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http://dx.doi.org/10.3795/KSME-A.2014.38.9.1037

A Study on CMP Characteristics According to Shape of Colloidal Silica Particles  

Kim, Moonsung (School of Mechanical Engineering, Pusan Nat'l Univ.)
Jeong, Haedo (School of Mechanical Engineering, Pusan Nat'l Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.38, no.9, 2014 , pp. 1037-1041 More about this Journal
Abstract
Slurry used for polishing semiconductors processed by exchange, pressurization, and multi-step feeding has been studied to investigate the effect of the size and shape of slurry particles on the oxide CMP removal rate. First, spherical silica sol was prepared by the ion exchange method. The spherical silica particle was used as a seed to grow non-spherical silica sol in accordance with the multi-step feeding of silicic acid by the ion exchange and pressurization methods. The oxide removal rate of both non-spherical silica sol and commercially available slurry were compared with increasing average particle size in the oxide CMP. The more alkaline the pH level of the non-spherical silica sol, the higher was the removal rate and non-uniformity.
Keywords
Colloidal Silica; Silica Sol; CMP; Slurry; Removal Rate;
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Times Cited By KSCI : 1  (Citation Analysis)
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