• ETRI Journal
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• v.29 no.4
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• pp.452-456
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• 2007

Very compact 4-channel 200-GHz-spacing external cavity lasers (ECLs) were fabricated by hybrid integration of reflection gratings and superluminescent laser diodes on a planar lightwave circuit chip. The fifth-order gratings as reflection gratings were formed using a conventional contact-mask photo-lithography process to achieve low-cost fabrication. The lasing wavelength of the fabricated ECLs matched the ITU grid with an accuracy of ${\pm}0.1$ nm, and optical powers were more than 0.4 mW at the injection current of 80 mA for all channels. The ECLs showed single mode operations with more than 30 dB side lobe suppression.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.8-12
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• 2002

Since the high performance analog-to-digital converter can be built with Rapid Single Flux Quantum (RSFQ) logic circuits the development of superconductive analog-to-digital converter has attracted a lot of interests as one of the most prospective area of the application of Josephson Junction technology. One of the main advantages in using Rapid Sng1e Flux Quantum logic in the analog-to-digital converter is the low voltage output from the Josephson junction switching, and hence the high resolution. To design an analog-digital converter, first we have used XIC tool to compose a circuit schematic, and then studied the operational principle of the circuit with WRSPICE tool. Through this process, we obtained the proper circuit diagram of an 1-bit analog-digital converter circuit. The optimized circuit was laid out as a mask drawing. Inductance values of the circuit layout were calculated with L-meter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.40-43
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• 1996

Substrates of SAW filter are mainly single crystal such as LiNbO$_3$, LiTaO$_3$. However, fabrication of crystal is difficult and cost is very high. In this study, crystal was substituted for piezoelectric ceramics which has simple fabrication process. The same SAW filter mask was photolithographed on crystal(LiNbO$_3$) substrate and ceramic(PZT4, PZT5A and PZT8) substrate in order to compare experimental value with theoretical value. The difference of center frequency was only 3.7%. PZT8 showed good bandwidth properties. It is considered that PZT8 has higher mechanical quality factor and propagation velocity than PZT4, PTT5A.

• Journal of Information Display
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• v.5 no.2
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• pp.1-5
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• 2004

We developed an a-Si TFT-LCD panel with integrated gate driver circuit using a standard 5-MASK process. To minimize the effect of the a-Si TFT current and LC's capacitance variation with temperature, we developed a new a-Si TFT circuit structure and minimized coupling capacitance by changing vertical architecture above gate driver circuit. Integration of gate driver circuit on glass substrate enables single chip and 3-side free panel structure in a-Si TFT-LCD of QVGA ($240{\times}320$) resolution. And using double ASG structure the dead space of TFT-LCD panel could be further decreased.

• Progress in Superconductivity and Cryogenics
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• v.6 no.4
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• pp.41-45
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• 2004

Rapid Single flux quantum (RSFQ) confluence buffer is widely used in complex superconductive digital circuits. In this work, we have improved the currently used confluence buffer and obtained a more soundly designed confluence buffer. In simulations, improvements in the bias margins of 11 % and the global margins of 10%, compared to the previously used confluence buffer, were achieved. Global margins are very important in estimating a process error range allowed in fabrications. We used two circuit simulation tools, WRspice and Julia, to design and optimize the confluence buffer. We used Xic to obtain a mask layout. We fabricated the improved circuits by using Nb technology. The test results at low frequency showed that the improved confluence buffer operated correctly and had a very wide main bias margin of +/-43% enhanced from +/-26% of the previously used confluence buffer.

• Applied Chemistry for Engineering
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• v.22 no.2
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• pp.230-234
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• 2011

In this work, the primary material for a single layered hardmask which can afford a spin-on process was prepared by the minture of organic and inorganic sources. The preparation of hybrid polymer was attempted by esterification from silanol terminated siloxane compounds and acetonide-2,2-bis(methoxy)propionic acid. The optical, thermal and morphological properties of the test hardmask film was examined in terms of cross-linking agent and additives. In addition, the etch rate of hardmask film and photo resist layer were compared. The hybrid polymer prepared from organic and inorganic materials was found to be useful for hardmask film to form the nano-patterns.

• ETRI Journal
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• v.35 no.3
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• pp.459-468
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• 2013

A novel integrated laser, that is, a distributed reflector laser diode integrated with an electroabsorption modulator, is proposed to improve the output efficiency, single-mode stability, and chirp. The proposed laser can be realized using the selective metalorganic vapor phase epitaxy technique (that is, control of the width of the insulating mask), and its fabrication process is almost the same as the conventional electroabsorption modulated laser (EML) process except for the asymmetric coupling coefficient structure along the cavity. For our analysis, an accurate time-domain transfer-matrix-based laser model is developed. Based on this model, we perform steady-state and large-signal analyses. The performances of the proposed laser, such as the output power, extinction ratio, and chirp, are compared with those of the EML. Under 10-Gbps NRZ modulation, we can obtain a 30% higher output power and about 50% lower chirp than the conventional EML. In particular, the simulation results show that the chirp provided by the proposed laser can appear to have a longer wavelength side at the leading edge of the pulse and a shorter wavelength side at the falling edge.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.395-400
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• 2005

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.20-25
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• 2010

An integrated Mach-Zehnder interferometric sensor operating at 632.8 nm was designed and fabricated by the technology of planar rib waveguides. Rib waveguide based on silica system ($SiO_2-SiO_xN_y-SiO_2$) was geometrically designed to have single mode operation and high sensitivity. It was structured by semiconductor fabrication processes such as thin film deposition, photolithography, and RIE (Reactive Ion Etching). With the power observation, propagation loss measurement by cut-back method showed about 4.82 dB/cm for rib waveguides. Additionally the chromium mask process for an etch stop was employed to solve the core damaging problem in patterning the sensing zone on the chip. Refractive index measurement of water/ethanol mixture with this device finally showed a sensitivity of about $\pi$/($4.04{\times}10^{-3}$).

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.259-267
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• 2002

We present a novel 3D fabrication method with single X-ray process utilizing an X-ray mask in which a micro-actuator is integrated. An X-ray absorber is electroplated on the shuttle mass driven by the integrated micro-actuator during deep X-ray exposures. 3D microstructures are revealed by development kinetics and modulated in-depth dose distribution in resist, usually PMMA. Fabrication of X-ray masks with integrated electrothermal xy-stage and electrostatic actuator is presented along with discussions on PMMA development characteristics. Both devices use $20-\mu\textrm{m}$-thick overhanging single crystal Si as a structural material and fabricated using deep reactive ion etching of silicon-on-insulator wafer, phosphorous diffusion, gold electroplating, and bulk micromachining process. In electrostatic devices, $10-\mu\textrm{m}-thick$ gold absorber on $1mm{\times}1mm$ Si shuttle mass is supported by $10-\mu\textrm{m}-wide$, 1-mm-long suspension beams and oscillated by comb electrodes during X-ray exposures. In electrothermal devices, gold absorber on 1.42 mm diameter shuttle mass is oscillated in x and y directions sequentially by thermal expansion caused by joule heating of the corresponding bent beam actuators. The fundamental frequency and amplitude of the electrostatic devices are around 3.6 kHz and $20\mu\textrm{m}$, respectively, for a dc bias of 100 V and an ac bias of 20 VP-P (peak-peak). Displacements in x and y directions of the electrothermal devices are both around $20{\;}\mu\textrm{m}$at 742 mW input power. S-shaped and conical shaped PMMA microstructures are demonstrated through X-ray experiments with the fabricated devices.