• 한국재료학회지
• /
• 제17권8호
• /
• pp.402-407
• /
• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Journal of Welding and Joining
• /
• 제35권3호
• /
• pp.21-27
• /
• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.

• 조명전기설비학회논문지
• /
• 제29권12호
• /
• pp.47-54
• /
• 2015

Normally, multiple socket-outlet is manufactured with soldered, welded permanent connection (termination). Because this procedure is very non-environmental and requires many labor forces, many companies skip this process. To solve this these problems, this research had to design permanent joint type multiple socket-outlet, develop safer multiple socket-outlet than is sold in markets. Progressing this research, we took 3 steps. First, we had to design device for fixing a frame suitable for multiple socket-outlet. Second, this multiple socket-outlet must pass fundamental standards through international standard (IEC 60884-1) and Korean standard (K 60884-1) tests. Third, it had to pass both several mechanical and electrical tests which is more strict than fundamental standards and vibration and impact tests following KS standards for enhancing its safety. After finishing 3 steps, we could obtain objective and fair data, develop environmental permanent joint type multiple socket-outlet without soldering crimped connection.

• 한국표면공학회지
• /
• 제35권2호
• /
• pp.129-137
• /
• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• 마이크로전자및패키징학회지
• /
• 제28권2호
• /
• pp.1-12
• /
• 2021

3차원 인쇄 기술은 제품의 설계를 3차원으로 하여 조립없이 제품의 생산까지의 시간을 획기적으로 줄이고 복잡한 구조도 구현할 수 있어 미래의 기술로 각광받고 있다. 본 논문은 3차원 인쇄기술을 이용한 전자소자에 대한 최근 연구동향을 알아보면서 구성품, 전원공급장치와 회로에서의 연결과 3차원 인쇄기술 PCB의 응용한 연구논문들을 소개하고 있다. 3차원 인쇄기술로 제작한 전자소자는 원스톱으로 전자소자, 솔더링(soldering), 스태킹(stacking), 회로의 봉지막(encapsulation)까지 제작함으로써 생산설비의 단순화와 전자기기를 개인 맞춤형을 할 수 있는 가능성을 보여주었다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 International Symposium
• /
• pp.261-278
• /
• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• 마이크로전자및패키징학회지
• /
• 제11권1호
• /
• pp.77-85
• /
• 2004

플라즈마 리플로우 솔더링에서 솔더볼의 접합성을 향상시키기 위해 UBM(Under Bump Metallization)을 Ar-10vol%$H_2$플라즈마로 클리닝하는 방법을 연구하였다. UBM층은 Si 웨이퍼 위에 Au(두께; 20 nm)/ Cu(4 $\mu\textrm{m}$)/ Ni(4 $\mu\textrm{m}$)/ Al(0.4 $\mu\textrm{m}$)을 웨이퍼 측으로 차례대로 증착하였다. 무연 솔더로는Sn-3.5wt%Ag, Sn-3.5wt%Ag-0.7wt%Cu를 사용하였고 Sn-37wt%Pb를 비교 솔더로 사용하였다. 지름이500 $\mu\textrm{m}$인 솔더 볼을 플라즈마 클리닝 처리를 한 UBM과 처리하지 않은 UBM위에 놓고, Ar-10%$H_2$플라즈마 분위기에서 플럭스 리스 솔더링하였다. 이 결과는 플럭스를 사용하여 대기 중에서 열풍 리플로우한 결과와 비교하였다. 실험 결과, 플라즈마 클리닝 후 플라즈마 리플로우한 솔더의 퍼짐율이 클리닝 하지 않은 플라즈마 솔더링보다 20-40%정도 더 높았다. 플라즈마 클리닝 후 플라즈마 리플로우한 솔더 볼의 전단 강도는 약58-65MPa로, 플라즈마 클리닝 하지 않은 플라즈마 리플로우보다 60-80%정도 높았으며, 플럭스를 사용한 열풍 리플로우보다는 15-35%정도 높았다. 따라서 Ar-10%$H_2$가스를 사용하여 UBM에 플라즈마 클리닝하는 공정은 플라즈마 리플로우 솔더 볼의 접합강도를 향상시키는데 상당한 효과가 있는 것으로 확인되었다.

