• Title/Summary/Keyword: SnAg

Search Result 625, Processing Time 0.025 seconds

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향)

  • Lee, Young-Chul;Kim, Kwang-Seok;Ahn, Ji-Hyuk;Yoon, Jeong-Won;Ko, Min-Kwan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
    • /
    • v.48 no.11
    • /
    • pp.1035-1040
    • /
    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향)

  • Ko, Min-Kwan;Ahn, Jee-Hyuk;Lee, Young-Chul;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
    • /
    • v.50 no.1
    • /
    • pp.71-77
    • /
    • 2012
  • We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

Metallurgical Observation of the Buddhist Bell of Youngmoon Mountain Sangwonsa Temple (용문산 상원사 범종의 금속학적 고찰)

  • Doh, Jungmann;Park, Bangju;Lee, Jungil;Hong, Kyungtae
    • Korean Journal of Metals and Materials
    • /
    • v.50 no.11
    • /
    • pp.829-838
    • /
    • 2012
  • The microstructure, chemical composition, and lead isotope ratio of the Buddhist bell of Yongmoon Mountain Sangwonsa temple, which was selected as one of the three great bells of Korea by Japanese historians, were analyzed in order to estimate the origin of the material and the time of casting. The microstructure of the temple bell was composed of a copper matrix phase with ${\alpha}$, a face centered cubit lattice structure, a ${\delta}$ phase with $Cu_{41}$ $(Sn,Ag,Sb)_{11}$ as the chemical structural formula, dispersed lead and $Cu_2S$ particles, and locally agglomerated fine particles. Through analysis of the chemical composition of the bell, a criterion (Pb: 0-3.0 wt%, Sn: 10-15 wt%) for distinguishing the bells of the Shilla dynasty from the bells of the Koryo Chosun dynasty is proposed. Examining the lead isotope ratio of $^{207}Pb/^{206}Pb$ and $^{208}Pb/^{206}Pb$ of the Buddhist bell of Sangwonsa temple proved that the bell was fabricated using raw materials in South Korea, which led to the conclusion that the bell was cast in Korea and the top board of the bell has been damaged by an unknown individual. The criteria of distinguishing the bells from the Shilla dynasty from the bells of the Koryo Chosun dynasty presented for the first time in this research is expected to aid in identifying and estimating the previously unclear production years of other bells.

Study on the tasty constituents and minerals in Clavariaceae botrytis (싸리버섯의 정미성분(呈味成分)과 Mineral에 관(關)한 연구(硏究))

  • Seoh, Jeong-Hi;Cho, Soo-Yeul;Lee, Sung-Woo
    • Journal of the Korean Society of Food Science and Nutrition
    • /
    • v.3 no.1
    • /
    • pp.17-21
    • /
    • 1974
  • Tasty constituents such as free amino acids. free organic acids and free sugars and minerals in clavariaceae botrytis were surveyed through the course of this study. The results were as, follows: 1. Isoleucine valine threonine alanine methionine cysteine glutamine histidine glutamic acid and aspartic acid were presented in clavariaceae botrytis, and aspartic acid showed the highest amount. 2. Succinic acid was the major organic acid in clavariaceae botrytis, and also citric acid malic acid and fumaric acid were presented. 3. Clavariaceae botrytis contained fructose, maltose glucose and sucrose ; glucose and sucrose were more than 80% of total sugars. 4. Na K Mg Ca Zn Mn Cu am Fe by atomic absorption spectrometer were detected and assayed. and Al Si Ni Sn Ti Cr Ag Pb B and Sr detected by emission spectrograph. K of these minerals showed the highest amount but very small amount of Ca was presented.

  • PDF

A Study on the Electrochemical Deposition and p-Type Doping of ZnTe Films as a Back Contact Material for CdTe Photovoltaic Solar Cells (CdTe계 태양전지에 응용되는 ZnTe 박막의 전기화학적 제조 및 Cu 도핑 연구)

  • Kim, Dong-Hwan;Jeon, Yong-Seok;Kim, Gang-Jin
    • Korean Journal of Materials Research
    • /
    • v.7 no.10
    • /
    • pp.856-862
    • /
    • 1997
  • 박막형 CdTe/CdS 태양전지의 배면전극(back contacts)물질로서 Cu도핑된 ZnTe 박막(ZnTe:Cu)을 전착법(electroplating)으로 제조하는 연구를 수행하였다. Sulfate계의 전해질 수용액에서 CdTe 기판과 투명전극으로 코팅된 유리(In$_{2}$O$_{3}$: Sn, ITO)기판 위에 ZnTe 박막을 코팅하는 방법으로써 potentiostat와 기판(cathode), Pt counter electrode, Ag/AgCI 표준전극으로 구성된 장치를 사용하여 pH=2.5-4, T=70-8$0^{\circ}C$, 0.02M $Zn^{2+}$ 1x$10^{-4}$M TeO$_{2}$, 0.2M $K_{2}$SO$_{4}$조건에서 -0.800 Vs~-0.975 V 범위의 전압(V$_{a}$ )에 걸쳐 실험하였다. ITO박막을 기판으로 사용하여 cyclic voltammogram을 작성한 결과 약 -0.50 V 에서 Te환원 peak이 나타났다. Auger electron spectroscopy (AES)로 조성분석한 결과 표면에서 Zn signal이 강하게 나왔고 시편의 두께에 따라 Zn의 signal감소하는 반면 Cd signal은 증가하는 것이 확인되었다. SEM 사진으로부터 ZnTe의 표면이 작은 입자 (0.2$\mu\textrm{m}$ 이하)로 구성되어 있으며 낮은 V$_{a}$ 에서는 입자가 작아지면서 조직이 치밀해짐이 관찰되었다. Optical transmission방법에 의하여 ITO기판위에 입혀진 박막의 밴드갭은 2.5 eV으로 측정되었다. 수용액중의 Cu$_{2+}$와 triethanolamine(TEA)은 산성용액에서 착물형성이 이루어지지 않았으며 1,10-phenanthroline과는 pH=2에서도 착물이 형성되었다.

