Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Wetting Property and Reflectivity of Sn-3.5Ag Solder by Plating for LED Lead Frame

LED용 리드프레임 상의 Sn-3.5Ag 솔더 도금의 젖음성 및 반사율

  • Kee, Se Ho (University of Seoul, Material Science and Engineering) ;
  • Xu, Zengfeng (University of Seoul, Material Science and Engineering) ;
  • Kim, Won Joong (University of Seoul, Material Science and Engineering) ;
  • Jung, Jae Pil (University of Seoul, Material Science and Engineering)
  • 기세호 (서울시립대학교 신소재공학과) ;
  • 허증봉 (서울시립대학교 신소재공학과) ;
  • 김원중 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2011.09.15
  • Published : 2012.08.25
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Abstract

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

Keywords

Acknowledgement

Supported by : 지식경제부

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