• Korean Journal of Computational Design and Engineering
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• v.22 no.2
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• pp.181-189
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• 2017

In this paper, we develop a human error-free wire connection guide system. The only related work is Japanese patent by Hitachi. The patent is guiding the wire connection using PC server. And no implementation details have been reported publicly. We propose a new method based on smart mobile devices. The proposed methods are registered as two Korean patents. We implement a prototype wire connection guide system to verify the patents. Through human experiments, we verify the system can reduce the human error more than 90% and speed up the connection process more than twice faster than working without the system. To be used in the industrial fields, the prototype system needs more product packaging works.

• Food Science and Industry
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• v.43 no.3
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• pp.2-13
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• 2010

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.35-41
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• 2022

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.56 no.4
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• pp.512-519
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• 2023

Pacific oysters Crassostrea gigas are a popular shellfish in the Republic of Korea. However, due to their abundant moisture and nutrient content, oysters are susceptible to microbiological growth and biochemical changes, which lead to quality degradation. Therefore, the present study aimed to investigate the effectiveness of modified atmosphere packaging (MAP) in maintaining the quality of raw oysters during storage. Microbiological and physicochemical parameters such as pH, glycogen content, soluble protein, turbidity, and volatile basic nitrogen (VBN) were analyzed for oysters stored under various gas compositions and storage periods. The results showed that there was no significant increase in viable cell count in MAP oysters after six days in MAP oysters. Moreover, the physicochemical quality of non-MAP oysters deteriorated rapidly, whereas the quality of MAP oysters were maintained during storage. This study suggests that MAP can be an effective technique for maintaining the freshness of raw oysters during distribution and storage, and may also be useful for extending the shelf-life and maintaining the quality of other seafood products.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.20-34
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• 2023

Single or multi-layered two-dimensional (2D) materials, with thicknesses in the order of a few nanometers, have garnered substantial attention across diverse research domains owing to their distinct properties, including electrical conductivity, flexibility, and optical transparency. These materials are frequently subjected to repetitive mechanical actions in applications like electronic skin (E-Skin) and smart textiles. Moreover, they are often exposed to external factors like temperature, humidity, and pressure, which can lead to a deterioration in component durability and lifespan. Consequently, significant research efforts are directed towards developing self-healing properties in these components. Notably, recent investigations have revealed promising outcomes in the field of self-healing composite materials, with Ti₃Ci₂Ti_x MXene being a prominent component among the myriad of available 2D materials. In this paper, we aim to introduce various synthesis methods and characteristics of Ti₃Ci₂Ti_x MXene, followed by an exploration of self-healing application technologies based on Ti₃Ci₂Ti_x MXene.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.88-93
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• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

• The Korean Journal of Applied Statistics
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• v.34 no.1
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• pp.99-114
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• 2021

With the Fourth Industrial Revolution based on new technology, the semiconductor manufacturing industry researches various analysis methods such as detecting process abnormalities and predicting yield based on equipment sensor data generated in the manufacturing process. The semiconductor manufacturing process consists of hundreds of processes and thousands of measurement processes associated with them, each of which has properties that cannot be defined by chemical or physical equations. In the individual measurement process, the actual measurement ratio does not exceed 0.1% to 5% of the target product, and it cannot be kept constant for each measurement point. For this reason, efforts are being made to determine whether to manage by using equipment sensor data that can indirectly determine the normal state of each step of the process. In this study, the Functional Data Analysis (FDA) was proposed to define a process abnormality detection process based on equipment sensor data and compensate for the disadvantages of the currently applied statistics-based diagnosis method. Anomaly detection accuracy was compared using machine learning on actual field case data, and its effectiveness was verified.

• The monthly packaging world
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• s.230
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• pp.92-99
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• 2012

KOREA STAR AWARDS는 패키징 $\triangle$완제품 $\triangle$재료(플라스틱, 종이 판지, 금속, 유리, 목재, 복합소재) $\triangle$친환경 $\triangle$기계(설비) 및 관련 부품 $\triangle$ 인쇄(라벨링) $\triangle$부자재 $\triangle$생산 및 가공공정 $\triangle$패키징 디자인 등의 분야에서 신기술 개발과 지속가능성을 통해 패키징 산업 발전에 기여한 기업, 그리고 패키징 관련 정책연구, 기술개발, 패키징산업 육성에 기여한 개인에게 시상. 2012 KOREA STAR AWARDS는 코리아스타상(기업, 학생, 공로부문)으로 지식경제부장관상(상장4점, 표창2점), 한국생산기술연구원장상(상장 12점, 표창1점), 한국포장기술사회장상(상장 20점) 총 39점 시상. 코리아스타상 기업부문 지식경제부장관상은 '에이스기계 종이상자 자동접착기의 패스트 폴딩 장치', 'LG생활건강 이자녹스 SMART 진동시리즈', '삼성전자 냉장고 친환경 재사용 포장', '한국에이버리 친환경 수분리성 점착라벨' 4개 제품 수상. 코리아스타상 공로부문 지식경제부장관표창은 (주)경연전람 김영수 대표와 김수일포장개발연구소 김수일 소장 수여. 본 고에서는 "2011 미래패키징 신기술 정부포상" 수상작들의 패키징 동향 및 유공자들의 공적 내용을 살펴보도록 한다.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.1-9
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• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.1-12
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• 2022

With the rapid development of artificial intelligence technology that gives existing sensors functions similar to human intelligence is drawing attention. Previously, researches were mainly focused on an improvement of fundamental performance indicators as sensors. However, recently, attempts to combine artificial intelligence such as classification and prediction with sensors have been explored. Based on this, intelligent sensor research has been actively reported in almost all kinds of sensing fields such as disease detection, motion detection, and gas sensor. In this paper, we introduce the basic concepts, types, and driving mechanisms of artificial intelligence and review some examples of its use.