• Title/Summary/Keyword: Single Junction

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A Study on Implanted and Annealed Antimony Profiles in Amorphous and Single Crystalline Silicon Using 10~50 keV Energy Bombardment (비정질 및 단결정 실리콘에서 10~50 keV 에너지로 주입된 안티몬 이온의 분포와 열적인 거동에 따른 연구)

  • Jung, Won-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.11
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    • pp.683-689
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    • 2015
  • For the formation of $N^+$ doping, the antimony ions are mainly used for the fabrication of a BJT (bipolar junction transistor), CMOS (complementary metal oxide semiconductor), FET (field effect transistor) and BiCMOS (bipolar and complementary metal oxide semiconductor) process integration. Antimony is a heavy element and has relatively a low diffusion coefficient in silicon. Therefore, antimony is preferred as a candidate of ultra shallow junction for n type doping instead of arsenic implantation. Three-dimensional (3D) profiles of antimony are also compared one another from different tilt angles and incident energies under same dimensional conditions. The diffusion effect of antimony showed ORD (oxygen retarded diffusion) after thermal oxidation process. The interfacial effect of a $SiO_2/Si$ is influenced antimony diffusion and showed segregation effects during the oxidation process. The surface sputtering effect of antimony must be considered due to its heavy mass in the case of low energy and high dose conditions. The range of antimony implanted in amorphous and crystalline silicon are compared each other and its data and profiles also showed and explained after thermal annealing under inert $N_2$ gas and dry oxidation.

Analysis of Sensing Mechanisms in a Gold-Decorated SWNT Network DNA Biosensor

  • Ahn, Jinhong;Kim, Seok Hyang;Lim, Jaeheung;Ko, Jung Woo;Park, Chan Hyeong;Park, Young June
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.2
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    • pp.153-162
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    • 2014
  • We show that carbon nanotube sensors with gold particles on the single-walled carbon nanotube (SWNT) network operate as Schottky barrier transistors, in which transistor action occurs primarily by varying the resistance of Au-SWNT junction rather than the channel conductance modulation. Transistor characteristics are calculated for the statistically simplified geometries, and the sensing mechanisms are analyzed by comparing the simulation results of the MOSFET model and Schottky junction model with the experimental data. We demonstrated that the semiconductor MOSFET effect cannot explain the experimental phenomena such as the very low limit of detection (LOD) and the logarithmic dependence of sensitivity to the DNA concentration. By building an asymmetric concentric-electrode model which consists of serially-connected segments of CNTFETs and Schottky diodes, we found that for a proper explanation of the experimental data, the work function shifts should be ~ 0.1 eV for 100 pM DNA concentration and ~ 0.4 eV for $100{\mu}M$.

Effects of an artificial hole on the crystal growth of large grain REBCO superconductor

  • Lee, Hwi-Joo;Hong, Yi-Seul;Park, Soon-dong;Jun, Byung-Hyuk;Kim, Chan-Joong;Lee, Hee-Gyoun
    • Progress in Superconductivity and Cryogenics
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    • v.20 no.3
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    • pp.5-10
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    • 2018
  • This study presents that various grain boundary junctions are prepared by controlling the seed orientation combined with an artificial hole in a melt process REBCO bulk superconductor. Large grain YBCO superconductors have been fabricated with various grain boundary junctions that the angle between the grain boundary and the <001> axis of Y123 crystal is $0^{\circ}$, $30^{\circ}$ and $45^{\circ}$, respectively. The presence of the artificial hole is beneficial for the formation of clean grain boundary junction and single peak trapped magnetic field profiles have been obtained. Artificial hole makes two growth fronts meet at a point on a periphery of the artificial hole. The presence of artificial hole is not likely to affect on the distribution of Y211 particles. The newly formed <110> facet lines are explained by the formation of new Y123/liquid interface with (010) crystallographic plane.

Close-contact melting of ice in a horizontal cylinder (수평원관내 얼음의 접촉융해과정)

  • ;;Ro, Sung Tack
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.10
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    • pp.2595-2606
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    • 1995
  • Buoyancy-assisted melting of an unconstrained ice in an isothermally heated horizontal enclosure was numerically analyzed in a range of wall temperatures encompassing the density inversion point. The problem as posed here involves two physically distinct domains each of which has its own scales and respective heat transfer mode. These two domains join at the junction where the liquid squeezed out of the film region flushes into the lower melt pool. Both of these domains have been treated separately in the literature by a patching technique which invokes several, otherwise unnecessary, assumptions. The present study eliminates successfully such a superfluous procedure by treating the film and lower melt pool regions as a single domain. As a result of this efficient solution procedure, the interaction of the water stream ejected at the junction and the natural convection in the melt pool could be clarified for different wall temperatures. Though limited by two-dimensionality, the present results conformed indirectly the earlier reported transition of the flow pattern, as the wall temperature was increased over the density inversion point. The transient evolution of the melting surface, the time rate of change in melt volume fraction, the local and temporal variation of the heat transfer coefficients are analyzed and presented.