• 구강회복응용과학지
• /
• 제19권2호
• /
• pp.75-86
• /
• 2003

The purpose of this study was to evaluate their mechanical properties after laser-welding or soldering of precious and non-precious dental alloys. For this study, 30 Co-Cr alloy specimens, 15 gold alloy specimens, 15 palladium alloy specimens were casted and seperated on the middle area. 15 sperated Co-Cr specimens and 15 seperated gold alloy specimens were laser welded (GW Group). 15 sperated Co-Cr specimens and 15 sperated gold alloy specimens were soldered by coventional soldering method (GS Group). 15 sperated Co-Cr specimens and 15 seperated palladium alloy specimens were laser welded (PW Group). 15 sperated Co-Cr specimens and 15 sperated palladium alloy specimens were soldered by coventional soldering method (PS Group). Tensile strength, 0.2% yield strength, % elongation were recorded in nine specimens of each group. Bending strength were record in six specimens of each group. These data for four groups were subjected to a two-way analysis of variance(ANOVA). The fracture locations, fractured surfaces were examined by SEM(scanning electron microscope). The results were as following: 1) In the same alloy combination, the tensile strength and 0.2% yield strength and of the laser welded group with same metal combination were significantly less than soldered groups(p<0.05). 2) In the combination of Co-Cr/Palladium, the bending strength of laser welded group were significantly less than that of soldered groups(p<0.05). In the combination of Co-Cr/Gold, the bending strength of laser welded group were significantly higher than that of soldered groups(p<0.05). 3) In the same method of joint, the tensile strength and 0.2% yield strength and bending strength of the Co-Cr/gold were significantly higher than Co-Cr/palladium(p<0.05). 4) There was no significantly statistical difference between each group in the % elongation(p>0.05). 5) The fracture of the laser welded specimens occured in the welding area and a large void was observed at the center of the fracture surface. 6) The fracture of the soldered specimens occured also inthe soldered area and many porpsities were showed at the fracture sites.

• 박물관보존과학
• /
• 제16권
• /
• pp.4-13
• /
• 2015

지금까지 한반도에서 출토된 누금세공유물의 접합방법을 살펴보면 금과 은을 합금한 재료를 사용한 금납법으로 접합한 경우가 대부분이다. 경주 보문동합장분 출토 금제태환이식(국보 제90호), 호암미술관 소장 금제세환이식과 금제태환이식(보물 제557호) 그리고 통일신라시대 감은사지 동삼층석탑 출토 금제풍탁(金製風鐸) 등에서 확인되었다. 그러나 경주 계림로 14호묘 출토 장식보검(裝飾寶劍)의 금립 접합방법은 지금까지 확인된 방식과는 다르다는 것을 SEM-EDS 분석으로 알 수 있었다. 계림로 장식보검의 금립은 크기와 형태가 매우 고르고, 표면에 수지상 조직(樹枝狀組織)을 갖고 있다. 순수한 금속에서는 이 수지상 조직이 나타나지 않으며, 합금된 물질의 특징이라고 할 수 있다. 실제로 금립의 조성은 Au 77wt%, Ag 18wt%, Cu 4wt%의 3원계 합금물질이다. 이 성분 특성(합금 금속)으로 인하여 순수한 금의 녹는점인 1064℃ 보다 훨씬 더 낮은 온도인 1000℃ 미만(약 980℃)에서도 금속의 용해가 가능하게 된다. 그러므로 금땜이나 다른 매개물을 전혀 사용하지 않고도 순간적으로 고온을 가하게 되면 금립의 접합이 가능하게 된다. 그리고 SEM 이미지 관찰에서도 땜의 흔적을 전혀 찾아 볼 수 없는 것으로 보아 융접법에 의한 접합이 이루어진 것으로 추정된다.

• 마이크로전자및패키징학회지
• /
• 제30권3호
• /
• pp.64-72
• /
• 2023

본 연구에서는 Cu 기판 위에 그래핀(graphene)을 전사하고 Cu 기판 위에 Sn-3.0Ag-0.5Cu 무연(Pb-free) 솔더페이스트를 도포한 후에, 리플로우 솔더링 공정 및 다양한 온도(125, 150, 175 ℃)에서 등온 시효 1000 h 동안 Cu 기판과 솔더 계면에서 발생하는 금속간화합물(intermetallic compound, IMC)의 형성과 성장 거동에 전사된 graphene의 미치는 영향에 대하여 보고하였다. Graphene이 계면에 존재하는 경우 graphene이 존재하지 않은 경우와 비교할 때, 솔더링 공정 및 시효 동안 형성되어 성장하는 Cu₆Sn₅과 Cu₃Sn IMC의 두께가 감소하는 것을 확인 할 수 있었다. 또한, 계면에 존재하는 전사된 graphene 층(layer)은 시효 온도와 시간에 따라 IMC들의 성장 거동과 관계된 Cu₆Sn₅과 Cu₃Sn IMC의 성장 속도 상수와 성장 속도 상수 제곱 값들도 크게 감소시킬 수 있는 것으로 나타났다.