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http://dx.doi.org/10.3365/KJMM.2012.50.8.563

Wetting Property and Reflectivity of Sn-3.5Ag Solder by Plating for LED Lead Frame  

Kee, Se Ho (University of Seoul, Material Science and Engineering)
Xu, Zengfeng (University of Seoul, Material Science and Engineering)
Kim, Won Joong (University of Seoul, Material Science and Engineering)
Jung, Jae Pil (University of Seoul, Material Science and Engineering)
Publication Information
Korean Journal of Metals and Materials / v.50, no.8, 2012 , pp. 563-568 More about this Journal
Abstract
The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.
Keywords
alloys; soldering; wetting; surface roughness; reflectivity;
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