• Title/Summary/Keyword: Smart-chip

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Implementation of IEEE 1451 based ZigBee Smart Sensor System for Active Telemetries (능동형 텔레매트릭스를 위한 IEEE 1451 기반 ZigBee 스마트 센서 시스템의 구현)

  • Lee, Suk;Song, Young-Hun;Park, Jee-Hun;Kim, Man-Ho;Lee, Kyung-Chang
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.2
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    • pp.176-184
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    • 2011
  • As modern megalopolises become more complex and huge, convenience and safety of citizens are main components for a welfare state. In order to make safe society, telemetrics technology, which remotely measures the information of target system using electronic devices, is an essential component. In general, telemetrics technology consists of USN (ubiquitous sensor network) based on a wireless network, smart sensor, and SoC (system on chip). In the smart sensor technology, the following two problems should be overcome. Firstly, because it is very difficult for transducer manufacturers to develop smart sensors that support all the existing network protocols, the smart sensor must be independent of the type of networking protocols. Secondly, smart sensors should be modular so that a faulty sensor element can be replaced without replacing healthy communication element. To solve these problems, this paper investigates the feasibility of an IEEE 1451 based ZigBee smart sensor system. More specifically, a smart sensor for large network coverage has been developed using ZigBee for active telemetrics.

Design of Smart Frame SoC to support the IoT Services (IoT 서비스를 지원하는 Smart Frame SoC 설계)

  • Yang, Dong-hun;Hwang, In-han;Kim, A-ra;Guard, Kanda;Ryoo, Kwang-ki
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.10a
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    • pp.503-506
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    • 2015
  • In accordance with IoT(Internet of Things) commercialization, the need to design SoC-based hardware platform with wireless communication is increasing. This paper therefor proposes an SoC platform architecture with Smart Frame System inter-communicating between devices. Wireless communication functions and high-performance real-time image processing hardware structure was applied to existing digital photo frame. We developed a smart phone application to control the smart frame through Bluetooth communication. The SoC platform hardware consists of CIS controller, Memory controller, ISP(Image Signal Processing) module for image scaling, Bluetooth Interface for inter-communicating between devices, VGA/TFT-LCD controller for displaying video. The Smart Frame System to support the IoT services was implemented and verified using HBE-SoC-IPD test board equipped with Virtex4 XC4VLX80 FPGA. The operating frequency is 54MHz.

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Hybrid Multi-System-on-Chip Architecture as a Rapid Development Approach for a High-Flexibility System

  • Putra, Rachmad Vidya Wicaksana;Adiono, Trio
    • IEIE Transactions on Smart Processing and Computing
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    • v.5 no.1
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    • pp.55-62
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    • 2016
  • In this paper, we propose a hybrid multi.system-on-chip (H-MSoC) architecture that provides a high-flexibility system in a rapid development time. The H-MSoC approach provides a flexible system-on-chip (SoC) architecture that is easy to configure for physical- and application-layer development. The physical- and application-layer aspects are dynamically designed and modified; hence, it is important to consider a design methodology that supports rapid SoC development. Physical layer development refers to intellectual property cores or other modular hardware (HW) development, while application layer development refers to user interface or application software (SW) development. H-MSoC is built from multi-SoC architectures in which each SoC is localized and specified based on its development focus, either physical or application (hybrid). Physical HW development SoC is referred to as physical-SoC (Phy-SoC) and application SW development SoC is referred to as application-SoC (App-SoC). Phy-SoC and App-SoC are connected to each other via Ethernet. Ethernet was chosen because of its flexibility, high speed, and easy configuration. For prototyping, we used a LEON3 SoC as the Phy-SoC and a ZYNQ-7000 SoC as the App-SoC. The proposed design was proven in real-time tests and achieved good performance.

A Fabrication and Testing of New RC CMOS Oscillator Insensitive Supply Voltage Variation

  • Kim, Jin-su;Sa, Yui-hwan;Kim, Hi-seok;Cha, Hyeong-woo
    • IEIE Transactions on Smart Processing and Computing
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    • v.5 no.2
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    • pp.71-76
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    • 2016
  • A controller area network (CAN) receiver measures differential voltage on a bus to determine the bus level. Since 3.3V transceivers generate the same differential voltage as 5V transceivers (usually ${\geq}1.5V$), all transceivers on the bus (regardless of supply voltage) can decipher the message. In fact, the other transceivers cannot even determine or show that there is anything different about the differential voltage levels. A new CMOS RC oscillator insensitive supply voltage for clock generation in a CAN transceiver was fabricated and tested to compensate for this drawback in CAN communication. The system consists of a symmetrical circuit for voltage and current switches, two capacitors, two comparators, and an RS flip-flop. The operational principle is similar to a bistable multivibrator but the oscillation frequency can also be controlled via a bias current and reference voltage. The chip test experimental results show that oscillation frequency and power dissipation are 500 kHz and 5.48 mW, respectively at a supply voltage of 3.3 V. The chip, chip area is $0.021mm^2$, is fabricated with $0.18{\mu}m$ CMOS technology from SK hynix.

