The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package |
Kim, Hyun-Ho
(Nano-Information Technology University & Seoul Technopark)
Kim, Do-Hyung (Nano-Information Technology University & Seoul Technopark) Kim, Jong-Bin (Nano-Information Technology University & Seoul Technopark) Kim, Hee-Jin (Nano-Information Technology University & Seoul Technopark) Ahn, Jae-Ung (Nano-Information Technology University & Seoul Technopark) Kang, In-Soo (NEPES Corporation) Lee, Jun-Kyu (NEPES Corporation) Ahn, Hyo-Sok (Seoul National University of Science and Technology) Kim, Sung-Dong (Seoul National University of Science and Technology) |
1 | Gi-Jo Jung, Yun-Mook Park, In-Soo Kang, Byoung-Yool Jeon, Sung-Dong Kim, Hyo-Sok Ahn, Young-Jung Huh, Kyoung-Chul Jo, Gil Heo, Hee-Jun Park and Se-Ryoung Kim, "Reliability of Various Types of Wafer Level Package (WLP) for Mobile Application", Proc. of Electronic Packaging Technology Conference, 842 (2008). |
2 | Ahmer Syed, Tae Seong Kim, Young Min Cho, Chang Woo Kim, and Min Yoo, "Alloying Effects of Ni, Co, and Sb in SAC solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish", Proc. of Electronic Components and Technology Conf. , 404 (2006). |
3 | Ji-Yeon Lim, Dong-Young Jang, and Hyo-Sok Ahn, "Experimental and Numerical Study on Board Level Impact Test of SnPb and SnAgCu BGA Assembly Packaging" J. Microelectron. Packag. Soc., 15(4), 77 (2008). 과학기술학회마을 |
4 | W. H. Zhu, Luhua Xu, John HL Pang, X. R. Zhang, Edith Poh, Y. F. Sun, Anthony Y. S. Sun, C. K. Wang and H. B. Tan, "Drop reliability Study of PBGA Assemblies with SAC305, SAC105 and SAC105-Ni Solder Ball on Cu-OSP and ENIG Surface Finish", Proc. of Electronic Components and Technology Conf. , 1667 (2008). |
5 | JEDEC solid state technology association, "Board Level Drop Test Method of Components for Handheld Electronic Products," JESD22-B111, July (2003). |
6 | Masamoto Tanaka, Tsutomu Sasaki, Takayuki Kobayashi and Kohei Tatsumi, "Improvement in Drop Shock Reliability of Sn-1.2Ag-0.5Cu BGA Interconnects by Ni Addition", Proc. of Electronic Components and Technology Conf., 78 (2006). |
7 | Sang-Ok Ha, Sang-Su Ha, Jong-Bum Lee, Jeong-Won Yoon, Jai-Hyun Park, Yong-Chul Chu, Jun-Hee Lee, Sung-Jin Kim and Seung-boo Jung, "Drop reliability evaluation of Sn3.0Ag 0.5Cu solder joint with OSP and ENIG surface finishes", J. Microelectron. Packag., 16(1), 33 (2009). 과학기술학회마을 |
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