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http://dx.doi.org/10.4313/JKEM.2003.16.6.549

Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P  

신영의 (중앙대학교 기계공학과)
황성진 (중앙대학교 기계공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.16, no.6, 2003 , pp. 549-554 More about this Journal
Abstract
The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.
Keywords
Lead-free Solder; Solderability; Wetting balance test; Intermetallic compound(IMC);
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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