Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2002.11a
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- Pages.55-58
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- 2002
The micorstructure and strength of SnCuX Solder joint
SnCuX계 솔더를 이용한 무연 솔더링에서의 계면구조와 기계적 특성
Abstract
The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500
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