• Title/Summary/Keyword: Sn-Cu alloy

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A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy42 Lead-Frame Solder Joint (Sn-3.5Ag/Alloy42 리드프레임 땜납접합의 미세조직과 접합특성에 관한 연구)

  • Kim, Si-Jung;Bae, Gyu-Sik
    • Korean Journal of Materials Research
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    • v.9 no.9
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    • pp.926-931
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    • 1999
  • The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

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Characteristics of Electroplated Sn-2.5Cu Alloy Layers for Surface Finishing (표면마무리를 위한 Sn-2.5Cu 합금 도금막의 특성)

  • Kim, Ju-Youn;Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.13 no.2
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    • pp.133-136
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    • 2003
  • Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

Microstructural Feature and Aging Characteristics of Spray-Formed Cu-5Ni-10Sn Alloy (가스분무성형 Cu-5Ni-10Sn 합금의 미세조직 및 시효강화)

  • Roh, Dae-Gyun;Kang, Hee-Soo;Baik, Kyeong-Ho
    • Journal of Powder Materials
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    • v.19 no.4
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    • pp.317-321
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    • 2012
  • In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

Adhesion Properties of Sn-3.5Ag solder on Cu, Alloy42 substrates after aging (시효 처리후 Sn-3.5Ag solder의 Cu, Alloy42 기판에서의 접합특성)

  • 김시중;김주연;배규식
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.640-644
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    • 2000
  • The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

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Microstructure and Mechanical Properties of the Sn-Pb Solder Alloy with Dispersion of ${Cu_6}{Sn_5}$ and Cu (${Cu_6}{Sn_5}$ 및 Cu 분산에 따른 Sn-Pb 솔더합금의 미세구조와 기계적 성질)

  • Lee, Gwang-Eung;Choe, Jin-Won;Lee, Yong-Ho;O, Tae-Seong
    • Korean Journal of Materials Research
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    • v.10 no.11
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    • pp.770-777
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    • 2000
  • Microstructure and mechanical properties of the $Cu_6Sn_5$-dispersed 63Sn-37Pb solder alloy, for which $Cu_6Sn_5$ powders less than $1{\mu\textrm{m}}$ size were fabricated by mechanical alloying, were characterizde and compared with those of the Cu-dispersed solder alloy. Compared to the $Cu_6Sn_5$-dispersed solder alloy, large amount of $Cu_6Sn_5$ and fast growth of $Cu_6Sn_5$ were observed in the Cu-dispersed alloy. The $Cu_6Sn_5$-dispersed solder alloy exhibited lower yield strength, but higher ultimate tensile strength than those of the Cu-dispersed alloy. With dispersion of 1~9 vol% $Cu_6Sn_5$ and Cu, the yield strength increased from 23 MPa and to 40 MPa, respectively. The ultimate tensile strength increased from 34.7 MPa to 45.3 MPa and to 43.1 MPa with dispersion of 5 vol% $Cu_6Sn_5$ and Cu, respectively.

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Electrochemical Performances of the Sn-Cu Alloy Negative Electrode Materials through Simple Chemical Reduction Method

  • Oh, Ji Seon;Kim, Duri;Chae, Seung Ho;Oh, Seungjoo;Yoo, Seong Tae;Kim, Haebeen;Ryu, Ji Heon
    • Journal of Electrochemical Science and Technology
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    • v.10 no.3
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    • pp.329-334
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    • 2019
  • Sn-Cu alloy powders were prepared via a simple chemical reduction method for the negative electrode materials in lithiumion batteries. The addition of Cu can suppress the growth of Sn particles during synthetic process. Furthermore, the Cu also acts as a matrix phase against the volume change during cycling. With increasing amount of the Cu, a stable $Cu_6Sn_5$ phase formed in the Sn-Cu alloy and its cycle performance greatly enhanced depending on the Cu content. To promote the generation of the $Cu_6Sn_5$ phase, the synthesis temperature is raised to $60-100^{\circ}C$ from the ambient temperature. The Sn-Cu alloy powders prepared at elevated temperatures showed remarkable cycle performances. The Sn-Cu alloy powder obtained at $60^{\circ}C$ exhibited a significantly high volumetric capacity of over 2,000 mAh/cc at the 50th cycle.

Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P (P의 함량에 따른 Sn-Ag-Cu 및 Sn-Cu 무연솔더의 특성평가)

  • 신영의;황성진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.6
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    • pp.549-554
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    • 2003
  • The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

Effect of Sn Addition on the Fatigue Properties of Al-Cu-Mn Cast Alloy (Al-Cu-Mu 주조합금의 피로성질에 미치는 Sn 첨가의 영향)

  • Kim, Kyung-Hyun;Kim, Jeung-Dae;Kim, In-Bae
    • Korean Journal of Materials Research
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    • v.12 no.4
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    • pp.248-253
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    • 2002
  • Effect of Sn addition on the fatigue properties of Al-Cu-Mn cast alloy was investigated by low and high cycle fatigue tests. Fatigue life showed the maximum value of 5450cycles in the Al-Cu-Mn alloy containing 0.10%Sn, but decreased rapidly beyond 0.20% of Sn additions. It was found that the fatigue strength was 132MPa and fatigue ratio was 0.31 in the alloy containing 0.10%Sn. Metallographic observation revealed that the fatigue crack initiated at the surface and propagated along the grain boundary. This propagation path was attributed to the presence of PFZ along the grain boundary. The tensile strength increased from 330MPa in 7he Sn-free Al-Cu-Mn cast alloy to 429MPa in the alloy containing 0.10%Sn. But above 0.20%Sn additions, tensile strength was decreased by the segregation of Sn.

The Properties and Processing of Bismuth and Indium Added Sn-Cu-Ni Solder Alloy System (Bi, In을 함유한 Sn-Cu-Ni계 솔더 합금 제조와 물성)

  • 박종원;최정철;최승철
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.1
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    • pp.21-28
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    • 2002
  • Bismuth and Indium added Sn-Cu-Ni solder alloy was investigated for a new lead free solder. The thermal, electrical and mechanical properties were characterized for the Sn-0.7%(Cu+Ni) solder alloy by adding 2~5% Bi and 2~ 10% In. The melting point of solder alloy was in range of 200 to $222^{\circ}C$ and the mushy zone was in range of 20 to $37^{\circ}C$. This alloys could be adapted to middle and high temperature solder materials. A new solder alloy composition. Sn-0.7%(Cu+Ni) -3.5%Bi-2%In is very promising with high performance and effective cost. The melting point was $220^{\circ}C$, the mushy zone range was $25^{\circ}C$, and mechanical, electrical and wetting properties were competitive with those of other lead-free solder except the lower elongation value.

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Alloy Design and Powder Manufacturing of Al-Cu-Si alloy for Low-Temperature Aluminum Brazing (저온 알루미늄 브레이징용 Al-Cu-Si-Sn 합금 설계 및 분말 제조)

  • Heeyeon Kim;Chun Woong Park;Won Hee Lee;Young Do Kim
    • Journal of Powder Materials
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    • v.30 no.4
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    • pp.339-345
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    • 2023
  • This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.