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http://dx.doi.org/10.3740/MRSK.2003.13.2.133

Characteristics of Electroplated Sn-2.5Cu Alloy Layers for Surface Finishing  

Kim, Ju-Youn (Division of Materials Science and Engineering, Hanyang University)
Bae, Kyoo-Sik (Department of Electronic Materials Engineering, The University of Suwon)
Publication Information
Korean Journal of Materials Research / v.13, no.2, 2003 , pp. 133-136 More about this Journal
Abstract
Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.
Keywords
Sn-Cu alloy; Electroplating; Surface finishing materials; surface roughness; adhesion strength.;
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