• Resources Recycling
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• v.14 no.5 s.67
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• pp.24-31
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• 2005

In order to recover valuable metals from fine-grained electronic waste, bioleaching of Cu, Zn, Al, Co, Ni, Fe, Sn and Pb were carried out using Aspergillus niger as a leaching microorganism in a shaking flask. Aspergillus niger was able to grow in the presence of electronic scrap. The formation of organic acids(citric and oxalic acid) from Aspergillus niger caused the mobilization of metals from waste electronic scrap. In a preliminary study, in order to obtain the data on the leaching of Cu, Zn, Al, Fe, Co and Ni from electronic scrap, chemical leaching using organic acid(Citric acid and Oxalic acid) was accomplished. At the electronic scrap concentration of 50 g/L, Aspergillus niger were able to leach more than 95% of the available Cu, Co. But Al, Zn, Pb and Sn were leached about 15-35%. Ni and Fe were detected in the leachate less than 10%.

• Bulletin of the Korean Chemical Society
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• v.32 no.6
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• pp.1912-1920
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• 2011

The $SnO_2$ with a particle size of about 300 nm instead of Ni is used in this study to overcome rapid catalytic deactivation by the formation of a $NiAl_2O_4$ spinal structure on the conventional Ni/${\gamma}$-$Al_2O_3$ catalyst and simultaneously impregnated the catalyst with potassium (K). The $SnO_2-K_2O$ impregnated Zeolite Y catalyst ($SnO_2-K_2O$/ZY) exhibited significantly higher ethanol reforming reactivity that that achieved with $SnO_2$ 100 and $SnO_2$ 30 wt %/ZY catalysts. The main products from ethanol steam reforming (ESR) over the $SnO_2$-$K_2O$/ZY catalyst were $H_2$, $CO_2$, and $CH_4$, with no evidence of any CO molecule formation. The $H_2$ production and ethanol conversion were maximized at 89% and 100%, respectively, over $SnO_2$ 30 wt %-$K_2O$ 3.0 wt %/ZY at 600 $^{\circ}C$ for 1 h at a $CH_3CH_2OH:H_2O$ ratio of 1:1 and a gas hourly space velocity (GHSV) of 12,700 $h^{-1}$. No catalytic deactivation occurred for up to 73 h. This result is attributable to the easier and weaker of reduction of Sn components and acidities over $SnO_2-K_2O$/ZY catalyst, respectively, than those of Ni/${\gamma}$-$Al_2O_3$ catalysts.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.956-960
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• 2010

CuO doped $WO_3-SnO_2$ thick film gas sensors were fabricated by screen printing method on alumina substrates and heat-treated at $350^{\circ}C$ in air. The effects of mixing ratio of $WO_3$ with $SnO_2$ on the structural and morphological properties of $WO_3-SnO_2$ were investigated X-ray diffraction and Scanning Electron Microscope. The structural properties of the $WO_3-SnO_2$:CuO thick film by XRD showed that the monoclinic of $WO_3$ and the tetragonal of $SnO_2$ phase were mixed. Nano CuO was coated on the $WO_3-SnO_2$ surface and then the surface of $WO_3$ was coated with $SnO_2$ particles with $1\sim1.5{\mu}m$ in diameters, as confirmed form the SEM image. The sensitivity of the $WO_3-SnO_2$:CuO sensor to 2000 ppm $CO_2$ gas and 50 ppm $H_2S$ gas for the various ratio of $WO_3$ and $SnO_2$ was investigated. The 4 wt% CuO doped $WO_3-SnO_2$(75:25) tkick films showed the highest sensitivity to $CO_2$ gas and $H_2S$ gas.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.85-87
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• 2009

Despite the success of $Cu(In,Ga)Se_2$ (CIGS) based PV technology now emerging in several industrial initiatives, concerns about the cost of In and Ga are often expressed. It is believed that the cost of those elements will eventually limit the cost reduction of this technology. one candidate to replace CIGS is $Cu_2ZnSnSe_4$ (CZTSe), fabricated by co-evaporation technique. Effects of substrate temperature of $Cu_2ZnSnSe_4$ absorber layer on the performance of thin films solar cells were investigated. As substrate temperature increased, the grain size of $Cu_2ZnSnSe_4$ films increased presumably. At a optimal condition of substrate temperature is $320^{\circ}C$, the solar cell shows a conversion efficiency of 1.79% with $V_{OC}$ of 0.213V, JSC of $16.91mA/cm^2$ and FF of 49.7%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.805-808
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• 2002

