frameworks were cast as one-piece (Group A) and later transversally sectioned through a diagonal axis (Group B) and compared to frameworks that were cast diagonally separated (Group C). All separated frameworks were laser welded. Only one side of the frameworks was screwed. RESULTS. The results on the tightened side were significantly lower in Group C ($6.43{\pm}3.24{\mu}m$) when compared to Groups A ($16.50{\pm}7.55{\mu}m$) and B ($16.27{\pm}1.71{\mu}m$) ($P$ <.05). On the opposite side, the diagonal section of the one-piece castings for laser welding showed significant improvement in the levels of misfit of the frameworks (Group A, $58.66{\pm}14.30{\mu}m$; Group B, $39.48{\pm}12.03{\mu}m$; Group C, $23.13{\pm}8.24{\mu}m$) ($P$ <.05). CONCLUSION. Casting diagonally sectioned frameworks lowers the misfit levels. Lower misfit levels for the frameworks can be achieved by diagonally sectioning one-piece frameworks.

• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Conservation Science in Museum
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• v.21
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• pp.17-28
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• 2019

The term jinjuseon(眞珠扇), meaning literally a pearl fan, refers to a fan decorated with precious stones for use in royal wedding ceremonies. This study examined a jinjuseon housed in the National Palace Museum of Korea (NPMK) which currently lacks jeweled ornaments. In order to determine whether pearls or other gemstone settings originally ornamented the fan,the surface and composition of the gray materials remaining on the washers were investigated and the fan was compared with other artifacts decorated using similar techniques. The analysis revealed that the gray materials visible around the round rims of the washers contain tin-lead alloys. The traces of folded nails suggest that soldering was not applied. The remains of the infill observed in other artifacts with bezel settings indicate that this jinjuseon in the NPMK collection was produced using abezel setting technique wherein pearls or other gemstones were affixed by filling cylindrical bezels with tin-lead alloys.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.5
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• pp.615-622
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• 2015

As the development of high efficiency and high flux density LEDs, the trend of illumination lamp industry transfers from conventional-lamps to the LED-lamps. For energy efficiencies, LED lamps are superior to the conventional lamps, but they have heat problems. Especially, the heat problems are severe for the high luminance lamps. They degrade the soldering point of the metal PCB, and shorten the life cycle of LEDs. So, the solution of the heat sinking is very important to develop high luminance LED lamps. This study suggested a new method to solve the heat problems for high luminance LED lamps, and developed a LED lamp which has 1200W power. In this study, a water jacket is installed to the LED lamp, and the cooing water is circulated by a water pump.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.554-560
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• 2013

This study proposes an structure that fixes the shielding device to two parts of the board by its two arranged clips. Said structure evenly distributes its loading/unloading load of the board and maintains the flatness of soldering area of the board. The structure of this study comprises a base part fixed to a printed circuit board and a clip part fixing a side wall of a shield can to the board, wherein the clip part is constituted with two clips fixable to two part of the shield can. Also, the structure of this study comprises a dented groove in order to easily solder the base part of clips and the printed circuit board. A mechanism is established and a design parameter was determined by a structure analysis and a vibration mode analysis. A single purpose machine for the production of the product was developed, the final workpiece was produced and the measuring-data and the computered-data was compared and reviewed.

• Tribology and Lubricants
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• v.30 no.3
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• pp.183-188
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• 2014

In this paper, we present our analysis of tribological failure examples for an anti-lock brake system(ABS) in a car. The study range of this paper is to improve the quality of ABS system by analyzing with sensor, computer, actuator and oil lines. In the first example, the brake leak from hydraulic supply line in a caliper on the rear left side of the ABS hydraulic modulator. This produces the sponge phenomenon, where the car does not brake even when the driver operates the brake pedal. The hydraulic unit operating ABS is actuator that play role regulating drive condition according with the oil pressure supplied with wheel of a car. In the second example, the service man does not completely tighten the fixed bolt after repairing the car. This causes the ABS warning lamp to light up as the ABS wheel speed sensor cannot detect whether the ABS has been activated. In the third example, the ABS electronic control unit is separated from the soldered part of the inner circuit board. Consequently, the ABS fails in control because the ABS motor pump receives no-signal for the hydraulic unit. The wheel speed sensor has to large durability because of giving signal of acting condition to computer by detected the acceleration and deceleration of wheel of a car. In the fourth example, the ABS warning lamp lights up of when cracks propagate in the circuit board soldering part. The circuit of this computer is very important part for input and output the operating signal of system. Such failures can aggravate the durability of the ABS. Thus, the ABS needs to be optimized to eliminate malfunction phenomenon.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.449-449
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• 2013