Electrical characteristics of polycrystalline 3C-SiC thin film diodes (다결정 3C-SiC 박막 다이오드의 전기적 특성)

  • Chung, Gwiy-Sang;Ahn, Jeong-Hak
    • Journal of Sensor Science and Technology
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    • v.16 no.4
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    • pp.259-262
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    • 2007
  • This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

Establishing Best Power Transmission Path using Receiver Based on the Received Signal Strength

  • Eom, Jeongsook;Son, Heedong;Park, Yongwan
    • Journal of Internet Computing and Services
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    • v.18 no.6
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    • pp.15-23
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    • 2017
  • Wireless power transmission (WPT) for wireless charging is currently attracting much attention as a promising approach to miniaturize batteries and increase the maximum total range of an electric vehicle. The main advantage of the laser power beam (LPB) approach is its high power transmission efficiency (PTE) over long distance. In this paper, we present the design of a laser power beam based WPT system, which has a best WPT channel selection technique at the receiver end when multiple power transmitters and single power receiver are operated simultaneously. The transmitters send their transmission channel information via optically modulated laser pulses. The receiver uses the received signal strength indicator and digitized data to choose an optimum power transmission path. We modeled a vertical multi-junction photovoltaic cell array, and conducted an experiment and simulation to test the feasibility of this system. From the experimental result, the standard deviation between the mathematical model and the measured values of normalized energy distribution is 0.0052. The error between the mathematical model and measured values are acceptable, thus the validity of the model is verified.

Properties and Applications of Magnetic Tunnel Junctions

  • Reiss, G.;Bruckl, H.;Thomas, A.;Justus, M.;Meyners, D.;Koop, H.
    • Journal of Magnetics
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    • v.8 no.1
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    • pp.24-31
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    • 2003
  • The discoveries of antiferromagnetic coupling in Fe/Cr multilayers by Grunberg, the Giant Magneto Resistance by Fert and Grunberg and a large tunneling magnetoresistance at room temperature by Moodera have triggered enormous research on magnetic thin films and magnetoelectronic devices. Large opportunities are especially opened by the spin dependent tunneling resistance, where a strong dependence of the tunneling current on an external magnetic field can be found. We will briefly address important basic properties of these junctions like thermal, magnetic and dielectric stability and discuss scaling issues down to junction sizes below 0.01 $\mu\textrm{m}$$^2$with respect to single domain behavior, switching properties and edge coupling effects. The second part will give an overview on applications beyond the use of the tunneling elements as storage cells in MRAMs. This concerns mainly field programmable logic circuits, where we demonstrate the clocked operation of a programmed AND gate. The second 'unconventional' feature is the use as sensing elements in DNA or protein biochips, where molecules marked magnetically with commercial beads can be detected via the dipole stray field in a highly sensitive and relatively simple way.

A Study on the Shallow $p^+-n$ Junction Formation and the Design of Diffusion Simulator for Predicting the Annealing Results ($p^+-n$ 박막접합 형성방법과 열처리 모의 실험을 위한 시뮬레이터 개발에 관한 연구)

  • Kim, Bo-Ra;Lee, Jae-Young;Lee, Jeong-Min;Hong, Shin-Nam
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.115-117
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    • 2005
  • In this paper, we formed the shallow junction by preamorphization and low energy ion implantation. And a simulator is designed for predicting the annealing process results. Especially, if considered the applicable to single step annealing process(RTA, FA) and dual step annealing process(RTA+FA, FA+RTA). In this simulation, the ion implantation model and the boron diffusion model are used. The Monte Carlo model is used for the ion implantation. Boron diffusion model is based on pair diffusion at nonequilibrium condition. And we considered that the BI-pairs lead the diffusion and the boron activation and clustering reaction. Using the boundary condition and initial condition, the diffusion equation is solved successfully. The simulator is made ofC language and reappear the experimental data successfully.

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1-Dimensional efficiency modeling of rear floationg junction solar cell (후면부유접합 태양전지에 있어서의 1차원 효율 모델링)

  • Ebong, A.U.;Kim, D.S.;Lee, S.H.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.1
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    • pp.81-92
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    • 1997
  • Rear floating junction cell (RFJC), using the buried contact technology, is capable of eliminating the efficiency limitations on the single sided cells by providing betterear surface passivation. The implementation of this structure, is simpler and lower in cost and therefore viable for commercial production. However, the contributions, due to damages in the two sets of grooves, to the total dark saturation current density has limited the achievable efficiency of the RFJC to only 21.5 %. This Paper reports on the efficiency estimates of RFJC using PC-1D.

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The Analysis of the Breakdown Voltage according to the Change of JTE Structures and Design Parameters of 4H-SiC Devices (4H-SiC 소자의 JTE 구조 및 설계 조건 변화에 따른 항복전압 분석)

  • Koo, Yoon-Mo;Cho, Doo-Hyung;Kim, Kwang-Soo
    • Journal of IKEEE
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    • v.19 no.4
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    • pp.491-499
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    • 2015
  • Silicon Carbide(SiC) has large advantage in high temperature and high voltage applications because of its high thermal conductivity and large band gap energy. When using SiC to design power semiconductor devices, edge termination techniques have to be adjusted for its maximum breakdown voltage characteristics. Many edge termination techniques have been proposed, and the most appropriate technique for SiC device is Junction Termination Extension(JTE). In this paper, the change of breakdown voltage efficiency ratio according to the change of doping concentration and passivation oxide charge of each JTE techniques is demonstrated. As a result, the maximum breakdown voltage ratio of Single Zone JTE(SZ-JTE), Double Zone JTE(DZ-JTE), Multiple Floating Zone JTE(MFZ-JTE), and Space Modulated JTE(SM-JTE) is 98.24%, 99.02%, 98.98%, 99.22% each. MFZ-JTE has the smallest and SZ-JTE has the largest sensitivity of breakdown voltage ratios according to the change of JTE doping concentration. Additionally the degradation of breakdown voltage due to the passivation oxide charge is analyzed, and the sensitivity is largest in SZ-JTE and smallest in MFZ-JTE, too. In this paper, DZ-JTE and SM-JTE is the best efficiency JTE techniques than MFZ-JTE which needs large doping concentration in short JTE width.