• 한국초지조사료학회지
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• 제41권4호
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• pp.280-286
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• 2021

The objective of this study was to prove the effect of pig slurry application with charcoal on nitrogen use efficiency (NUE), feed value and ammonia (NH₃) emission from maize forage. The four treatments were applied: 1) non-pig slurry (only water as a control), 2) only pig slurry application (PS), 3) pig slurry application with large particle charcoal (LC), 4) pig slurry application with small particle charcoal (SC). The pig slurry was applied at a rate of 150 kg N ha^-1, and the charcoal was applied at a rate of 300 kg ha-1 regardless of the size. To determine the feed value of maize, crude protein, dry matter intake, digestible dry matter, total digestible nutrient, and relative feed value were investigated. All feed value was increased by charcoal treatment compared to water and PS treatment. Also, the NUE for plant N was significantly higher in charcoal treatments (LC and SC) compared to PS treatment. On the other hand, there is no significant difference for feed value and NUE between LC and SC. The NH₃ emission was significantly reduced 15.2% and 27.9% by LC and SC, respectively, compared to PS. Especially, SC significantly decreased NH₃ emission by 15% compared to LC. The present study clearly showed that charcoal application exhibited positive potential in nitrogen use efficiency, feed value and reducing N losses through NH₃ emission.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.335-338
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-layer dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding $1\;{\mu}m$ in size, which could cause micro-scratch on the wafer surface. In this paper, we have studied aging effect the of CMP sin as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1288-1291
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• 2004

In this study, physical characteristics of alumina slurry on variation of pH value and the effect of non-ionic surfactants on alumina slurry for copper chemical mechanical planarization (CMP) slurry have been investigated. After pH value of the slurry with alumina abrasive was changed by adding various amount of $HNO^3$ or KOH, the differences of settling rate, particle size, and zeta-potential were estimated. Better settling rates were shown in slurries with alumina abrasive at near pH 1. Higher zeta-potential was shown at around pH 2 in alumina slurry and the point of zero charge (PZC) was measured at about pH $9\sim10$. Non-ionic surfactant was added in the slurry with 5wt% alumina abrasive to get its effect on slurry practically. Abrasive size was smaller increased when amount of surfactant increased in slurry with P-4 as abrasive; on the other side, it was smaller when amount of surfactant decreased with AES-12. Variation of zeta-potential has no tendency with adding surfactant; however, values of zeta-potential were between $35\sim50mV$. The proper amount of surfactant was $0.1\sim1.0wt%$ in slurry with P-4 and $0.5\sim1.0wt%$ in slurry with AES-12 respectively. Excellent dispersion stabilization was obtained by addition of non-ionic surfactant

• 한국재료학회지
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• 제34권1호
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• pp.27-33
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• 2024

Al₂O₃ has excellent sintering properties and is important in semiconductor manufacturing processes that require high-temperature resistance and chemical inertness in a plasma environment. In this study, a comprehensive analysis of the chemical characteristics, physical properties, crystal structure, and dispersion stability of three commercially available Al₂O₃ powders was conducted. The aim was to provide a technological foundation for selecting and utilizing appropriate Al₂O₃ powders in practical applications. All powders exhibited α-Al₂O₃ as the main phase, with the presence of beta-phase Na₂O-11Al₂O₃ as the secondary phase. The highest Na⁺ ion leaching was observed in the aqueous slurry state due to the presence of the secondary phase. Although the average particle size difference among the three powders was not significant, distinct differences in particle size distribution were observed. ALG-1SH showed a broad particle size distribution, P162 exhibited a bimodal distribution, and AES-11 displayed a uniform unimodal distribution. High-concentration Al₂O₃ slurries showed differences in viscosity due to ion release when no dispersant was added, affecting the electrical double-layer thickness. Polycarboxylate was found to effectively enhance the dispersion stability of all three powders. In the dispersion stability analysis, ALG-1SH exhibited the slowest sedimentation tendency, as evidenced by the low TSI value, while P162 showed faster precipitation, influenced by the particle size distribution.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권11호
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• pp.551-555
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• 2004

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

• 한국전기전자재료학회논문지
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• 제28권12호
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• pp.792-796
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• 2015

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed 'Modified slurry preparation process' to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

