1 |
H. Winick, Synchrotron radiation research, H. Winick and S. Doniach, Ed., New York: Plenum Press, 1980, Ch. 2, pp. 11-25
|
2 |
K.-C. Lee and Seung S. Lee, 'Deep X-ray mask with integrated actuator for 3D microfabrication,' in Proc. Pacific Rim Workshop on Transducers and Micro/Nano Technologies, Xiamen, China, 22-24 July 2002, pp. 71-74
|
3 |
Y. Cheng, N.-Y. Kuo, and C. H. Su, 'Dose distribution of synchrotron X-ray penetrating materials of low atomic numbers,' Rev. Sci. Instrum., 68, pp. 180-183, 1997
DOI
ScienceOn
|
4 |
L.-W. Pan, L. Lin, and J. Ni, 'Cylindrical plastic lens array fabricated by a micro intrusion process,' in Technical Digest of the 12th IEEE International Conference on Microelectromechanical Systems (MEMS'99), Orlando, FL, USA, 17-21 January 1999, pp. 217-221
DOI
|
5 |
P. Ruther, B. Gerlach, J. Gottert, M. Ilie, J. Mohr, A. Muller, and C. OBmann, 'Fabrication and characterization of microlenses realized by a modified LIGA process,' Pure. Appl. Opt., 6, pp. 643-653, 1997
DOI
ScienceOn
|
6 |
J. Schulze, W. Ehrfeld, J. HoBfeld, M. Klaus, M. Kufner, S. Kufner, H. Muller, and A. Picard, 'Parallel optical interconnections using self-adjusting microlenses on injection molded ferrules made by LIGA technique,' in Proc. SPlE Vol. 3737, 1999, pp. 562-571
DOI
|
7 |
S. Sugiyama and H. Ueno, 'Novel shaped microstructures processed by deep X-ray lithography,' in Technical Digest of the 2001 International Conference on Solid State Sensors and Actuator (Transducers'01 ), Munich, Germany, 10-14 June 2001, pp. 1574-1577
|
8 |
O. Tabata, N. Matsuzuka, T. Yamaji, and H. You, 'Fabrication of 3-dimensional microstructures using moving mask deep X-ray lithography ' in Technical Digest of the 14th IEEE International Conference on Microelectromechanical Systems (MEMS'01), Interlaken, Switzerland, 21-25 January 2001, pp.94-97
|
9 |
O. Tabata, N. Matsuzuka, T. Yamaji, S. Uemura, and K. Yamamoto, '3D microFabrication by moving mask deep X-ray lithography with multiple stages', in Technical Digest of the 15th IEEE International Conference on Microelectromechanical Systems (MEMS'02), Las Vegs, NV, USA, 20-24 January 2002, pp. 180-183
DOI
|
10 |
W. Ehrfeld and A. Schmidt, 'Recent developmensts in deep X-ray lithography', J. Vac. Sci. Technol. B. 16, pp. 3526-3534, 1998
DOI
ScienceOn
|
11 |
L.-W. Pan and L. Lin, 'Batch transfer of LIGA microstructures by selective electroplating and bonding,' J. of Microelectromech. Syst., 10, pp. 25-32, 2001
DOI
ScienceOn
|
12 |
A. D. Feinerman, R. E. Lajos, V. White, and D. D. Denton, 'X-ray lathe: an X-ray lithographic exposure tool for nonplanar objects,' J. of Microelectromech. Syst., 5, pp. 250-255, 1996
DOI
ScienceOn
|
13 |
T. Katoh, N. Nishi, M. Fukugawa, H. Ueno, and S. Sugiyama, 'Direct writing for three-dimensional micro fabrication using synchrotron radiation etching,' Sensors Actuators A, 89, pp. 10-15, 2001
DOI
ScienceOn
|
14 |
V. White, C. Herdey, D. D. Denton, and J. Song, 'X-ray fabrication of nonorthogonal structures using 'surface' masks,' J. Vac. Sci. Technol. B, 15, pp. 2514-2516, 1997
DOI
ScienceOn
|
15 |
D. Maas, B. Bustgens, J. Fahrenberg, W. Keller, P. Ruther, W. K. Schomburg, and D. Seidel, 'Fabrication of microcomponents using adhesive bonding techniques,' in Technical Digest of the 9th IEEE International Conference on Microelectromechanical Systems (MEMS'96), San Diego, CA, USA, 11-15 February 1996, pp.331-336
DOI
|
16 |
H. Guckel, 'High-aspect-ratio micromachining via deep X-ray lithography,' Proc. of the IEEE, 86, pp. 1586-1593, 1998
DOI
ScienceOn
|
17 |
T. R. Christenson and D. T. Schmale, 'A batch wafer scale LIGA assembly and packaging technique via diffusion bonding,' in Technical Digest of the 12th IEEE International Conference on Microelectromechanical Systems (MEMS'99), Orlando, FL, USA, 17-21 January 1999, pp. 476-481
DOI
|