• Journal of the Korea Society of Computer and Information
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• v.26 no.2
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• pp.221-227
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• 2021

In this paper, we tried to explore factors influencing the diffusion of online events through SNS by analyzing the online footprint of consumers. To this end, log data of online events conducted by "C" beer brands were collected and analyzed. The analysis unit of log data was set for each one hour, and the analyzing method used descriptive and regression analysis. Results are as follows. First, factors influencing the diffusion of the view of SNS-based online events were like, friend used coupon, and friend size. In particular, the size of friends had the greatest impact on the diffusion, which again suggests the importance of social hubs in online events. Second, factors influencing the diffusion of the number of inflows were also like, friend used coupon, and size of friends. Third, it was found that the number of reply did not affect the diffusion of views and inflows. This study is meaningful that it suggested an alternative plan to increase the effect of online events by using real data.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Powder Materials
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• v.25 no.4
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• pp.302-308
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• 2018

A lean alloy is defined as a low alloy steel that minimizes the content of the alloying elements, while maintaining the characteristics of the sintered alloy. The purpose of this study is to determine the change in microstructure and mechanical properties due to the addition of silicon or tin in Fe-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P alloys. Silicon- or tin-added F-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P master alloys were compacted at 700 MPa and subsequently sintered under a $H_2-N_2$ atmosphere at $1120^{\circ}C$. The sintered density of three alloy systems decreases under the same compacting pressure due to dimensional expansion with increasing Si content. As the diffusion rate in the Fe-P-Mo system is higher than that in the Fe-P-Mn system, the decrease in the sintered density is the largest in the Fe-P-Mn system. The sintered density of Sn added alloys does not change with the increasing Sn content due to the effect of non-dimensional changes. However, the effect of Si addition on the transverse rupture strengthening enhancement is stronger than that of Sn addition in these lean alloys.

• Journal of Sensor Science and Technology
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• v.29 no.6
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• pp.420-426
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• 2020

A metal oxide semiconductor gas sensor is operated by measuring the changes in resistance that occur on the surface of nanostructures for gas detection. ZnO, which is an n-type metal oxide semiconductor, is widely used as a gas sensor material owing to its high sensitivity. Various ZnO nanostructures in gas sensors have been studied with the aim of improving surface reactions. In the present study, the sol-gel and vapor phase growth techniques were used to fabricate nanostructures to improve the sensitivity, response, and recovery rate for gas sensing. The sol-gel method was used to synthesize SnO₂ nanoparticles, which were used as the seed layer. The nanoparticles size was controlled by regulating the process parameters of the solution, such as the pH of the solution, the type and amount of solvent. As a result, the SnO₂ seed layer suppressed the aggregation of the nanostructures, thereby interrupting gas diffusion. The ZnO nanostructures with a sol-gel processed SnO₂ seed layer had larger specific surface area and high sensitivity. The gas response and recovery rate were 1-7 min faster than the gas sensor without the sol-gel process. The gas response increased 4-24 times compared to that of the gas sensor without the sol-gel method.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.253-255
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• 2002

Since a butt Joint is smaller than a lap type joint, it is expected to have smaller AC losses. The butt joint is produced by the diffusion bonding of the contacting surface under pressured and heated condition. It is important to find robust joining conditions, because butt joint has small contact area and has the shape by which the quality of bonding is hard to be checked. In this research, the loading pressure is considered as the joining parameter to find optimum joining condition. The DC resistance of the joint may be changed by the surface pressure during joining process, because the superconducting strands near the contact surface are failed by large plastic deformation. The range from 10 MPa to 18 MPa is expected optimum surface pressure in the conditions of 1 hour heating time and $750^{\circ}C$ temperature in the vacuum furnace.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.37-44
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• 2000

Numerical investigation is made to study the effects of natural convection on the formation of macrosegregation of a Pb-Sn alloy solidification process in a 2-D confined rectangle mold. The governing equations are calculated using previous continuum models with SIMPLE algorithm doring the solidification process. In addition. to track the solid-liquid interface with time variations. the moving boundary condition Is adopted and irregular interface shapes are treated with Boundary-Fitted Coordinate system. As the temperature reduce from the liquidus to the solidus, the liquid concentration of Sn. the lighter constituent, increases. Then the buoyancy-driven flow due to temperature and liquid composition gradients, called thermosolutal convection or double diffusion, occurs in the mushy region and forms the complicated macrosegregation maps. Related to this phnomena, effects on the macrosegregation formation depending on the cooling condition and gravity values are described.

• Journal of Internet Computing and Services
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• v.12 no.6
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• pp.171-187
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• 2011

Due to the vitalization of the smart phones, mobile revolution has been started. The mobile revolution has elevated SNS service, which was once considered as just one of many communication tools, to the single most important communication method as well as diffusion of social commerce. Yet, there has not been an adequate study of the roles of SNS in the domestic social commerce market, which has gotten a lot of spotlights. Therefore, the purpose of this study is to investigate the influence of various characteristics of social commerce that it has an impact on the purchase intension as well as the moderating effects of SNS. For these purposes, this study has drawn up the characteristics of social commerce in cost cutting, impulse buy, social influence, decision support, word of mouth effect and etc. to prove the interaction effect of SNS. The regression analysis showed that the characteristics of all the social commerce are related to the dependent variable. As a result of drawing up the interaction effect of SNS, it has shown that the cost cutting and word of mouth have significant influence in the social commerce diffusion as the usage of SNS increased. In conclusion, the main implication of this study is to provide the basic grounds for social commerce business strategy as it investigated the characteristics of SNS and its relation.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Journal of the Korean Physical Society
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• v.73 no.10
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• pp.1437-1443
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• 2018

In this work, $SnO_2$ modified with reduced graphene oxide (rGO) and carbon nanotubes (CNTs) separately and combined sensitized by using the co-precipitation method and their sensing behavior toward ethanol vapor at room temperature were investigated. An interdigitated electrode (IDE) gold substrate is very expensive compared to a fluorine doped tin oxide (FTO) substrate; hence, we used the latter to reduce the fabrication cost. The structure and the morphology of the studied materials were characterized by using differential thermal analyses (DTA) and thermogravimetric analysis (TGA), transmission electron microscope (TEM), X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, Brunauer-Emmett-Teller surface area and Barrett-Joyner-Halenda (BJH) pore size measurements. The studied composites were subjected to ethanol in its gas phase at concentrations from 10 to 200 ppm. The present composites showed high-performance sensitivity for many reasons: the incorporation of $SnO_2$ and CNTs which prevents the agglomeration of rGO sheets, the formation of a 3D mesopourus structure and an increase in the surface area. The decoration with rGO and CNTs led to more active sites, such as vacancies, which increased the adsorption of ethanol gas. In addition, the mesopore structure and the nano size of the $SnO_2$ particles allowed an efficient diffusion of gases to the active sites. Based on these results, the present composites should be considered as efficient and low-cost sensors for alcohol.