A Study on the Recycling of Silica Slurry Abrasives by Filtering

필터링에 의한 실리카 슬러리 연마제의 재활용에 관한 연구

  • 서용진 (대불대학교 전기전자공학과) ;
  • 박성우 (대불대학교 전기전자공학과) ;
  • 이우선 (조선대학교 전기공학과)
  • Published : 2004.11.01

Abstract

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

Keywords

References

  1. F. B. Kaufman, D. B. Thompson, R. E. Broadie, M. A. Jaso, W. L. Gutherie, D. J.. Pearson and M. B. Small, 'Chemical Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects', J. Electrochem. Soc., Vol. 138, No. 11, p, 3460, 1991 https://doi.org/10.1149/1.2085434
  2. Y. J. Seo, S. W. Park, S. Y. Jeong, W. S. Choi, and S. Y. Kim, 'Slurry Induced Metallic Contaminations on Different Silicate Oxides by as-deposited and Post-CMP Cleaning', Proceedings of Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMF-MIC-2001), Santa Clara, CA. USA. (Mar. 5-9, 2001). pp, 287-290, 2001
  3. Y. J. Seo, S. Y. Kim, W. S. Lee, 'Optimization of pre-metal dielectric(PMD) materials', Journal of Materials Science : Materials in Electronics, Vol. 12, No. 9, pp, 551-554, 2001 https://doi.org/10.1023/A:1012461728470
  4. B. Wihters, E. Zhao, W. Krusell, R. Jairath and S. Hosale, 'Wide Margin CMP for STI', Solite Technology, p. 173, 1998
  5. Woo-Sun Lee, Sang-Young Kim, Yong-Jin Seo, Jong-Kook Lee, 'An Optimization of Tungsten Plug Chemical Mechanical Polishing (CMP) using Different Consumables' , Journal of Materials Science, Vol. 12, No.1, p. 63-68, 2001 https://doi.org/10.1023/A:1011276830620
  6. G. B. Basim, J. J. Adler, U. Mahajan, R. K. Singh, and B. M. Moudgil, 'Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects', J. Electrochem. Soc., Vol. 147, No. 9, p. 3523-3528, 2000 https://doi.org/10.1149/1.1393931AdditionalInformation
  7. A. jinda, S. Hegde, S. V. Babu, 'Chemical Mechanical Polishing Using Mixed Abrasive Slurry', Electrochemical and Solid-State Letters, Vol. 5, No.4, p. G48, 2002 https://doi.org/10.1149/1.1479297
  8. H. J. Kim, D. H. Eom and J. G. Park, 'Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry', Jpn. J. Appl. Phys., Vol. 40, pp. 1236-1239, 2001 https://doi.org/10.1143/JJAP.40.1236