A carbon monoxide gas sensor utilizing Pt-SiC, Pt-SnO2-SiC diode structure was fabricated. Since the operating temperature for silicon devices in limited to 200oC, sensor which employ the silicon substrate can not at high temperature. In this study, CO gas sensor operating at high temperature which utilize SiC semiconductor as a substrate was developed. Since the SiC is the semiconductor with wide band gap. the sensor at above $700^{\circ}C$. Carbon monoxide-sensing behavior of Pt-SiC, Pt-SnO2-SiC diode is systematically compared and analyzed as a function of carbon monoxide concentration and temperature by I-V and ${\Delta}$I-t method under steady-state and transient conditions.

• Journal of the Korean institute of surface engineering
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• v.51 no.5
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• pp.297-302
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• 2018

The important drawback of hardware fasteners consisted of 304 stainless steel (STS) is a frequent galling caused by a combination of friction and adhesion between the sliding surface. To improve the anti-galling effect, Sn-Al coatings by a thermal diffusion have been developed. The thermal diffusion by pack cementation with an $AlCl_3$ activator at $250^{\circ}C$ for 1 hour produced an Sn-Al alloy coating layer with an average thickness of $9.9{\pm}0.5{\mu}m$ on the surface of 304 STS fasteners. Compared with the galling frequency of the 304 STS fasteners, Sn-Al coatings on the surface of 304 STS fasteners demonstrated about 2.8-time reduction of the galling frequency.

• Journal of Sensor Science and Technology
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• v.21 no.3
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• pp.167-171
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• 2012

Ag- and Pd-loaded $SnO_2$ nanowire network sensors were prepared by the growth of $SnO_2$ nanowires via thermal evaporation, the coating of slurry containing $SnO_2$ nanowires, and dropping of a droplet containing Ag or Pd nanoparticles, and subsequent heat treatment. All the pristine, Pd-loaded and Ag-loaded $SnO_2$ nanowire networks showed the selective detection of $C_2H_5OH$ with low cross-responses to CO, $H_2$, $C_3H_8$, and $NH_3$. However, the relative gas responses and gas selectivity depended closely on the catalyst loading. The loading of Pd enhanced the responses($R_a/R_g$: $R_a$: resistance in air, $R_g$: resistance in gas) to CO and $H_2$ significantly, while it slightly deteriorated the response to $C_2H_5OH$. In contrast, a 3.1-fold enhancement was observed in the response to 100 ppm $C_2H_5OH$ by loading of Ag onto $SnO_2$ nanowire networks. The role of Ag catalysts in the highly sensitive and selective detection of $C_2H_5OH$ is discussed.

• Journal of Sensor Science and Technology
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• v.6 no.5
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• pp.369-375
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• 1997

$V_{2}O_{5}/ThO_{2}/Pd$-doped $SnO_{2}$ sensor has a good selectivity and stability to CO at high sensor temperature of about $500^{\circ}C$, and shows rapid response. In particular, many kinds of interference gases, such as $NO_{x}$, $C_{3}H_{8}$, $CH_{4}$ and $SO_{2}$ have been found to give only a slight influence on the sensor selectivity to CO gas sensitivity by doped $V_{2}O_{5}$ (3.0 wt.%). For the sensor we used well-known thick film technological route with $V_{2}O_{5}$(3.0 wt.%), Pd(1.0 wt.%) and $ThO_{2}$(l.5 wt.%) as catalytic materials. In the case of mixed $NO_{x}$-CO gases, as combustion exhaust gas, only CO detection by $SnO_{2}$ type semiconductor sensor is generally very difficult because of $NO_{x}$ interference. The developed sensors can use to measure the exhausting gas of the automobile or the boiler for the Air-to-Fuel ratio control.

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.150-157
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• 2006

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.