• Title/Summary/Keyword: Silver powder

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Effect of Mechanical Milling Parameters on the Particle Size of Silver Flake (은 플레이크 분말의 입자크기에 미치는 기계적 밀링 공정변수의 영향)

  • Lee, Gil-Geun;Jeong, Hae-Young
    • Journal of Powder Materials
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    • v.21 no.4
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    • pp.307-312
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    • 2014
  • This study is focused on investigating the relation between the particle size of silver flake powder and mechanical milling parameters. Mechanical milling parameters such as ball size, impeller rotation speed and milling time of the attrition ball-mill were controlled to produce silver flake powder. The particle size of the silver flake powder increased with increasing ball size and impeller rotation speed. The change of the particle size of the silver flake powder with mechanical milling parameters was analyzed based on balls motion in the mill container of the attrition ball-mill. The silver flake particles were formed at the elastic deformation area of the ball due to the collision between balls. The change of the particle size of the silver flake powder with mechanical milling parameters well consists with the change of the collision energy of ball with parameters mentioned above.

Fabrication of Silver Flake Powder by the Mechanical Milling Process (기계적 밀링공정에 의한 은 플레이크 분말 제조)

  • Jeong, Hae-Young;Lee, Gil-Geun
    • Journal of Powder Materials
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    • v.23 no.1
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    • pp.54-60
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    • 2016
  • This study focuses on fabricating silver flake powder by a mechanical milling process and investigating the formation of flake-shaped particles during milling. The silver flake powder is fabricated by varying the mechanical milling parameters such as the amount of powder, ball size, impeller rotation speed, and milling time of the attrition ballmill. The particle size of the silver flake powder decreases with increasing amount of powder; however, it increases with increasing impeller rotation speed. The change in the particle size of the silver flake powder is analyzed based on elastic collision between the balls, taking energy loss of the balls due to the powder into consideration. The change in the particle size of the silver flake powder with mechanical milling parameters is consistent with the change in the diameter of the elastic deformation contact area of the ball, due to the collision between the balls, with milling parameters. The flake-shaped silver particles are formed at the elastic deformation contact area of the ball due to the collision.

Non-electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder

  • Lee, Jae-Ho;Change, Gun-Ho
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1225-1226
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    • 2006
  • Particles of high strength material when coated with silver offer a means of obtaining desirable electrical properties and high strength. The coating process employed aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives were also applied. The reduction and subsequent deposition of silver occurred selectively on the surface of the tungsten particles. The morphologies of the coated particles were assessed by SEM imaging. The silver was uniformed coated on tungsten powder and its thickness was estimated to be approximately 100nm on the basis of a mass account.

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The Recovery of Silver from Thiourea Leaching Solution by Cementation Technique (침전법을 이용한 Thiourea 용출용액으로부터 Silver 회수)

  • Kim, Bong-Ju;Cho, Kang-Hee;Choi, Nag-Choul;Park, Cheon-Young
    • Economic and Environmental Geology
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    • v.46 no.1
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    • pp.29-37
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    • 2013
  • In order to apply the silver cementation method using Fe powder from pregnant thiourea leaching solution. Parameters such as the amount of Fe powder addition, agitation speed, and temperature were investigated. The silver cementation rate was increased by the increasing of Fe powder addition, agitation speed, and temperature. The highest silver cementation rate was found when the addition of Fe powder was 50 g/L at the agitation speed of 500 rpm. The silver cementation rate increase with increasing temperature according to the Arrhenius equation and obeys $1^{st}$ order kinetics. The activation energy from the kinetics data was found to be between 13.73 KJ/mol and 17.02 KJ/mol. In the XRD analysis, goethite was detected in the precipitate of the thiourea leach solution. This indicates that an oxidation-reduction reaction had occurred in the thiourea solution due to the addition of the Fe powder.

Reuse of Oyster Shell Waste as Antimicrobial Water Treatment Agent by Silver Ion Exchange

  • Jo, Myung-Chan;Byeong-II Noh;Shin, Choon-Hwan
    • Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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    • v.4 no.3
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    • pp.185-193
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    • 2000
  • A water treatment agent with antimicrobial activity(Ag-Os) was created by exchanging silver ion($Ag^{+}$) on calcined oyster shell powder. The desorption of the exchanged silver ion was negligible, thereby indicating a stable antimicrobial water treatment agent. The sterilization effect of Ag-Os on underwater microorganisms was then investigated. An MIC (Minimum Inhibitory Concentration) test result indicated that Ag-Os had an excellent sterilization effect on G-germs, such as Escherichia coli and Pseudomonas aeruginosa. Most germs were annihilated with an Ag-Os concentration of 200 ppm and contact time of 60 minutes. The sterilization effect was mainly dependent on the contact time. The zeta potential of the Ag-Os powder adsorbed on sand was measured relative to the concentration of exchanged silver ion. As the concentration of the exchanged silver ion increased, the surface charge density of the anions on the surface of the Ag-Os powder adsorbed on sand also increased. Accordingly, this result indicated that a higher silver ion than ion exchange capacity was present on the particle surface due to adsorption. Consequently, this increased concentration of exchanged silver ion would appear to significantly enhance the sterilization power.

