• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1018-1024
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• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Polymer(Korea)
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• v.30 no.6
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• pp.519-524
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• 2006

Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.55-62
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• 2001

With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

• Journal of Technologic Dentistry
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• v.32 no.2
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• pp.65-74
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• 2010

Purpose : To understand the impact on the strength or restoration force by the change of heating temperature when soldering 18-8 stainless steel round wire which is the chrome-nickel class for dental orthodontic device production. Methods : The following conclusions were made upon the results from tensile strength test, 3 point bending test, and $90^{\circ}$ bending fatigue test with 24 samples that had been applied with condition 1 (before heat treatment - natural) and condition 2 (after heat treatment - mooring 30 seconds after heating up to $500^{\circ}C$, $700^{\circ}C$, and $900^{\circ}C$) to ${\phi}0.4mm$, ${\phi}0.7{\beta}mm$, 18-8 stainless steel round wire (spring hard) by Jinsung Company. Results : When it was heat-treated at $900^{\circ}C$, both ${\phi}0.4mm$ and ${\phi}0.7mm$ showed very low tensile strengths compared to the heat treated cases at $500^{\circ}C$ and $700^{\circ}C$ Yield strengths of both ${\phi}0.4mm$ and ${\phi}0.7mm$ showed very low compared to the heat treated cases at natural, $500^{\circ}C$, and $700^{\circ}C$, as well. Upon the results of 3 point bending test, the heat treated case at $900^{\circ}C$ showed very low in both ${\phi}0.4mm$ and ${\phi}0.7mm$, compared to the heat treated cases at natural, $500^{\circ}C$, and $700^{\circ}C$. Tensile strength of both ${\phi}0.4mm$ and ${\phi}0.7mm$ as well, showed very low compared to the heat treated cases at natural, $500^{\circ}C$, and $700^{\circ}C$. Upon the results of $90^{\circ}$ bending fatigue test, the heat treated case at $900^{\circ}C$ showed the highest wave node resistance in both ${\phi}0.4mm$ and ${\phi}0.7mm$. Conclusion : This study concluded that heating temperature change during wire soldering impacts on the characteristics of orthodntic wire.

• Korean Journal of Optics and Photonics
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• v.20 no.5
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• pp.272-275
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• 2009

In order to enhance the background noise filtering performance of the white light interferometry(WLI), we demonstrate the noise filtering performance of preprocessing of the measured fringe signals. The WLI was realized through a mirau interferometer which was equipped with a green LED. When measuring large-height and rough surface objects, the illumination optics are considered the numerical aperture(NA) and the depth of focus(DOF). In this case, the limited NA of the illumination optics has a considerable impact on the interference fringe. Therefore, we propose a preprocessing method that uses the intensity difference between the measured intensity and the moving average intensity. The performance is demonstrated by measuring an array of metal solder balls fabricated on printed circuit board(PCB). The proposed method reduces the noise pixels by 15 percent.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.67-73
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• 2009

Compared to the chip-bonding process utilizing solder bumps, flip chip process using Cu pillar bumps can accomplish fine-pitch interconnection without compromising stand-off height. Cu pillar bump technology is one of the most promising chip-mounting process for RF packages where large gap between a chip and a substrate is required in order to suppress the parasitic capacitance. In this study, Cu pillar bumps and Sn bumps were electroplated on a chip and a substrate, respectively, and were flip-chip bonded together. Contact resistance and chip shear force of the Cu pillar bump joints were measured with variation of the electroplated Sn-bump height. With increasing the Sn-bump height from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance was improved from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$ and the chip shear force increased from 3.8 N to 6.8 N. On the contrary, the aspect ratio of the Cu pillar bump joint decreased from 1.3 to 0.9. Based on the variation behaviors of the contact resistance, the chip shear force, and the aspect ratio, the optimum height of the electroplated Sn bump could be thought as 20 ${\mu}m$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.866-872
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• 2010

In this paper, we developed a digital soldering station based on PID controller, which supply stable power by controlling the current of heater of soldering iron. The proposed system designed PID controller to converge quickly to the set up temperature by user, and regain the lost of heat by external factors quickly. PID controller, designed by Ziegler-Nichols' tuning method, decides triac's trigger timing using setting temperature and present temperature to control the phase of AC 24V power that supply to the heater. Also, we give the function that shows present temperature and setting temperature of iron, and working time by graphic LCD. And during the rest time, we decided the power saving and extension of iron tip by dropping to the optimal temperature. Two experiments had implemented in $25^{\circ}C$ laboratory to confirm the performance of proposed method. The first experiment took 12sec, 13sec, 16sec, 18sec, reaching to $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ respectively which result showed shorten of rising time than previous method. In the loading experiment of $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ steady state showed temperature drop of $3.8^{\circ}C$, $4.1^{\circ}C$, $4.5^{\circ}C$ which result showed the low temperature deviation than previous method.

• Korean Journal of Heritage: History & Science
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• v.43 no.3
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• pp.102-121
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• 2010

Three bronze bells excavated from the Hoeamsa temple site were investigated for their microstructures and chemical compositions in an effort to understand the technology applied in fabrication, which may represent the related industry established in the early Joseon period. The result shows that the bells were cast from alloys of approximately 85% copper-8% tin-7% lead. The chemical analysis for ten trace elements shows that they were all kept below 0.3 weight %, suggesting that the alloys were made of relatively well-refined copper, tin and lead. The presence of sulfur and iron indicates that chalcopyrite or chalcocite may have been used in the smelting of copper. Evidence has been found that the bells were cast by pouring the liquid metal from the top of the sand molds that were set up in an upright position. No additional treatments, thermal or mechanical, other than a little grinding were applied upon the completion of casting. After the shaping process, a balancing plate was attached to the top of the bell using a steel connection ring. The connection assembly was then fixed to the main body by using molten bronze as a solder. The surface inscription was found carved using different techniques. The differences in the order of strokes and the calligraphic style indicate that the carving was carried out by more than one master. In the absence of documentary evidence on past bronze technology, the present bronze bells with known chronology, provenance and the main agent of production, prove to be a rare and valuable archaeological material for the understanding of the related technology in use in the early Joseon period.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.