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Park, S. W., Kim, S. Y and Seo, Y. J., 2002, "Optimization of Double polishing pad for STI-CMP Applications," Trans. of the KIEE, Vol. 51C, No. 7, pp. 311-315.
과학기술학회마을
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5 |
Lee, W. S., Seo, Y. J., Kim, S.Y and Chang, E. K., 2001, "A Study on the Nitride Residue and pad Oxide Damage of Shallow Trench Isolation(STI)-Chemical Mechanical Polishing(CMP) Process," Trans. of the KIEE, Vol. 50C, No. 9, pp. 438-443.
과학기술학회마을
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6 |
Kim, S. Y., Seo, Y. J., Kim, T. H., Lee, W. S., Kim, C. I and Chang, E. G., 1998, "An Optimized Nitride Residue Phenomena of Shallow Trench Isolation(STI) Process by Chemical Mechanical Polishing(CMP)," IUMRS-ICEM-98, p. 468.
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