• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.55-58
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• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2006년도 학술발표대회 논문집
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• pp.3-19
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• 2006

The Status quo of the reliability in China is described in this paper, a reliability surge is now spreading in China, covering the fields such as hardware, software, machinery and electronics. The reliability work in China was firstly conducted by the CEPREI Lab as far as early in the 1950s, and the reliability engineering in China has developed from the reliability of electronic products to that of machinery and non-electronic products, from hardware reliability to software reliability, from the attention to the reliability statistical test to emphasis on the reliability engineering test. Concern of Chinese companies about the reliability is the complete import of reliability engineering, the reliability testing, the software reliability and the reliability of lead-free soldering. Demonstration of reliability cases is given.

• 한국태양에너지학회 논문집
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• 제23권2호
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• pp.91-98
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• 2003

Experimental study for a porous aluminum heat dissipator/or heat sink made by casting method is conducted to evaluate the performance of the porous aluminum heat sinks. The parameters applied for the present study are the manufacturing method. various bonding materials for the bottom plate of heat sink, and their different material, pore size, etc.. The casting method for porous aluminum heat sink is suggested for the best performance of heat dissipation in this experiment. The bottom plate applied by melting aluminum is introduced and proved their excellent characteristics compared with brazing, soldering, and bonding methods. In the present experiment, aluminum with different conductivities, such as AC8A and pure aluminum, are tested and the pure aluminums with the higher conductivity than AC8A shows their improvement of the performance. And the proper dimensions related to the pore size and the height of porous aluminum heat sinks are proposed in the present study.

• 마이크로전자및패키징학회지
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• 제16권2호
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• pp.1-9
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• 2009

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330$^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• 한국전기전자재료학회논문지
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• 제13권2호
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• pp.170-176
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• 2000

The joints with multi-interfaces was expected to have low DC resistance compared with those with single interface. The small size joint specimens joined with Nb3Sn sub-cables were fabricated to investi-gate the DC performance in the range of 0 to 600A transport current without external magnetic field. The joints with multi-interfaces have a few n-Ohm resistance, which is much lower than that of single lap joint. Because the interfaces between sub-cables of multi-interfaced joint are more complicated than those of single-interfaced joint, the soldering condition between sub-cables is very effective on the joint DC resistance.

• 대한임상검사과학회지
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• 제41권2호
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• pp.67-75
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• 2009

In order to provide basic data for the prevention of adverse effects of lead on health, we examined lead levels in the blood of 30 handicapped workers employed in manufacturing electronic components in Seoul from 2002 to 2008. The average lead level in the blood of all the subjects was $4.79{\pm}4.32{\mu}g/dL$ in females, $2.64{\pm}2.31{\mu}g/dL$ in males, and $3.88{\pm}3.75{\mu}g/dL$ in total. Lead levels examined in this study were significantly lower than other investigators study have reported. The average lead level from personal exposure of the subjects was $1.44{\pm}0.91mg/m^3$ in the workplace. The relation between blood lead levels and personal exposure was a simple linear regression; it's equation was "Lead level in blood = 6.04 - 1.92 lead level by personal exposure".

• 대한금속재료학회지
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• 제50권8호
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• pp.563-568
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• 2012

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

• 한국기계가공학회지
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• 제20권12호
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• pp.92-99
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• 2021

The ever-growing demand for enhanced competitiveness of engineered systems require designing in quality strategies that can efficiently incorporate multiple design attributes into a system. In a robust design, there must be consideration for any uncontrollable factors that should not be disregarded in the design process. Studies on multi-attribute design challenges usually assume mutual utility independence amongst the design attributes. However, mutual utility independence does not exist in every design situation. In this study, a new robust design methodology that has two utility-dependent attributes are presented. The proposed method was then compared with a traditional robust design that utilizes a wave soldering process design. The results of this case study indicate that the proposed method yields a better solution than the traditional method.

• 대한치과기공학회지
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• 제44권4호
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• pp.154-160
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• 2022

The need for repairing removable dentures has grown as the population had aged. The direct methods allow existing dentures to be repaired without interrupting their use. However, if patient compliance is low, direct methods may be challenging. Moreover, attaching an artificial tooth to a metal base is a complicated procedure because it necessitates casting a retentive element and soldering it to a metal base. This clinical report describes how to add an artificial tooth to a metal base, reline denture bases, and reestablish occlusion on relined removable dentures using indirect methods. Existing removable dentures were successfully repaired and their service life was efficiently extended using the methods described.