A Monolithic Integration with A High Density Circular-Shape SOI Microsensor and CMOS Microcontroller IC (CMOS Microcontroller IC와 고밀도 원형모양SOI 마이크로센서의 단일집적)

  • Mike, Myung-Ok;Moon, Yang-Ho
    • Journal of IKEEE
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    • v.1 no.1 s.1
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    • pp.1-10
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    • 1997
  • It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

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Clothing Management System Using the Smart Hanger Embedded RFID (RFID가 내장된 스마트 옷걸이를 이용한 의류 관리 시스템)

  • Chung, Sung Boo
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.8
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    • pp.185-194
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    • 2014
  • In this paper, we proposed the clothing management system using the smart hanger. Proposed system consists of smart hanger, base module, and server, and the smart hanger consists of MCU, LED, RFID reader, RF chip, ring sensor, and battery. The smart hanger reads the RFID tag attached to the clothes and wirelessly transmitted to the server. The server associated base module communicates with the smart hanger and transmits information to the server. The server manages clothing through the DB, and can display various information through the web page and the smart phone. In order to verify the usefulness of the proposed system, we did experiment with the management system for clothing store and laundry where using a lot of hangers. Performance tests of the smart hanger are applied to check the current consumption and can be predicted the battery life with the proposed low power algorithm. The clothing store management system can be increased sales and convenience of the consumer. The laundry management system can be increased the efficiency of laundry category and convenience of the consumer.

Designing Smart-tag based Logistics System with Intelligent Track and Trace Service

  • Oh, Se-Won;Park, Joo-Sang;Lee, Yong-Joon
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 2003.09a
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    • pp.244-247
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    • 2003
  • All over the value chain, a logistics information system must satisfy several requirements about gathering and sharing related information. For example, distributors or forwarders need up-to-date information for scheduling and managing their logistics resources. Meanwhile, consignors or consignees want to know the dynamic information about current states or location of their goods. Such information is dependent upon the quality of data sets collected throughout the logistics processes. Thus, gathering accurate data promptly is the essential factor for the success of a logistics information system. However, there are limits in reducing both time-gap and man-power for datn sourcing, since this process is done manually or by using bar codes and scanning devices. Smart-tag can be the alternative to such n time-consuming and inefficient operation, especially for handling piles of goods. The tag includes a micro-chip containing data which is remotely readable by readers with antenna. Logistics system with Smart tag can provide all the information anywhere and anytime, and it will increase the efficiency of logistics and satisfaction of users. In this paper, we propose a conceptual architecture for smart-tag based logistics system and describe its functions.

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Development of Power Amplifier for Piezoelectric Actuator and Control Algorithm Realization System for Active Vibration Control of Structures (구조물 능동진동제어를 위한 압전 작동기 구동 파워앰프와 제어 알고리즘 구현 시스템의 개발)

  • Lee, Wan-Joo;Kwak, Moon-K.
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.22 no.2
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    • pp.170-178
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    • 2012
  • This paper is concerned with the development of power amplifier and controller for piezoelectric actuator and sensor used in smart structures. Even though a high-voltage power amplifier is provided in the form of an operational amplifier, a very high DC voltage is still necessary as a power supply. In this study, we propose a low-cost design for the power amplifier including the DC power supply. We also need a controller on which a control algorithm will be mounted. In general, a digital signal processing chip is popularly used because of high speed. However, only commercial product is available for smart structure applications. In this paper, a controller consisting of a DSP and electronic circuits suitable for piezoelectric sensor and actuator pair is proposed. To validate the proposed controller with power amplifier, experiment on smart structure was carried out. The experimental results show that the proposed control system can be effectively used for smart structure applications with low cost.

A Study on MT-Serpent Cryptographic Algorithm Design for the Portable Security System (휴대용 보안시스템에 적합한 MT-Serpent 암호알고리즘 설계에 관한 연구)

  • Lee, Seon-Keun;Jeong, Woo-Yeol
    • Journal of the Korea Society of Computer and Information
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    • v.13 no.6
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    • pp.195-201
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    • 2008
  • We proposed that is suitable network environment and wire/wireless communication network, easy of implementation, security level preservation, scalable & reconfigurable to TCP/IP protocol architecture to implement suitable smart card MS-Serpent cryptographic algorithm for smart card by hardware base chip level that software base is not implement. Implemented MT-Serpent cryptosystem have 4,032 in gate counter and 406.2Mbps@2.44MHz in throughput. Implemented MS-Serpent cryptographic algorithm strengthens security vulnerability of TCP/IP protocol to do to rescue characteristic of smart card and though several kind of services are available and keep security about many user in wire/wireless environment, there is important purpose.

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A Polymer-based Capacitive Air Flow Sensor with a Readout IC and a Temperature Sensor

  • Kim, Wonhyo;Lee, Hyugman;Lee, Kook-Nyeong;Kim, Kunnyun
    • Journal of Sensor Science and Technology
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    • v.28 no.1
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    • pp.1-6
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    • 2019
  • This paper presents an air flow sensor (AFS) based on a polymer thin film. This AFS primarily consists of a polymer membrane attached to a metal-patterned glass substrate and a temperature-sensing element composed of NiCr. These two components were integrated on a single glass substrate. The AFS measures changes in capacitance caused by deformation of the polymer membrane based on the air flow and simultaneously detects the temperature of the surrounding environment. A readout integrated circuit (ROIC) was also fabricated for signal processing, and an ROIC chip, 1.8 mm by 1.9 mm in size, was packaged with an AFS in the form of a system-in-package module. The total size of the AFS is 1 by 1 cm, and the diameter and thickness of the circular-shaped polymer membrane are 4 mm and $15{\mu}m$, respectively. The rate of change of the capacitance is approximately 11.2% for air flows ranging between 0 and 40 m/s.