• 설비공학논문집
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• 제15권5호
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• pp.352-359
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• 2003

The present study has been conducted for manufacturing MPCM (microencapsulated phase change material) slurry with in-situ polymerization and proving their applicabilities for tooling system. The surface of MPCM is composed of melamine, while tetradecane, paraffin wax, is centered in the MPCM. The produced capsules are observed by the optical microscope and SEM for superficial shapes. Their thermal properties are measured by DSC. Their size distributions are observed by FA particle analyzer. A narrow size distribution from 1 to 10 ${\mu}{\textrm}{m}$ with 5 ${\mu}{\textrm}{m}$ of average diameter was observed. Melting temperature was 6.7$^{\circ}C$. The durability of MPCM was tested with various types of pump such as centrifugal, peristaltic, and mono pumps. During 10000 cycles the fraction of broken capsules was smaller than 6% for the centrifugal and peristaltic pumps, while bigger value of 8% for the mono pump. A cooling system, which adopted MPCM slurry as a media for transporting cold thermal energy, was designed to investigate the performance of the MPCM. The discharging times of 10 and 20 wt% MPCM slurry were lasted up to 105 and 285 minutes longer, respectively, than the water cooling system.

• 대한기계학회논문집A
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• 제38권9호
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• pp.1037-1041
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• 2014

반도체 연마용 슬러리를 이온교환법, 가압방법 및 다단계 주입방법으로 제조하여 입자 크기와 형상에 따른 화학적 기계적 연마에 미치는 영향을 연구하였다. 이온교환법을 이용하여 구형의 콜로이달실리카를 크기별로 입자로 제조하였다. 이렇게 제조한 구형의 실리카를 다시 가압방법을 이용해 입자간의 결합을 유도해 비구형의 형상을 가진 콜로이달 실리카를 제조하였고, 이온교환법과 가압방법의 특징을 살려 실리식산을 다단계로 주입하여 입자 표면과 실리식산의 반응으로, 2~3 개의 입자가 결합한 형상의 콜로이달 실리카를 제조하였다. 이렇게 제조한 입자를 CMP 에 적용하여 콜로이달 실리카의 입자 형상에 따른 연마율을 기존의 상용 슬러리와 비교하였다. pH 가 높을수록 연마율은 높아졌고, 입자가 결합한 비구형의 콜로이달 실리카는 가장 높은 연마율과 양호한 비균일도를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.707-710
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• 2004

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). In this paper, we have investigated slurry properties and CMP performance of silicon dioxide (oxide) as a function of different temperature of slurry. Thermal effects on the silica slurry properties such as pH, particle size, conductivity and zeta potential were studied. Moreover, the relationship between the removal rate (RR) with WIWNU and slurry properties caused by changes of temperature were investigated. Therefore, the understanding of these temperature effects provides a foundation to optimize an oxide CMP Process for ULSI multi-level interconnection technology.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.50-50
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• 2007

최근 DRAM 소자 내에서 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 고유전체와의 높은 안정성등과 같은 특성으로 인해 금속층-유전막(insulator)-금속층 캐패시터에 대한 하부전극으로 각광받고 있다. 일반적으로 Ru은 화학적으로 매우 안정하여 습식 식각으로 제거하기 어려우며, 이로인해 건식 식각을 이용하여 Ru을 제거하는 것이 널리 통용되고 있다. 하지만 칵 캐패시터의 분리를 위해 Ru을 건식 식각할 경우, 유독한 $Ru0_4$ 가스가 발생할 수 있으며 Ru 하부전극의 탈균일한 표면과 몰드 산화막의 손실을 유발할 수 있다. 이로인해 각 캐패시터간의 분리와 평탄화를 위해 CMP 공정이 도입되게 되었다. 이러한 CMP 공정에 공급되는 슬러리에는 부식액, pH 적정제, 연마입자등이 첨가되는데 이때 연마입자가 응집하여 슬러리의 분산 안정성 저하에 영향을 줄 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 surfactant와 같은 첨가제에 따른 zeta potential, particle size, sedimentation의 분석을 통해 slurry 안정성에 대란 영향을 살펴보았다. 또한 선택된 surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru의 removal rate와 TEOS에 대한 selectivity를 측정해 보았다.