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Synthesis of Silver Nano-particles by Homogeneous Precipitation (균일 침전법에 의한 은 나노 입자 합성)

  • Kang, Won-Mo;Kim, Ho-Kun
    • Journal of Powder Materials
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    • v.15 no.5
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    • pp.386-392
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    • 2008
  • Silver particles were synthesized from silver nitrate by homogeneous precipitation and chemical reduction methods involving the intermediate silver cyanate. The obtained silver particles were characterized by XRD, SEM, TEM, and BET. Urea which could prevent the agglomeration of the reduced silver particles was used as a homogeneous precipitator. The spherical silver particles with average particle diameter of 100 nm were obtained under the optimum reaction conditions. The optimum synthetic conditions were found as follows: reaction temperature $100^{\circ}C$, reaction time 60 min, concentration of silver nitrate $1{\times}10^{-2}$ mol, urea $5{\times}10^{-3}$ mol, and sodium citrate $8.5{\times}10^{-4}$ mol. The phase of obtained silver particles was crystalline state and the silver particles were relatively dense, which had the surface area of $0.7571\;m^{2}/g$.

A Study on the Characteristics of Conductive Paste for Roll-to-Roll Printing (Roll to Roll Printing용 전도성 Paste 물성 연구)

  • Cho, Mi-Jeong;Nam, Su-Yong
    • Proceedings of the Korean Printing Society Conference
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    • 2007.11a
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    • pp.59-64
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    • 2007
  • We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

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Investigation on Microstructure and Electrical Properties of Silver Conductive Features Using a Powder Composed of Silver nanoparticles and Nanoplatelets (은 나노입자-나노플레이트 혼합 분말로 형성된 은 전도성 배선의 미세조직 및 전기적 특성 연구)

  • Goo, Yong-Sung;Choa, Yong-Ho;Hwangbo, Young;Lee, Young-In
    • Journal of Powder Materials
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    • v.23 no.5
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    • pp.358-363
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    • 2016
  • Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at $200^{\circ}C$ shows a highly dense and well-sintered microstructure and has a resistivity of $7.60{\mu}{\Omega}{\cdot}cm$. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.

Filling and Wiping Properties of Silver Nano Paste in Trench Layer of Metal Mesh Type Transparent Conducting Electrode Films for Touch Screen Panel Application (실버 나노분말을 이용한 메탈메쉬용 페이스트의 충전 및 와이핑 특성)

  • Kim, Gi-Dong;Nam, Hyun-Min;Yang, Sangsun;Park, Lee-Soon;Nam, Su-Yong
    • Journal of Powder Materials
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    • v.24 no.6
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    • pp.464-471
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    • 2017
  • A metal mesh TCE film is fabricated using a series of processes such as UV imprinting of a transparent trench pattern (with a width of $2-5{\mu}m$) onto a PET film, filling it with silver paste, wiping of the surface, and heat-curing the silver paste. In this work nanosized (40-50 nm) silver particles are synthesized and mixed with submicron (250-300 nm)-sized silver particles to prepare silver paste for the fabrication of metal mesh-type TCE films. The filling of these silver pastes into the patterned trench layer is examined using a specially designed filling machine and the rheological testing of the silver pastes. The wiping of the trench layer surface to remove any residual silver paste or particles is tested with various mixture solvents, and ethyl cellosolve acetate (ECA):DI water = 90:10 wt% is found to give the best result. The silver paste with 40-50 nm Ag:250-300 nm Ag in a 10:90 wt% mixture gives the highest electrical conductance. The metal mesh TCE film obtained with this silver paste in an optimized process exhibits a light transmittance of 90.4% and haze at 1.2%, which is suitable for TSP application.

A Study on Powder Electroluminescencent Device using ZnS:Cu (ZnS:CU를 이용한 후막 전계 발광소자에 관한 연구)

  • 이종찬;박대희;박용규
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.121-124
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    • 1998
  • Generally the structure of powder electroluminescent devices (PELDs) on ITO-film was makeup of the ZnS:Cu phosphor layer and BaTiO$_3$ insulating layer. The active layer, which consists of a suitably doped ZnS powder mixed in a dielectric, is sandwiched between two electrodes; one of which are ITO film and the other is aluminum. In this paper, three kinds of powder eleotroluminescent devices (PELDs) : WK-A(ITO/BaTiO$_3$/ZnS:Cu/Silver paste). WK-B(ITO/BaTiO$_3$+ZnS:Cu/Silver paste) and WK-C(ITO/BaTiO$_3$/ZnS:Cu/BaTiO$_3$/Silver paste), fabricated by spin coating method, were investigated. To evaluate the luminescence properties of three kinds of PELDs, EL emission spectroscopy, transferred charge density and time response of EL emission intensity under square wave voltage driving were measured.

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