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The Performance Characteristics of the Open Celled Aluminum Foam Applied for Heat Dissipation  

Kim, Jong-Soo (Korean Registor of Shipping)
Lee, Hyo-Jin (Dept. of Building Service Engineering, Hanbat National University)
Publication Information
Journal of the Korean Solar Energy Society / v.23, no.2, 2003 , pp. 91-98 More about this Journal
Abstract
Experimental study for a porous aluminum heat dissipator/or heat sink made by casting method is conducted to evaluate the performance of the porous aluminum heat sinks. The parameters applied for the present study are the manufacturing method. various bonding materials for the bottom plate of heat sink, and their different material, pore size, etc.. The casting method for porous aluminum heat sink is suggested for the best performance of heat dissipation in this experiment. The bottom plate applied by melting aluminum is introduced and proved their excellent characteristics compared with brazing, soldering, and bonding methods. In the present experiment, aluminum with different conductivities, such as AC8A and pure aluminum, are tested and the pure aluminums with the higher conductivity than AC8A shows their improvement of the performance. And the proper dimensions related to the pore size and the height of porous aluminum heat sinks are proposed in the present study.
Keywords
Open celled media; Porous aluminum; Heat dissipation;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 Lu, T.J., Stone, H.A., and Ashby, M.F.,Heat Transfer in Open-Cell Metal Foams,Acta Matehals, 1998, Vol. 46, No. 10,pp. 3619-3635   DOI   ScienceOn
2 Boomsma, K., and Poulikakos, D., On theEffective Thermal Conductivity of aThree-dimensionally Structured FIuid-satura-ted Metal Foam, Int. J. Heat MassTransfer, 2001, Vol. 44, pp. 827-836,2001   DOI   ScienceOn
3 이명호 외, CPU 냉각을 위한 홴-발포알루미늄방열기 조합의 열 전달 특성, 2001년도 열공학부문 춘계 학술대회 논문집, pp. 101-106
4 백진욱 외, 발포 알루미늄 표면이 충돌제트 열전달에 미치는 영향, 2001년도 열공학 부문 춘계학술대회 논문집, pp.89-94
5 Patel, C. and Belady, C., Modeling and Metrology in High Performance Heat Sink Design, Proceedings of the 47th Electronic Components and Technology Conference, IEEE, 1997, pp. 296-304
6 Shaukatullah, H., Bibliography of Air Heat Sinks for Thermal Enhancement of Electronic Packages. Fourteenth IEEE EMITHERM Symposium, 1998, pp. 177-221
7 Intel Pentium4 Processor Thermal Design Guidelines, November, 2000, pp. 17-21
8 Martin, H., Heat and Mass Transfer between Impinging Gas Jet and SolidSurface, Advances in Heat Transfer, 1977, Vol. 13, pp. 1-60   DOI
9 민경수 외, Darcy 유동과 Two- equation 모델을 이용한 다공성 방열기 이론해석, 2001년도 열공학 부문 춘계 학술대회 논문집, pp. 95-100
10 Loh, C.K., Chou, B., Nelson, D., andChou, D.J., Study of Thermal Characteristics on Solder and Adhesive Bonded Folded Fin Heat Sink, 2000 Inter Society Conference on Thermal Phenomena, IEEE, 2000, pp. 1~7
11 조성석, 김상동, 수용성 용융염 입자를 이용한 다공질 금속의 제조방법, 출원 10-2000-0025470, 2000