최근 반도체 소자의 집적회로는 점점 복잡해지고 있는 반면, 소자의 크기는 작아지고 있으며 그로 인해 패드의 크기가 작아지고 패드사이의 간격 또한 협소해지고 있다. 따라서 웨이퍼 단계에서 제조된 집적회로의 불량여부를 판단하기위한 검사 장비인 프로브카드(Probe Card)의 높은 집적도가 요구되고 있다. 하지만 기존의 MEMS 공법으로 제작되는 프로브 빔은 복잡한 제조 공정과 높은 생산비용, 낮은 집적도의 문제점을 가지고 있다. 본 연구에서는 이러한 문제점을 해결하기 위하여 간단한 제조 공정과 낮은 생산비용, 높은 집적도를 가지는 프로브 빔을 개발하기 위하여 절연절단 방식으로 BeCu (Beryllium-Copper) 프로브 빔을 제작하였다. 낮은 소비 전력으로 우수한 프로브 빔 어레이를 제작하기 위해서 가장 고려해야할 대상은 프로브 빔의 재료와 구조(형상)이다. 절연전단 방식으로 프로브 빔을 형성할 때 요구되는 Fusing current는 프로브 빔의 구조(형상)에 크게 영향을 받는다. 낮은 Fusing current는 소비 전력을 줄여주고, 절연절단으로 형성되는 프로브 빔의 단면(끝)을 날카롭게 하여 프로브 빔과 집적회로의 패드 간의 접촉 저항을 감소시킨다. 프로브 빔의 제작은 BeCu 박판을 빔 형태로 식각하여 제작하였으며, 실리콘 비아 홀(Via hole) 구조의 기판위에 정렬하여 soldering 공정을 통해 실리콘 기판과 BeCu 박판을 접합시켰다. 접합된 프로브 빔의 끝부분을 들어 올린 상태로 전류를 인가하여 stress free 상태로 만들어 내부 응력을 제거하였으며, BeCu 박판에 fusing current를 인가하여 BeCu 박판 프레임으로부터 제거를 하였다. 제작된 프로브 빔의 길이는 1.7 mm, 폭은 $50{\mu}m$, 두께는 $15{\mu}m$, 절단부의 단면적은 1$50{\mu}m^2$로 제작되었다. 그리고 프로브 빔의 절단부의 길이는 $50{\mu}m$ 부터 $90{\mu}m$까지 $10{\mu}m$ 증가시켜 제작되었다. 이후에 절연절단 공정에 요구되는 Fusing current를 측정하였고, 절연절단 후의 절단면의 형상을 SEM (Scanning Electron Microscope)장비를 통하여 확인하였다. 절단부의 길이가 $50{\mu}m$일 때 5.98A의 fusing current를 얻었으며, 절연절단 후 절단부 상태 또한 가장 우수했다. 본 연구에서 제안된 프로브 빔 제작 방법은 프로브카드 및 테스트 소켓(Test socket) 생산에 응용이 가능하리라 기대한다.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.3
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• pp.961-966
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• 2012

The concern about vacuum glass is enhanced as society gets greener and becomes more concerned about energy savings due to the rising cost of oil. The glass edge sealing process needs the high reliability among the main process for the vacuum glass development in order to maintain between the two glass by the vacuum. In this paper, the process of the edge sealing was performed by using the hydrogen mixture gas which is the high density heat source unlike the traditional method glass edge sealing by using the frit as the soldering process. The ambient temperature in the electric furnace was set in the edge sealing to prevents the thermal impact and transformation of the glasses and the temperature distribution uniformity was measured. The parameter of the edge sealing was set through the basic test and the mathematical relation with the area of the glass edge parts according to the parameter was drawn using the multiple regression analysis method.