  • PDF

A STUDY ON THE FRACTURE OF DENTAL AMALGAM (치과용 아말감의 파절에 관한 연구)

  • Huh, Hyeon-Do;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
    • /
    • v.9 no.1
    • /
    • pp.101-106
    • /
    • 1983
  • It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

  • PDF

IGZO 박막트렌지스터의 열처리 조건에 따른 Ti/Au 전극 연구

  • Lee, Min-Jeong;Choe, Ji-Hyeok;Gang, Ji-Yeon;Myeong, Jae-Min
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2010.05a
    • /
    • pp.54.1-54.1
    • /
    • 2010
  • 산화물 기반의 TFT는 유리, 금속, 플라스틱 등 기판 종류에 상관없이 균일한 제작이 가능하며, 상온 및 저온에서 대면적으로 제작이 가능하고, 저렴한 비용으로 제작 가능하다는 장점 때문에 최근 많은 연구가 이루어지고 있다. 현재 TFT 물질로 많이 연구되고 있는 산화물은 ZnO (3.4 eV)나 InOx (3.6 eV), GaOx (4.9 eV), SnOx(3.7 eV)등의 물질과 각각의 조합으로 구성된 재료들이 주로 사용되고 있으며, 가장 많은 연구가 이루어진 ZnO 기반의 TFT는 mobility와 switching 속도에서 우수한 특성을 보이나, 트렌지스터의 안정성이 떨어지는 것으로 보고 되고 있다. 그러나 IGZO 물질의 경우 결정학적으로 비정질이며 상온 및 저온에서 대면적으로 제작이 가능하고, 높은 전자 이동도의 특성을 가지고 있는 장점 때문에 최근 차세대 산화물 트렌지스터로 각광받고 있다. IGZO TFT 소자의 경우 Ag, Au, In, Pt, Ti, ITO 등 다양한 전극 물질이 사용되고 있는데, 이들 중 active channel과 ohmic contact을 이루는 Al, Ti, Ag의 적용을 통해 향상된 성능을 얻을 수 있다. 하지만 이들 전극 재료는 TFT 소자 제작시 필수적인 열처리 공정에 노출되면서 active channel 과 전극 사이 계면에 문제점을 야기할 수 있다. 특히, Ti의 경우 산화가 잘되기 때문에 전극계면에 TiO2를 형성하여 contact resistance의 큰 영향을 미치는 것으로 보고 되고 있다. 본 연구에서는 ohmic 전극재료인 Ti 또는 Ti/Au를 적용하여 TFT 소자 제작 및 특성에 대한 평가를 진행했으며, 열처리에 따른 전극과 IGZO 계면 사이의 미세구조와 전기적인 특성간의 상관관계를 연구하였다. 이를 통해, 소자 제작 공정을 최적화하고 신뢰성 있는 소자 특성을 얻을 수 있었다.

  • PDF

Formation of Ni-W-P/Cu Electrodes for Silicon Solar Cells by Electroless Deposition (무전해 도금을 이용한 Si 태양전지 Ni-W-P/Cu 전극 형성)

  • Kim, Eun Ju;Kim, Kwang-Ho;Lee, Duk Haeng;Jung, Woon Suk;Lim, Jae-Hong
    • Journal of Surface Science and Engineering
    • /
    • v.49 no.1
    • /
    • pp.54-61
    • /
    • 2016
  • Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

Bronze Production Technology in the Early Iron Age: A comparative study of bronze artifacts recovered from the Hoam-dong site in Chungju and Chongsong-ri in Buyeo (초기철기시대 청동기의 제작기술 - 충주 호암동유적과 부여 청송리유적 출토 청동기의 비교 연구-)

  • Han, Woorim;Hwang, Jinju;Kim, Sojin
    • Korean Journal of Heritage: History & Science
    • /
    • v.51 no.4
    • /
    • pp.224-233
    • /
    • 2018
  • Thirty-three Early Iron Age bronzes at the sites of Hoam-dong in Chungju and Cheongsong-ri in Buyeo were investigated in order to study the manufacturing technique and the provenance of lead. Chemical analysis using X-ray fluorescence showed that 33 bronzes consist of copper(Cu), tin(Sn) and lead(Pb) served as major elements. Major and minor elemental analyses by EPMA were performed on two mirrors and 2 weapons of the bronzes investigated. The results shows that bronze mirrors from Chungju and Buyeo were high-tin bronzes(> 30 wt%). And 20% of tin and 5% of lead were founded in bronze weapons. Iron, zinc, arsenic, silver, nickel, sulfur and cobalt detected in four bronzes as minor and trace elements. The four bronzes were alloyed considering their function and were not heat treated after casting due to their high tin content. Lead isotope analysis using TIMS indicates that thirty-three bronzes were distributed southern Korea peninsula except Zone 1. As a result, lead raw materials came from various regions in Korean Peninsula not from Gyeongsang-do regions. The manufacturing techniques of bronze ware generalized at this age, and bronze was produced in various sites using raw materials from various sources.

A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS (치과용 아말감합금 및 아말감의 마세구조에 관한 연구)

  • Yeon, Sang-Heum;Lee, Chung-Sik;Lee, Myung-Jong;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
    • /
    • v.21 no.1
    • /
    • pp.87-105
    • /
    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

  • PDF