1 |
H. Hashimoto, T. Shinozaki and S. Yashima: J. Chem. Eng. Jpn., 20 (1987) 380.
DOI
|
2 |
R. A. Serway and J. W. Jewett: Physics for Scientists and Engineers with Modern Physics, 6th Ed., Cengage Learning Korea Ltd., Seoul (2005) 292.
|
3 |
S. P. Timoshenko and J. N. Goodier: Theory of Elasticity, 3rd Ed., McGraw-Hill, NewYork (1970) 420.
|
4 |
K. S. Venkataraman and K. S. Narayanan: Powd. Tech., 96 (1998) 190.
DOI
ScienceOn
|
5 |
S. M. Towlson: USA, US 5,653,918 (1996).
|
6 |
J. Oprosky and D. Stotka: USA, US 5,346,651 (1993).
|
7 |
R. G. Reed: USA, US 4,964,948 (1989).
|
8 |
N. I. Liu and R. Meer: USA, US 4,566,990 (1983).
|
9 |
V. Paneccasio and M. P. Chasse.: USA, US 6,013,203 (1998).
|
10 |
H. W. Cui, D. S. Li, Q. Fan and H. X. Lai: Int. J. Adhes. Adhes., 44 (2013) 232.
DOI
ScienceOn
|
11 |
H. H. Lee, K. S. Chou and Z. W. Shih: Int. J. Adhes. Adhes., 25 (2005) 437.
DOI
ScienceOn
|
12 |
D. Lu and C. P. Wong: Int. Sym. Adv. Packag. Mater., 10 (1998) 48.
|
13 |
D. L. Markley, Q. K. Tong, D. J. Magliocca and T. D. Hahn: Int. Sym. Adv. Packag. Mater., 12 (1999) 16.
|
14 |
W. Songping: J. Mater. Sci. Mater. Electr., 18 (2007) 447.
|
15 |
C. Suyanarayana: Prog. Mater. Sci., 46 (2001) 1.
DOI
ScienceOn
|
16 |
ASM International Handbook Committee: ASM Handbook Vol 7 Powder Metal Technologies and Application, ASM International, Ohio (1998) 134.
|
17 |
J. Kano and F. Saito: Powd. Tech., 98 (1998) 166.
DOI
ScienceOn
|
18 |
A. Theodore, K. J. Jeon and C. Y. Wu: Kona, 24 (2006) 83.
DOI
|
19 |
P. R. Santhanam and E. L. Dreizin: Powd. Tech., 221 (2012) 403.
DOI
ScienceOn
|
20 |
R. Watananbe, H. Hashimoto and G. G. Lee: Mater. Trans. JIM, 36 (1995) 102.
DOI
|
21 |
G. G. Lee, D. W. Lee, G. H. Ha and B. K. Kim: J. Jpn. Soc. Powd. Met., 43 (1996) 1253.
DOI
|
22 |
D. W. Lee, B. K. Kim, G. G. Lee and G. H. Ha: J. Kor. Powd. Met. Inst., 3 (1996) 159.
|
23 |
S. H. Hong and B. K. Kim: Mater. Lett., 51 (2001) 139.
DOI
ScienceOn
|
24 |
H. W. Cui, A. Kowalczyk, D. S. Li and Q. Fan: Int. J. Adhes. Adhes., 44 (2013) 220.
DOI
ScienceOn
|
25 |
H. W. Cui, Q. Fan and D. S. Li: Int. J. Adhes. Adhes., 48 (2014) 177.
DOI
ScienceOn
|